1. Field of the Invention
The present invention relates to a technique for extracting a piece of a sample including a desired area from a semiconductor wafer, a semiconductor device, or the like using ion beams.
2. Background Art
Manufacture of semiconductor devices such as a semiconductor memory and a microprocessor and electronic components such as a magnetic head requires characteristic inspection for product quality control. The characteristic inspection includes measurement of manufacturing dimension, inspection of a circuit pattern for a defect, and analysis of foreign bodies. Various means are prepared to perform these inspections. If an abnormality is found inside a product, a micromachining and observation apparatus using a focused ion beam (FIB) is used. This apparatus includes a function of cutting out a minute area of the order of microns including an observation part and producing a minute sample for facilitating observation inside and outside the apparatus (hereinafter, a minute sample will be referred to as a micro-sample, and a step of producing a micro-sample as micro-sampling). As a method for realizing the function, there has been devised and used a method for separating a micro-sample from an original sample by connecting the micro-sample to a needle-shaped probe and moving the position of the probe (JP Patent Publication (Kokai) No. 5-52721 A (1993)).
Positioning by probe drive control is important to separate a micro-sample from an original sample in micro-sampling. As a preliminary step for micro-sampling, a micro-sample needs to be brought to within an observation area by controlling to drive a stage. The position of a probe to be brought into contact with the micro-sample is determined by controlling to drive the probe. If an error occurs in both of the stage drive control and the probe drive control, it is necessary to manually adjust the position of the probe to that of the micro-sample while viewing an observation image.
A process of bringing a probe into contact with a micro-sample requires precise control of movement of the probe to a probe adhesion position of a small piece of several micrometers. This is because the process aims at connecting a micro-sample to the tip of a probe and separating the micro-sample from an original sample. Although movement of a sample stage by precise drive control is also important, it is not easy to always control to move the sample stage to a desired position, even allowing for the tolerance of a connection position of a micro-sample. Even if coordinate positioning by precise probe drive control is possible, coordinates for control of a probe drive control mechanism do not directly indicate the position of the tip of a probe. This is because a probe itself may be deformed or shortened in micro-sampling.
Conventional micro-sampling is work in a minute space, and the operability of a probe significantly affects operating precision and efficiency. Additionally, a heavy burden is placed on an operator due to the importance of a sample, the durability of a probe itself, and the like. For this reason, micro-sampling requires operational skill.
The present invention has as its object to improve contact precision and probe operability.
The present invention controls sample stage movement and probe movement on an observation image using a single coordinate system, thereby allowing positioning using a sample stage stop error as a probe control movement amount. Also, the present invention figures out a position of a tip of a probe using the observation image and stores coordinates of the probe at a reference position on the image.
Preferably, positional information of the tip of the probe is acquired while observing the tip of the probe, and a coordinate system recognized by a probe drive control section is associated with the positional information.
Preferably, control of a position of the tip of the probe using a same coordinate system as a coordinate system of coordinates of a stage is allowed by associating the coordinates of the stage, on which a sample is mounted, with coordinates recognized by the probe drive control section.
Preferably, an operation of designating a direction and a magnitude on the observation image is performed using a pointing device, a position of the probe is changed by a same magnitude and in a same direction as the operation on the image, and the position of the probe is moved to a desired position while observing the tip of the probe on the image.
Preferably, a positional relationship between the position of the tip of the probe and the observation image is maintained, and measurement of a displacement and feedback of the displacement for coordinates of the probe are performed even if a shape of the tip of the probe changes due to factors including probe replacement, probe break, and probe deformation.
Preferably, a shape of the tip of the probe which has been deformed is shaped by precisely arranging the tip of the probe within an observation area and applying a charged particle beam to an area of a regular shape.
Preferably, recognition of the tip of the probe and association of the control section for stage driving with the coordinates recognized by the probe drive control section are automatically performed, and the association is held and used for probe control.
Preferably, a search area is limited based on the recognition of the tip of the probe and storage of the coordinates of the probe in tip recognition at another time.
Preferably, shift amounts in X and Y directions on the observation image are measured in advance at at least two heights, the degree of shift when controlling the probe to a target height is derived, and the probe is controlled to be driven to a target position based on the degree of shift.
Preferably, the probe is brought into contact with a surface of a minute sample, the tip of the probe is caused by deposition to adhere to the minute sample, a connection between the minute sample and a sample is cut, and the minute sample is picked up by controlling to drive the probe.
The present invention facilitates precise probe contact operation to a sample position of the order of microns.
The foregoing and other novel features and advantages of the present invention will be described below with reference to the drawings. Note that the drawings are illustrative only and not intended to restrict the scope of right.
The apparatus includes a charged particle beam generating section, a charged particle beam irradiating optical system section, a stage on which a sample is mounted and which can move below a charged particle beam, a control section which drives the stage, an electron detecting section which detects a particle emitted from the sample, a control section which acquires an observation image by synchronizing a detection signal from the electron detecting section and charged particle beam scanning, a probe for cutting out a minute sample from a sample, and a drive control section which controls driving of the probe.
More specifically, reference numeral 101 denotes a focused ion beam for processing and observation. The processing and observation are performed by applying the focused ion beam 101 to a sample 105 while changing conditions for the beam 101. Since the deflectable range of the focused ion beam 101 is narrower than that of a sample stage 102, the sample stage 102 is moved through a stage controlling device in order to display a desired processing and observation position on the sample 105. The sample stage 102 has movable axes for horizontal directions X and Y and a movable axis which enables the sample stage 102 to form an angle allowing cutting of a bottom portion of a micro-sample with the focused ion beam 101. In some cases, a mechanism movable in the vertical direction of the beam or in the direction of rotation of the beam may be provided. The sample 105 is irradiated with the focused ion beam 101, and a secondary electron generated from the sample 105 is captured by a detector 103 and is displayed on an image display device 108 of a control computer through an image processing device. In the apparatus, a probe 104 necessary for micro-sampling and a deposition nozzle 106 which discharges gas necessary for deposition are respectively connected to the control computer through a probe controlling device and a deposition controlling device. An operator controls the probe 104 and deposition nozzle 106 using an input device 107 while referring to an image on the image display device 108.
The probe replacement work (301) in this algorithm means not only probe replacement. The work is performed as needed if shortening of a probe caused by a break, deformation in adhesion deposition, or the like occurs in the micro-sampling process.
The above-described series of processes is performed by an operator who is actually observing an image. However, if a probe tip position can be recognized on the field 201 of view without manual intervention, position adjustment can be automatically performed. In other words, the process 303 can be automated in the algorithm in
If the work of moving the sample stage and bringing a desired position to the center of the field of view is performed, the desired position may not fall at the center of field of view due to a stage stop error. Fine drive control for a probe is superior in precision to that for the sample stage, and it is better to control a probe for compensation for a shift from the center. A coordinate system of the stage drive control mechanism and one of the probe drive control mechanism do not always coincide with each other. Accordingly, a function of treating a shift of the sample stage from a target position as a drive control amount for a probe (referred to as probe alignment) is provided. An algorithm in
The probe alignment is alignment of the probe with a displayed image. If the relationship between the displayed image and the sample stage is such that the tilt of the sample stage is negligible, the size of the image after conversion using the scaling factor and the amount of movement of the field of view caused by stage movement are almost equal, and the image and a sample stage drive axis are nearly orthogonal to each other, the result of the probe alignment can be directly used for alignment in the stage coordinate system. If a coordinate system for the displayed image and one for the sample stage cannot be considered to be the same, the stage alignment can be performed by processing similar to the probe alignment for the stage. The relationship between the probe and the stage can be easily derived from the relationship between the probe and the displayed image and that between the displayed image and the stage.
Consider a function of making corrections in the X and Y directions, for control of a probe in a direction of height. The function is designed with a case in mind where the position of a probe in the Z-axis direction which is to move vertically is shifted in the X and Y directions on an observation image at the time of probe contact from a height Z to a target position and intended to compensate for such a shift.
To directly move a probe from a height to a target position in one stroke, the height of the target position is subtracted from the height, and the remainder is multiplied by the amount of tilt, thereby calculating a displacement. The probe is shifted by the displacement in the opposite direction and is moved downward. With this operation, the probe arrives at the target position. When the probe is to be manually and gradually moved downward, the probe is moved downward in a stepwise manner while performing X shift driving and Y shift driving per unit Z distance. To move the probe downward while manually checking the probe, X and Y shift amounts per unit Z distance are supplied to the probe drive control mechanism without change as the ratio between a Z lowering speed and an X movement speed and that between the Z lowering speed and a Y movement speed, and X shift driving and Y shift driving corresponding to a probe lowering speed are simultaneously performed.
To eliminate a positional shift of a probe within an observation image in drive control of the probe in the direction of height, shift amounts in the X and Y directions on an observation image are measured at each of two or more heights in advance, the degree of shift when controlling the probe to a target height is derived, and the degree of shift is added in a direction which compensates for a shift. This makes it possible to control to drive the probe to the target position.
A mechanism for automating a series of processes from probe contact to lifting of a micro-sample will be described.
After completion of positioning of a micro-sample, a series of processes is performed by pressing an Auto Pickup button 1001. More specifically, a probe is called, the probe is brought into contact with a micro-sample at a defined position, deposition is performed under defined conditions to cause the probe to adhere to the micro-sample, a connection between a sample and the micro-sample is cut by processing, and the probe is lifted. In the operation screen, the progress of the series of processes is represented by conceptual diagrams (1002 to 1006), and one of the processes in progress is visually enhanced.
This embodiment achieves advantages such as an increase in the success rate of sampling, a reduction in mental burden, an increase in the lifetime of a probe, and elimination of personality. A series of operations from contact of a probe with a micro-sample to separation of the micro-sample from a sample can be automatically performed. It is further possible to easily shape a deformed probe.
Number | Date | Country | Kind |
---|---|---|---|
2007-048377 | Feb 2007 | JP | national |