Claims
- 1. A tape automated bonding method for a thin film structure, having a substrate, a contact region in a surface of said substrate, and at least one passivation layer superposing said surface, comprising:
- forming a via in said passivation layer to an area of said contact region;
- superposing a conductive tape beam across said via in said passivation layer, said conductive tape beam including a conductive layer and a support layer, said support layer having a support layer via corresponding in position to said via in said passivation layer;
- applying first force to said beam to deform said beam into said via and into contact with said contact region; and,
- maintaining said first force to hold said beam in contact with said contact region while applying a second force to said beam to bond said beam to said contact region.
- 2. The method as set forth in claim 1 wherein said step of applying a first force comprises:
- applying approximately 100 to 140 grams linearly for 30 to 80 milliseconds.
- 3. The method as set forth in claim 2 wherein said step of applying a second force comprises:
- applying 100 to 150 microinches of 60 kHz ultrasonic scrub.
- 4. The method as set forth in claim 3 wherein said tape is formed of copper having a thickness of approximately 0.0014 inch, hardness in the range of approximately 60 to 100 Knoop, and plating with 99.99% gold to a thickness of approximately 30 micro-inches.
- 5. The method as set forth in claim 4, Wherein said tape chemically milled to a predetermined pattern, such that each beam has a width in the range of approximately 0.0025 to 0.0030 inch.
Parent Case Info
This is a division of application Ser. No. 052,666, filed May 20, 1987, now abandoned.
US Referenced Citations (2)
Non-Patent Literature Citations (1)
Entry |
IBM Technical Disclosure Bulletin, vol. 25, No. 4, Sep. 1982; See Edwards, pp. 1948-1949. |
Divisions (1)
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Number |
Date |
Country |
Parent |
52666 |
May 1987 |
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