Claims
- 1. A substrate having a top surface for mounting multiple integrated circuit (IC) chips comprising:a most performance-demanding IC chip encapsulated under an encapsulation mounted on said substrate; and a set of chip-size-package(CSP)/flip-chip contact footprints disposed next to and interconnected via a plurality of connecting traces to said most performance demanding IC chip for carrying out a burn-in test for said substrate mounted with said most performance-demanding IC chip with said connecting traces connected to said CSP/flip-chip contact footprints.
- 2. The substrate of claim 1 wherein:said set of CSP/flip-chip contact footprints further comprising a plurality of solder balls ready for mounting a CSP or a flip-chip thereon.
- 3. The substrate of claim 1 further comprising:a known-good peripheral IC chip clamped on to said set of CSP/flip-chip contact footprints for carrying on full-functional multiple-chip test.
- 4. The substrate of claim 1 wherein:said most performance-demanding IC chip is wire-bonded onto said substrate.
- 5. The substrate of claim 1 wherein:said most performance-demanding IC chip is a chip-on-board (COB) chip by wire bonding said most performance-demanding IC chip directly onto said substrate.
- 6. The substrate of claim 1 wherein:said set of CSP/flip-chip contact footprints further comprising a plurality of solder balls ready for mounting a CSP chip thereon to conduct a functional MCM test for said substrate mounted with said most performance-demanding IC chip and said CSP chip.
- 7. The substrate of claim 1 wherein:said set of CSP/flip-chip contact footprints further comprising a plurality of solder balls ready for mounting a flip-chip thereon to conduct a functional MCM test for said substrate mounted with said most performance-demanding IC chip and said flip-chip.
- 8. The substrate of claim 3 further comprising:at least a set of signal generator electrical contacts for temporarily mounting at least a signal generator to conduct a functional MCM test for said substrate mounted with said most performance-demanding IC chip and said known-good CSP or flip-chip.
- 9. The substrate of claim 1 wherein:said most performance-demanding IC chip is packaged as a chip-size package (CSP) mounted onto said substrate.
- 10. The substrate of claim 1 wherein:said most performance-demanding IC chip is a flip-chip mounted directly onto said substrate.
Parent Case Info
This Application is a Continuation-in-part Application and claims a priority date of Jan. 13, 1998 of a Provisional Patent Application No. 60/071,177 that was filed as a Formal application Ser. No. 09/229,139 on Jan. 12, 1999.
US Referenced Citations (6)
Provisional Applications (1)
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Number |
Date |
Country |
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60/071177 |
Jan 1998 |
US |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
09/229139 |
Jan 1999 |
US |
Child |
09/727913 |
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US |