Patent Application
20140326016
The present invention relates to a cooling device which cools a heat generating member in electronic equipment and an electronic equipment using the same, and, more particularly, to a cooling device which cools a heat generating member using phase changes of a refrigerant in electronic equipment of a low height such as a 1U server and an electronic equipment using the same.
In recent years, along with improvement in performance, functions and the like of a semiconductor device and electronic equipment, their heat generation amounts have been also increasing. For example, also in a small electronic device such as a personal computer and a 1U server, a heat generation amount from a semiconductor element such as a CPU is being increased along with increase in an amount of information and a processing speed. There are arranged a plurality of cooling fans or a large cooling fan in a personal computer and a 1U server because the semiconductor element may be damaged by heat radiated from the semiconductor element itself. The 1U server is a server housed in a rack of 1U (1.75 inches) which is the minimum unit of a rack height set by Electronic Industries Alliance.
In a small electronic device such as a personal computer and a 1U server, miniaturization of a cooling device, especially keeping a height low, is required because a mounting space cannot be secured sufficiently. Accordingly, instead of arranging a plurality of cooling fans or a large cooling fan, arranging a cooling device of a refrigerant circulation type has been proposed.
In patent literature 1, there is disclosed electronic equipment equipped with a refrigerant circulation type cooling device. In electronic equipment of patent literature 1, a cooling device, where a vaporizer and a condenser which cool the CPU are connected by pipes, a cooling device vaporizes a refrigerant by heat from the CPU and condenses it by cooling the condenser by using a fan. Then, the cooling device performs transportation and heat radiation of heat generated by a CPU. In this electronic equipment, it is enabled to mount a cooling device into thin type electronic equipment by dividing the condenser of the cooling device into a main condenser and an associate condenser and installing the associate condenser on the vaporizer.
In patent literature 2, there is disclosed electronic equipment which cools a CPU using a cooling device of a refrigerant circulation type and cools other heat generating members using a cooling wind from a fan. It is said that a cooling device in patent literature 2 improves the performance of a condenser by touching with a high temperature-side pipe and a low temperature-side pipe, which are connecting between the condenser and a vaporizer, each other via a thermal joint.
However, a cooling device in patent literature 1 cannot cool an associate condenser sufficiently because the distance between the associate condenser arranged on a vaporizer and a fan becomes large. In this case, the cooling efficiency of a cooling device declines. In addition, in a cooling device in patent literature 2, because a vaporizer is arranged in order to cool a CPU, a flow of a cooling wind delivered from a fan is disturbed by the vaporizer. Accordingly, the cooling efficiency for other heat generating members besides the CPU declines, and the cooling efficiency of electronic equipment as a whole declines consequently.
On the other hand, when, in electronic equipment of an existing air cooling system, a cooling device of a refrigerant circulation type is arranged instead of arranging a plurality of cooling fans or a large cooling fan, a layout change of each component in the electronic equipment is needed to be performed to optimize a flow of a cooling wind. However, it is difficult to perform a layout of components again for each model of electronic equipment.
Thus, in cooling devices disclosed in a patent literature 1 and a patent literature 2, there is a problem that the cooling efficiency of electronic equipment as a whole falls when a cooling device of a refrigerant circulation type is mounted on thin type electronic equipment. Further, in electronic equipment of an existing air cooling system, when a cooling device of a refrigerant circulation type is arranged instead of arranging a plurality of cooling fans or a large cooling fan, there is a problem that a layout change of each component in the electronic equipment is needed to optimize a flow of a cooling wind.
An object of the present invention is to provide a cooling device and electronic equipment using the same which settle a problem, which is the problem mentioned above, that the cooling efficiency of electronic equipment as a whole declines when a cooling device of a refrigerant circulation type is arranged in thin type electronic equipment, and that a layout change of each component in the electronic equipment is required to avoid that.
In order to achieve the above-mentioned object, a cooling device according to the present invention is a cooling device that is arranged in a chassis having an upper surface, and comprises: a refrigerant; a vaporizer including an evaporative vessel having a side face of a curved surface shape, and performing heat-absorption by making the refrigerant change a phase from a liquid phase state to a vapor phase state; a condenser to perform heat-radiation by making the refrigerant change a phase from a vapor phase state to a liquid phase state; a pipe to connect the vaporizer and the condenser; and a flow path suppression means for suppressing a cooling wind flowing between an area over the evaporative vessel and the upper surface.
In order to achieve the above-mentioned object, electronic equipment according to the present invention comprises: a chassis having an upper surface; the cooling device mentioned above; a first heat generating member and a second heat generating member, both generating heat along with their operations; a fan being arranged facing said condenser of the cooling device which delivers a cooling wind. Here, the first heat generating member is arranged in an area under the evaporative vessel; and the second heat generating member is arranged in a direction along a curved-surface-shape side face of the evaporative vessel.
A cooling device according to the present invention and electronic equipment using the same can improve, when a cooling device of a refrigerant circulation type is arranged in thin type electronic equipment, the cooling efficiency of the electronic equipment as a whole without changing the layout of each component in the electronic equipment.
The first exemplary embodiment will be described. There is shown a top view indicating an internal configuration of electronic equipment according to this exemplary embodiment in
In the chassis 11, the first heat generating member 31 is arranged under the vaporizer 21 of the cooling device 20, and the condenser 22 is arranged facing the fan 40. The vaporizer 21 is arranged between the second heat generating member 32 and the condenser 22. The first heat generating member 31 is cooled by the cooling device 20, and the condenser 22 and the second heat generating member 32 are cooled by the fan 40. Description will be made later about cooling of the second heat generating member 32.
Here, a top view showing an internal configuration of related electronic equipment to which an air cooling system is applied is indicated in
When the electronic equipment 10 having the cooling device 20 of a phase change cooling system shown in
That is, about the cooling device 20 and the electronic equipment 10 according to this exemplary embodiment, a change to the electronic equipment 10 of a phase change cooling system from the related electronic equipment 90 of an air cooling system is made by just arranging the condenser 22 in part of the fan arrangement area in the related electronic equipment 90 of an air cooling system without performing other large layout changes.
Next, a cooling efficiency of the electronic equipment 10 equipped with the cooling device 20 according this exemplary embodiment will be described by explaining each element of the cooling device 20.
The vaporizer 21 is arranged on the first heat generating member 31, and cools the first heat generating member 31 by making heat of the first heat generating member 31 be absorbed by the refrigerant 25 of a liquid phase state that is collected in the interior. In this exemplary embodiment, the side face of an evaporative vessel which constitutes the vaporizer 21 is formed into a curved surface shape. For example, the side face of an evaporative vessel is formed into a shape that widens smoothly once from the windward direction of a cooling wind delivered from the fan 40 toward predetermined directions and then narrows smoothly. By composing the side face of an evaporative vessel in a curved surface shape, a cooling wind which is delivered from the fan 40 and reaches the vaporizer 21 experiences a small occurrence of detachment of a flow from the side face of the evaporative vessel and a turbulent flow, and has a small decrease of a wind velocity even after flowing into the side behind the vaporizer 21 along the side face of the evaporative vessel.
The condenser 22 cools the refrigerant 25 of a vapor phase state. For example, the condenser 22 has a plurality of tubular bodies that are not illustrated and radiators arranged along the lengthwise direction of the tubular bodies. The condenser 22 makes heat of the refrigerant 25 of the vapor phase state be radiated to outside air via the radiators by the refrigerant 25 of the vapor phase state passing interior of the tubular bodies. Meanwhile, in this exemplary embodiment, the condenser 22 employs a plate-like fin of metal as a radiator.
The steam pipe 23 connects the vaporizer 21 and the condenser 22. The refrigerant 25 that has become a vapor phase state in the vaporizer 21 passes the steam pipe 23, and is transported to the condenser 22.
The liquid pipe 24 connects the condenser 22 and the vaporizer 21. The refrigerant 25 that has become a liquid phase state in the condenser 22 passes the liquid pipe 24, and is transported to the vaporizer 21.
The refrigerant 25 is a medium having a low-boiling point. The refrigerant 25 absorbs heat of the first heat generating member 31 in the vaporizer 21, and changes its phase to the vapor phase state from the liquid phase state. The refrigerant 25 of the vapor phase state is transported to the condenser 22 via the steam pipe 23. In the condenser 22, the refrigerant 25 condenses by radiating heat into outside air and changes its phase to the liquid phase state from the vapor phase state. The refrigerant 25 of the liquid phase state is transported to the vaporizer 21 again via the liquid pipe 24.
The flow path suppression means 26 is arranged in a manner reaching near the upper surface 12 of the chassis 11, and suppresses leak of a cooling wind, which has been delivered from the fan 40, passed the condenser 22 and reached the vaporizer 21, through a space over the vaporizer 21. By having the flow path suppression means 26, a cooling wind which has reached a vaporizer 11 flows toward the backward along the side face of the evaporative vessel without passing the space over the evaporative vessel. By this, at the back of the evaporative vessel, a cooling wind having a maintained wind speed can be obtained in the neighborhood of the substrate surface.
The flow path suppression means 26 can be configured by, when the evaporative vessel is arranged on the first heat generating member 31, forming the height of the evaporative vessel which constitutes the vaporizer 21 as a height that the upper surface of the evaporative vessel reaches near the upper surface 12 of the chassis 11, for example. The flow path suppression means 26 can be also configured by a flow path suppression member arranged on the evaporative vessel. This flow path suppression member is formed with a height that the upper surface of the flow path suppression member reaches near the upper surface 12 of the chassis 11 when arranging the evaporative vessel on the first heat generating member 31 and arranging the flow path suppression member on the evaporative vessel. Alternatively, the flow path suppression member can be configured by providing a cap for the vaporizer on the lid of the upper chassis side.
The cooling device 20 constituted as above makes the refrigerant 25 keep circulating in the cooling device 20 without using a liquid pump and the like, and radiates heat which has been generated by the first heat generating member 31 to outside air, cooling the first heat generating member 31.
Further, in the cooling device 20 constituted as above, the flow path suppression means 26 prevents a cooling wind which has reached the vaporizer 21 from flowing through the space over the vaporizer 21, and the side face of an evaporative vessel which constitutes the vaporizer 21 is formed into a curved surface shape such as a shape that widens smoothly once to predetermined directions from the windward direction of the cooling wind delivered from the fan 40 and then narrows smoothly. In this case, because there is a small occurrence of detachment and a turbulent flow of a flow from the side face of the evaporative vessel, a cooling wind delivered from the fan 40 flows into the backward along the side face while keeping a wind speed, and cools the second heat generating member 32 arranged behind the vaporizer 21. Accordingly, even when the cooling device 20 according to this exemplary embodiment is mounted on thin type electronic equipment, the cooling efficiency of the whole electronic equipment can be improved.
As above, the cooling device 20 according to this exemplary embodiment and the electronic equipment 10 using that can improve, when the cooling device 20 of a refrigerant circulation type is arranged in thin type electronic equipment, the cooling efficiency of the electronic equipment 10 as a whole without changing the layout of each component in the electronic equipment 10.
The second exemplary embodiment will be described. In this exemplary embodiment, a cooling device of a phase change cooling system is applied to a 1U server.
In
In the server 100 according to this exemplary embodiment, the CPU 130 radiates heat when operating, and is cooled by the cooling device 110. The heat generating component 140 and the power supply 160 generate heat when operating, and cooled by a cooling wind which is delivered from the fan 120.
On the other hand, in
When the server 100 equipped with the cooling device 110 of a phase change cooling system shown in
That is, the cooling device 110 of a phase change cooling system according to this exemplary embodiment can be arranged in the fan 910 of the related server 900 of an air cooling system by just making the occupation area of the fan 910 small without performing large layout changes about other components.
The server 100 according to this exemplary embodiment will be described using
The cooling device 110 cools the CPU 130. The fan 120 cools the condenser 120 of the cooling device 110, the heat generating component 140 and the power supply 160. The cooling device 110 and the fan 120 will be described later.
The CPU 130 carries out various operations by reading a program or the like stored in the memory 150. The CPU 130 is formed by a semiconductor and the like, and generates heat along with its operations. The CPU 130 is cooled by the cooling device 110.
The heat generating component 140 is a component which generates heat along with its operations, and is a chipset or the like such as Northbridge. In
The memory 150 stores various kinds of information such as a program. In
The power supply 160 supplies electric power to each part of the server 100. In this exemplary embodiment, the power supply 160 is cooled by a cooling wind which is delivered from the fan 120 and passes the memory 150.
Next, the cooling device 110 and the fan 120 according to this exemplary embodiment will be described in detail.
The vaporizer 111 is arranged on the CPU 130, and houses a plurality of pieces of fin 116 and the refrigerant 115 in its interior. The vaporizer 111 includes a steam outlet head 111a for connecting the steam pipe 112, and a liquid inlet head 111b for connecting the liquid pipe 113. The vaporizer 111 cools the CPU 130 by absorbing heat released from the CPU 130. The vaporizer 111 makes heat released from the CPU 130 be heat-transferred to the refrigerant 115 of a liquid phase state stored inside the vaporizer 111 via the plurality of pieces of fin 116. By heat released from the CPU 130 being made to be heat-transferred to the refrigerant 115 of the liquid phase state, the refrigerant 115 performs a phase change to a vapor phase state from the liquid phase state.
In this exemplary embodiment, a height of the evaporative vessel which constitutes the vaporizer 111 is designed as a height that reaches near the upper surface of the chassis of the server 100 starting from the upper position of the CPU 130. Furthermore, the side face of an evaporative vessel is designed as a curved surface shape, such as a shape that widens smoothly once toward the direction of the heat generating component 140 starting from the fan 120 side, and then narrows smoothly. In this exemplary embodiment, the evaporative vessel is formed into a cylindrical shape having a height that reaches near the upper surface of the chassis of the server 100 when the vaporizer 111 is arranged on the CPU 130.
By arranging the vaporizer 111 near the upper surface of the chassis of the server 100, a cooling wind which flows to the backward passing the upper surface of the vaporizer 111 can be suppressed. By forming the side face of the evaporative vessel of the vaporizer 111 into a curved surface shape, it is possible to prevent a cooling wind which has reached the vaporizer 111 from being detached from the side face of the evaporative vessel, and to guide it to the side behind the vaporizer 111 along the side face without disturbing the flow.
The steam pipe 112 connects the vaporizer 111 and the condenser 114. The refrigerant 115 that has become a vapor phase state in the vaporizer 111 passes the steam pipe 112, and is transported to the condenser 114.
The liquid pipe 113 connects the condenser 114 and the vaporizer 111. The refrigerant 115 that has become a liquid phase state in the condenser 114 passes the liquid pipe 113, and is transported to the vaporizer 111 again.
The condenser 114 has a steam inlet head 114a for connecting the steam pipe 112, a liquid outlet head 114b for connecting a liquid pipe 113 and a plurality of tubular bodies which are not illustrated and plate-like fins which are stacked along the lengthwise direction of this tubular body. In the condenser 114, the plurality of tubular bodies which are not illustrated are arranged in parallel with each other in a direction perpendicular to the direction of the cooling wind delivered from the fan 120. By the refrigerant 115 of the vapor phase state passing in the tubular bodies of the condenser 114, heat of the refrigerant 115 is radiated via plate-like fins, and the refrigerant 115 of the vapor phase state is cooled. A cooling wind which has cooled plate-like fins flows out into the backward of the condenser 114, that is, into the side of the vaporizer 111 and the memory 150 just as it is. By heat of the refrigerant 115 being radiated, the refrigerant 115 changes its phase to a liquid phase state from a vapor phase state.
The refrigerant 115 is a medium having low-boiling points. As the refrigerant 115, an organic refrigerant such as HFC (hydrofluorocarbon) and HFE (hydro-fluoro ether) can be applied. The refrigerant 115 performs heat-absorption of heat of the CPU 130, and changes its phase to a vapor phase state from a liquid phase state in the vaporizer 111. The refrigerant 115 of the vapor phase state is transported to the condenser 114 via the steam pipe 112. Further, the refrigerant 115 condenses due to heat being transported to outside air in the condenser 114, and changes its phase to a liquid phase state from the vapor phase state. The refrigerant 115 of the liquid phase state is transported to the vaporizer 111 again via the liquid pipe 113.
In the cooling device 110 configured as above, the refrigerant 115 keeps circulating in the cooling device 110 without using a pump, and cools the CPU 130 by radiating heat generated in the CPU 130 to outside air.
The fan 120 is arranged facing the condenser 114 of the cooling device 110, and mainly cools the condenser 114 by air by delivering a cooling wind to the condenser 114. A cooling wind released from the fan 120 passes between the plate-like fins of the condenser 114 which are stacked, and flows into a space behind the condenser 114. In
On the other hand, in
As above, the cooling device 110 according to this exemplary embodiment and the server 100 using that can change the related server 900 of an air cooling system to a server of a phase change cooling system by just replacing part of fans by a condenser without performing other large layout changes.
Further, by designing, in the cooling device 110 according to this exemplary embodiment and the server 100 using that, the height of the evaporative vessel of the vaporizer 111 as a height that reaches near the upper surface of the chassis of the server 100, and designing a side face of the evaporative vessel in a curved surface shape such as a shape that widens toward the direction of the heat generating component 140 smoothly once from the side of the fan 120 and then narrows smoothly, for example, the heat generating component 140 arranged at the back of the vaporizer 111 can be cooled efficiently using a cooling wind which has been delivered from the fan 120.
Accordingly, the cooling device 110 according to this exemplary embodiment and the server 100 using that can improve, in a thin type server such as a 1U server, the cooling efficiency of a 1U server as a whole only by arranging the condenser 114 in a space that becomes available by substituting the one-barreled fan 120 of a refrigerant circulation type for the two-barreled fan 910 of an air cooling system.
Here, as shown in
A modified example of the second exemplary embodiment will be described. Top views showing part of the internal configuration of a server according to this exemplary embodiment are shown in
First, the server 100B shown in
A flow of a cooling wind at that time will be described. A flow of a cooling wind is shown in
Next, the server 100C shown in
In
A flow of a cooling wind at that time will be described. A flow of a cooling wind is shown in
The server 100D shown in
A flow of a cooling wind at that time will be described. A flow of a cooling wind is shown in
As above, in the cooling device according to this exemplary embodiment and the server using the same, the evaporative vessel has a height that reaches near the upper surface of the chassis of the server and its cross-sectional shape is formed with a drop shape made by joining streamline shapes. Because a streamline shape is a curve line which makes fluid resistance due to detachment minimal, a cooling wind can be led to the side behind the vaporizer efficiently in a manner keeping a wind speed while suppressing occurrence of detachment and a turbulent flow from the side face of the evaporative vessel in a minimum, and thus components arranged behind the vaporizer can be cooled. That is, even when a cooling device of a refrigerant circulation type is mounted on a thin type server such as a 1U server, the cooling efficiency of the 1U server as a whole can be improved.
Meanwhile when a refrigerant circulation system is substituted for an air cooling system in a thin type server, only part of a plurality of cooling fans is needed to be replaced by a cooling device of a refrigerant circulation type according to this exemplary embodiment, and a layout change of each component in the server is unnecessary.
In addition, a flow of a cooling wind which has reached a vaporizer can be bent into a desired direction by making the side face of an evaporative vessel be a drop shape made by joining streamline shapes and turning the joint to a desired direction. Accordingly, a cooling wind which has been delivered from a fan and reached a vaporizer can be made to flow toward the side of a heat generating component easily. Further, by forming the side face of the evaporative vessel into a shape made by joining streamline shapes at a plurality of points, a plurality of heat generating components which are arranged in different directions behind the vaporizer can be cooled simultaneously using a cooling wind which has reached the vaporizer.
Here, in the cooling device according to this exemplary embodiment and the server using that, it is desirable to arrange a steam outlet head and a liquid inlet head of the vaporizer in opposite positions from each other.
The third exemplary embodiment will be described.
The fan 220, the CPU 230, the heat generating component 240, the steam pipe 212, the liquid pipe 213, the condenser 214 and the refrigerant 215 have the same functions as the fan 120, the CPU 130, the heat generating component 140, the steam pipe 112, the liquid pipe 113, the condenser 114 and the refrigerant 115 described in the second exemplary embodiment. Hereinafter, description will be made centering on parts different from the server 100 according to the second exemplary embodiment.
The side face of an evaporative vessel which constitutes the vaporizer 211 is formed with a curved surface shape such as a shape that is widened toward the direction of the heat generating component 240 from the side of the fan 220 smoothly once and then narrows smoothly. In this exemplary embodiment, the vaporizer 211 is formed into a cylindrical shape.
A flow path suppression member 217 is a plate-like body of height d. The flow path suppression member 217 can be formed using resin or the like. In this exemplary embodiment, the flow path suppression member 217 is formed into a columnar form of height d having the same cross-sectional shapes as the vaporizer 211. When arranging the vaporizer 211 on the CPU 230 and arranging the flow path suppression member 217 on the vaporizer 211, the height d is set as a height that the upper surface of the flow path suppression member 217 reaches near the upper surface of the chassis of the server 200.
By arranging the flow path suppression member 217 of height d on the vaporizer 211, a cooling wind which flows toward the backward passing the upper surface of the flow path suppression member 217 can be suppressed. Also, by forming the evaporative vessel and the flow path suppression member 217 into cylindrical shapes, a cooling wind which has reached the vaporizer 211 and the flow path suppression member 217 is led to the side behind the vaporizer 211 and the flow path suppression member 217 along the side faces of the evaporative vessel and the flow path suppression member 217.
As above, in the cooling device 210 according to this exemplary embodiment and the server 200 using that, the side faces of the evaporative vessel and the flow path suppression member 217 are formed as a curved surface shape such as a shape that widens toward the direction of the heat generating component 240 from the side of the fan 220 smoothly once and then narrows smoothly. Furthermore, height d of the flow path suppression member 217 is set to a height by which the upper surface of the flow path suppression member 217 reaches near the upper surface of the chassis of the server 200 when arrangement of the CPU 230, the vaporizer 211 and the flow path suppression member 217 is made in a stacked manner. In this case, the heat generating component 240 arranged behind the vaporizer 211 can be cooled efficiently using a cooling wind which has been delivered from the fan 220. That is, even when the cooling device 210 of a refrigerant circulation type is mounted on the thin type server 200 such as a 1U server, the cooling efficiency of the server 200 as a whole can be improved.
Meanwhile, when a refrigerant circulation system is substituted for an air cooling system in a thin type server, only part of a plurality of cooling fans is needed to be replaced by the condenser 214, and a layout change of each component in the server is unnecessary.
In addition, in a case where the vaporizer 211 and the flow path suppression member 217 of height d are used together, when CPUs of different heights are used, or when the heights of servers differ from each other, the vaporizer 211 can be used in common by changing height d of the flow path suppression member 217 according to that. Accordingly, a vaporizer does not need to be prepared for each CPU or server, and thus the cost of the cooling device 210 and the server 200 can be made to be low.
Here, in the above-mentioned exemplary embodiment, although the cross-sectional shape of the flow path suppression member 217 is made to be the same as the cross-sectional shape of the evaporative vessel of the vaporizer 211, it is not limited to this.
In
Height d is set to a height by which the upper surface of the flow path suppression member 217B reaches near the upper surface of the chassis of the server 200B when arranging a vaporizer 211B on a CPU 230B and arranging the flow path suppression member 217B on the vaporizer 211B. By arranging the flow path suppression member 217B of height d on the vaporizer 211B, a cooling wind which flows to the backward passing the upper surface of the flow path suppression member 217B can be suppressed.
On the other hand, length L is set to a numerical value larger than the diameter of the vaporizer 211B. Accordingly, when the flow path suppression member 217B is arranged on the vaporizer 211B, part of the flow path suppression member 217B projects in the x-direction from the vaporizer 211B. A portion of the flow path suppression member 217B projecting from the vaporizer 211B (hereinafter, it is described as a projecting portion 218B) is shown in
A flow of a cooling wind at that time will be described. A flow of a cooling wind is shown in
As above, in the server 200B equipped with a cooling device 210B according to this exemplary embodiment, the flow path suppression member 217B of height d equipped with the projecting portion 218B is arranged on the vaporizer 211B. In this case, by setting height d of the flow path suppression member 217B according to the heights of the server 200B and the CPU 230B, the vaporizer 211B can be used in common. Further, because the flow path suppression member 217B is equipped with the projecting portion 218B, a cooling wind which has reached the vaporizer 211B and the flow path suppression member 217B is led below the projecting portion 218B of the flow path suppression member 217B. Accordingly, the heat generating component 240B of a low height which is arranged on the substrate at the back of the vaporizer 211B can be cooled efficiently using a cooling wind which is delivered from the fan 220B.
Here, it is possible to form part of the under surface of the projecting portion 218B of the flow path suppression member 217B into a concave shape, or a shape inclining downward. In this case, a cooling wind is able to be led downward furthermore.
The fourth exemplary embodiment will be described.
A point that the server 300 according to this exemplary embodiment is different from the server 100 according to the second exemplary embodiment is that the straightening member 318 is arranged around the vaporizer 311. Hereinafter, description will be made focusing on a point different from the server 100 described in the second exemplary embodiment.
The straightening member 318 is arranged in a periphery of the evaporative vessel of which the vaporizer 311 is composed, and is formed of a tabular member, for example. As shown in
A flow of a cooling wind at that time will be described. A flow of a cooling wind is shown in
In addition, a cooling wind which flows toward the backward passing the upper surfaces of the vaporizer 311 and the straightening member 318 can be suppressed because the evaporative vessel of the vaporizer 311 is formed with a height that reaches near the upper surface of the chassis of the server 300 and the straightening member 318 is fastened to the upper end of the vaporizer 311 in the side of the condenser 314. Accordingly, the heat generating component 340 can be cooled efficiently.
As above, by fastening the straightening member 318 to the vaporizer 311 in the cooling device 310 according to this exemplary embodiment and the server 300 using that, the heat generating component 340 of a low height which is arranged in a downward position at the back of the vaporizer 311 can be cooled efficiently using a cooling wind which is delivered from the fan 320. That is, even when the cooling device 310 of a refrigerant circulation system is mounted on the thin type server 300 such as a 1U server, the cooling efficiency of the server 300 as a whole can be improved.
Meanwhile, when, in a thin type server, a refrigerant circulation system is substituted for an air cooling system, only part of a plurality of cooling fans is needed to be replaced by the condenser 314, and a layout change of each of the other components in the server is unnecessary.
Here, a plurality of straightening members can be arranged in a vaporizer.
In
The heat generating component 340B is a component of a low height which generates heat with operations. In the PCI slot 360B, there is mounted a heat generating component such as a LSI (Large Scale Integration) 361B. As shown in
The straightening members 318aB and 318bB are tabular members each having a hole for fitting the vaporizer 311B in its center, for example. In
A flow of a cooling wind at that time will be described. A flow of a cooling wind is shown in
On the other hand, the remaining cooling wind is led toward the side behind the vaporizer 311B downward along the under surface of the straightening member 318aB, the upper surface of the straightening member 318bB and the side face of the evaporative vessel. The cooling wind led toward the side behind the vaporizer 311B downward reaches the heat generating component 340B, and cools the heat generating component 340B.
As above, by arranging two straightening members 318aB and 318bB in the vaporizer 311B in the cooling device 310B according to this exemplary embodiment and the server 300B using that, both of the heat generating component 340B arranged in a lower portion of the server 300B and the PCI slot 360B arranged in an upper portion of the server 300B can be cooled using a cooling wind which has reached the vaporizer 311B.
Meanwhile, the number of the straightening members arranged in a vaporizer is not limited to 1 or two. Also, a straightening member described in this exemplary embodiment and a flow path suppression member described in the third exemplary embodiment can be combined. Further, it is not limited to make a straightening member and a flow path suppression member be fastened to a cylindrical evaporative vessel. For example, it is possible to make a straightening member and a flow path suppression member be fastened to an evaporative vessel which is formed into a drop shape made by joining streamline shapes described in a modified example of the second exemplary embodiment, or into a truncated cone shape, or into a temple bell shape or the like.
Meanwhile, although the present invention has been described with reference to an exemplary embodiment, the present invention is not limited to the above-mentioned exemplary embodiments. Even if there is a change or the like in the design within the range that does not deviate from the point of this invention, it is included in this invention.
This application claims priority based on Japanese application Japanese Patent Application No. 2012-000077, filed on Jan. 4, 2012, the disclosure of which is incorporated herein in its entirety.
The present invention can be applied to a component, equipment and a system in general having a heat generating member as well as a cooling device which cools the heat generating member in its interior.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2012-000077 | Jan 2012 | JP | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/JP2012/008208 | 12/21/2012 | WO | 00 | 7/1/2014 |
