1. Field of the Invention
The invention relates generally to an apparatus for treating surfaces of wafer-shaped articles, such as semiconductor wafers, wherein one or more treatment fluids may be recovered from within a closed process chamber.
2. Description of Related Art
Semiconductor wafers are subjected to various surface treatment processes such as etching, cleaning, polishing and material deposition. To accommodate such processes, a single wafer may be supported in relation to one or more treatment fluid nozzles by a chuck associated with a rotatable carrier, as is described for example in U.S. Pat. Nos. 4,903,717 and 5,513,668.
Alternatively, a chuck in the form of a ring rotor adapted to support a wafer may be located within a closed process chamber and driven without physical contact through an active magnetic bearing, as is described for example in International Publication No. WO 2007/101764 and U.S. Pat. No. 6,485,531. Treatment fluids which are driven outwardly from the edge of a rotating wafer due to centrifugal action are delivered to a common drain for disposal.
Although conventional closed process chambers adequately contain the hazardous substances used for wafer processing while the chamber is closed, they must be opened for loading and unloading of wafers. This causes a significant risk that process gas, chemical fumes, hot vapor such as vaporized isopropyl alcohol, ozone and the like could be released to the tool environment, which could result in significant safety risks and damage to surrounding components and tools.
The present inventors have developed an improved closed process chamber for treating wafer-shaped articles, in which an inner chamber is provided within an outer chamber, with each of the inner and outer chambers being configured to provide a gas-tight enclosure.
Thus, the invention in one aspect relates to a device for processing wafer-shaped articles, comprising a closed process chamber. The closed process chamber comprises a housing providing a gas-tight enclosure, a rotary chuck located within the closed process chamber and adapted to hold a wafer shaped article thereon, and an interior cover disposed within said closed process chamber. The interior cover is movable between a first position in which the rotary chuck communicates with an outer wall of the closed process chamber, and a second position in which the interior cover seals against an inner surface of the closed process chamber adjacent the rotary chuck to define a gas-tight inner process chamber. Preferably said movement between the first position and the second position is an axial movement along the rotational axis of rotary chuck.
In preferred embodiments of the device according to the present invention, the interior cover forms a lower portion of the inner process chamber when in the second position.
In preferred embodiments of the device according to the present invention, the interior cover comprises a base and at least one upstanding wall, the base being connected to a shaft that penetrates the closed process chamber via a seal that permits relative movement between the shaft and the closed process chamber while maintaining gas tightness of the outer process chamber. Preferably said relative movement is an axial movement along the rotational axis of rotary chuck.
In preferred embodiments of the device according to the present invention, at least one process fluid collector is formed in a lower portion of the interior cover, the process fluid collector communicating with a discharge pipe depending from the interior cover that penetrates the closed process chamber via a seal that permits relative movement between the discharge pipe and the closed process chamber while maintaining gas tightness of the outer process chamber.
In preferred embodiments of the device according to the present invention, the closed process chamber comprises independently controlled exhaust ports, a first exhaust port opening into the closed process chamber in a region inside the inner chamber when the interior cover is in the second position, and a second exhaust port opening into the closed process chamber in a region outside the inner chamber when the interior cover is in the second position.
In preferred embodiments of the device according to the present invention, the interior cover comprises a plurality of splash guards that are independently axially displaceable relative to the interior cover, the splash guards and the interior cover being adapted to define a plurality of distinct processing regions within the inner chamber when the interior cover is in the second position.
In preferred embodiments of the device according to the present invention, each of the distinct processing regions comprises a respective liquid discharge pipe in fluid communication therewith.
In preferred embodiments of the device according to the present invention, each axially displaceable splash guard is selectively driven from outside the closed process chamber to a predefined vertical position.
In preferred embodiments of the device according to the present invention, each axially displaceable splash guard is selectively positionable so as to capture a preselected process fluid emanating from a spinning wafer carried by the rotary chuck.
In preferred embodiments of the device according to the present invention, the rotary chuck is adapted to be driven without physical contact through a magnetic bearing, and the rotary chuck and the interior cover are vertically movable relative to each other.
In preferred embodiments of the device according to the present invention, the magnetic bearing comprises a stator located outside the closed process chamber.
In preferred embodiments of the device according to the present invention, the magnetic bearing is selectively positionable such that a preselected process fluid emanating from a spinning wafer carried by the rotary chuck is directed to a preselected fluid collector.
In preferred embodiments of the device according to the present invention, the magnetic bearing is an active magnetic bearing.
In preferred embodiments of the device according to the present invention, the closed process chamber is a module in a station for single wafer wet processing of semiconductor wafers.
In preferred embodiments of the device according to the present invention, the closed process chamber is made of aluminum coated with perfluoroalkoxy resin.
Other objects, features and advantages of the invention will become more apparent after reading the following detailed description of preferred embodiments of the invention, given with reference to the accompanying drawings, in which:
Referring now to
A rotary chuck 30 is disposed in the upper part of chamber 1, and surrounded by the cylindrical wall 34. Rotary chuck 30 rotatably supports a wafer W during used of the apparatus. The rotary chuck 30 incorporates a rotary drive comprising ring gear 38, which engages and drives a plurality of eccentrically movable gripping members for selectively contacting and releasing the peripheral edge of a wafer W.
In this embodiment, the rotary chuck 30 is a ring rotor provided adjacent to the interior surface of the cylindrical wall 34. A stator 32 is provided opposite the ring rotor adjacent the outer surface of the cylindrical wall 34. The rotor 30 and stator 34 serve as a motor by which the ring rotor 30 (and thereby a supported wafer W) may be rotated through an active magnetic bearing. For example, the stator 34 can comprise a plurality of electromagnetic coils or windings that may be actively controlled to rotatably drive the rotary chuck 30 through corresponding permanent magnets provided on the rotor. Axial and radial bearing of the rotary chuck 30 may be accomplished also by active control of the stator or by permanent magnets. Thus, the rotary chuck 30 may be levitated and rotatably driven free from mechanical contact. Alternatively, the rotor may be held by a passive bearing where the magnets of the rotor are held by corresponding high-temperature-superconducting magnets (HTS-magnets) that are circumferentially arranged on an outer rotor outside the chamber. With this alternative embodiment each magnet of the ring rotor is pinned to its corresponding HTS-magnet of the outer rotor. Therefore the inner rotor makes the same movement as the outer rotor without being physically connected.
The lid 36 has a manifold 42 mounted on its exterior, which supplies a medium inlet 44 that traverses the lid 36 and opens into the chamber above the wafer W. It will be noted that the wafer W in this embodiment hangs downwardly from the rotary chuck 30, supported by the gripping members 40, such that fluids supplied through inlet 44 would impinge upon the upwardly facing surface of the wafer W.
In case wafer 30 is a semiconductor wafer, for example of 300 mm or 450 mm diameter, the upwardly facing side of wafer W could be either the device side or the obverse side of the wafer W, which is determined by how the wafer is positioned on the rotary chuck 30, which in turn is dictated by the particular process being performed within the chamber 1.
The apparatus of
Hollow shaft 22 is surrounded by a boss 12 formed in the main chamber 1, and these elements are connected via a dynamic seal that permits the hollow shaft 22 to be displaced relative to the boss 12 while maintaining a gas-tight seal with the chamber 1.
At the top of cylindrical wall 21 there is attached an annular deflector member 24, which carries on its upwardly-facing surface a gasket 26. Cover 2 preferably comprises a fluid medium inlet 28 traversing the base 20, so that process fluids and rinsing liquid may be introduced into the chamber onto the downwardly facing surface of wafer W.
Cover 2 furthermore includes a process liquid discharge opening 23, which opens into a discharge pipe 25. Whereas pipe 25 is rigidly mounted to base 20 of cover 2, it traverses the bottom wall 14 of chamber 1 via a dynamic seal 17 so that the pipe may slide axially relative to the bottom wall 14 while maintaining a gas-tight seal.
An exhaust opening 16 traverses the wall 10 of chamber 1, whereas a separate exhaust opening 46 traverses the lid 36 near the inner surface of rotary chuck 30. Each exhaust opening is connected to suitable exhaust conduits (not shown), which are preferably independently controlled via respective valves and venting devices.
The position depicted in
In
When the interior cover 2 reaches its second position as depicted in
During processing of a wafer, processing fluids may be directed through medium inlets 44 and/or 28 to a rotating wafer W in order to perform various processes, such as etching, cleaning, rinsing, and any other desired surface treatment of the wafer undergoing processing.
Provision of the inner chamber 48 within the overall process chamber 1 thus enhances the safety of environmentally closed chambers by permitting the gases and liquids used for wafer processing to be better isolated from the exterior environment of the process chamber, and reduces the risk of process gas, chemical fumes, hot vapor such as vaporized isopropyl alcohol, ozone and the like being released to the tool environment.
The outer splash guard 37 is positioned concentrically about the inner splash guard 39. Thus, the inner splash guard 39 defines an inner process fluid collector within its interior. A middle process fluid collector is defined by an annular region formed between the outer surface of the inner splash guard 39 and the inner surface of the outer splash guard 37. An outer process fluid collector is defined by an annular region formed between the outer surface of the outer splash guard 37 and the inner surface of the cylindrical wall 21.
Associated with each such fluid collector a drain is provided for delivering collected process media from the respective fluid collector to outside the closed process chamber. As shown in
Deflector 27 in this embodiment is somewhat elongated to accommodate the upper portions of splash guards 37 and 39, but is otherwise as described above in connection with the first embodiment.
Splash guards 37 and 39 are moved up and down relative to interior cover 2 by suitable actuators such as pneumatic cylinders, combinations of pneumatic and hydraulic cylinders, linear motors, Bowden wires or the like. Although not shown in the accompanying drawings, the actuators for splash guards 37 and 39 are similarly mounted traversing bottom wall 14 via a dynamic seal.
Each splash guard is independently movable in the vertical direction. Accordingly, each splash guard can selectively be raised and/or lowered relative to the rotary chuck 30, relative to any other splash guard, and relative to the interior cover 2, such that excess process fluid emanating from the trailing edge of the rotary chuck 30 is directed toward a selected fluid collector.
In
In
In
In particular, wafer W is loaded onto spin chuck 50 when interior cover 2 is in the loading/unloading position depicted in
In this embodiment, it will be seen that spin chuck 50 is also vertically moveable relative to the interior cover 2, so that it can be raised to an optimum processing position within the chamber 48. Spin chuck 50 is then rotated by a motor (not shown) acting upon shaft 55.
Thus, wafer W is loaded onto spin chuck 50 with interior cover 2 is in the loading/unloading position depicted in
As the spin chuck 50 of this embodiment is not vertically moveable relative to the interior cover 2, the movement of the interior cover 2 serves simultaneously to position wafer W at its final processing position within the chamber 48. Spin chuck 50 is then rotated by a motor (not shown) acting upon shaft 55.
Number | Name | Date | Kind |
---|---|---|---|
4903717 | Sumnitsch | Feb 1990 | A |
5472502 | Batchelder | Dec 1995 | A |
5513668 | Sumnitsch | May 1996 | A |
5762708 | Motoda | Jun 1998 | A |
5772770 | Suda et al. | Jun 1998 | A |
6100618 | Schoeb et al. | Aug 2000 | A |
6221781 | Siefering et al. | Apr 2001 | B1 |
6485531 | Schob | Nov 2002 | B1 |
6680253 | Wirth et al. | Jan 2004 | B2 |
6810888 | Tsuchiya et al. | Nov 2004 | B2 |
6874516 | Matsuno et al. | Apr 2005 | B2 |
7585686 | Verhaverbeke et al. | Sep 2009 | B2 |
8485204 | Obweger et al. | Jul 2013 | B2 |
20020096196 | Toshima | Jul 2002 | A1 |
20020157960 | Dordi et al. | Oct 2002 | A1 |
20030005948 | Matsuno et al. | Jan 2003 | A1 |
20030010671 | Orii et al. | Jan 2003 | A1 |
20040182316 | Watanabe | Sep 2004 | A1 |
20050260345 | Lubomirsky et al. | Nov 2005 | A1 |
20060269686 | Lin et al. | Nov 2006 | A1 |
20070000527 | Aegerter et al. | Jan 2007 | A1 |
20070022948 | Rose et al. | Feb 2007 | A1 |
20080057219 | Kim et al. | Mar 2008 | A1 |
20080142051 | Hashizume | Jun 2008 | A1 |
20080271763 | Collins et al. | Nov 2008 | A1 |
20090079122 | Obweger | Mar 2009 | A1 |
20100101424 | Hohenwarter | Apr 2010 | A1 |
20110008740 | Sorabji et al. | Jan 2011 | A1 |
20110240220 | Schoeb | Oct 2011 | A1 |
20110250044 | Obweger et al. | Oct 2011 | A1 |
20110290283 | Obweger et al. | Dec 2011 | A1 |
20130101372 | Tschinderle et al. | Apr 2013 | A1 |
20130125379 | Plazonic et al. | May 2013 | A1 |
20130134128 | Tschinderle et al. | May 2013 | A1 |
20130160260 | Frank et al. | Jun 2013 | A1 |
Number | Date | Country |
---|---|---|
0986162 | Mar 2000 | EP |
WO 9631934 | Oct 1996 | WO |
2007101764 | Sep 2007 | WO |
WO 2010070562 | Jun 2010 | WO |
Entry |
---|
International Search Report, dated Feb. 1, 2013, from corresponding PCT application. |
Number | Date | Country | |
---|---|---|---|
20130062839 A1 | Mar 2013 | US |