Claims
- 1. A method for use with a primary semiconductor die and a secondary support structure, comprising:
- mounting the primary die to a lead frame so that a first lead finger of the frame is located a first distance from a first bond pad of the primary die and a second lead finger of the frame is located a second distance from a second bond pad of the primary die, the first distance being substantially different than the second distance;
- using the secondary support structure to establish a first impedance between the first lead finger and the first bond pad that is substantially the same as a second impedance between the second lead finger and the second bond pad.
- 2. The method of claim 1, wherein the using comprises:
- forming a first network on the secondary support structure to form the first impedance; and
- forming a second network on the secondary support structure to form the second impedance.
- 3. The method of claim 1, further comprising:
- mounting the primary semiconductor die on the secondary support structure.
- 4. The method of claim 1, further comprising:
- mounting the primary semiconductor die on the leadframe beside of the secondary support structure.
- 5. The method of claim 1, wherein the secondary support structure comprises a semiconductor die.
- 6. The method of claim 1, wherein the secondary support structure comprises a printed circuit board.
- 7. A method for use with a secondary support structure and a primary semiconductor die capable of having different sizes, comprising:
- using a first bond pad of the secondary support structure to mount to a bond pad of the primary semiconductor die when the primary die is a first size; and
- using a second bond pad of the secondary support structure to mount to the bond pad of the primary semiconductor die when the primary die is a second size.
- 8. The method of claim 7, further comprising:
- mounting the primary semiconductor die to the secondary support structure.
- 9. The method of claim 7, wherein the secondary support structure comprises a semiconductor die.
- 10. The method of claim 7, wherein the secondary support structure comprises a printed circuit board.
- 11. A method for use with a primary semiconductor die and a secondary support structure, comprising:
- forming a first impedance network on the secondary support structure to establish a first impedance between the primary die and a lead;
- forming a second impedance network on the secondary support structure to establish a second impedance between the primary die and a lead; and
- using a bond option to select either the first or second impedance network.
- 12. The method of claim 11, further comprising:
- mounting the primary semiconductor die to the secondary support structure.
- 13. The method of claim 11, wherein the secondary support structure is mounted beside the primary die on a leadframe.
- 14. The method of claim 11, wherein the secondary support structure comprises a semiconductor die.
- 15. The method of claim 11, wherein the secondary support structure comprises a printed circuit board.
Parent Case Info
This is a divisional of prior application Ser. No. 08/987,000 filed Dec. 8, 1997.
US Referenced Citations (3)
Divisions (1)
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Number |
Date |
Country |
Parent |
987000 |
Dec 1997 |
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