Number | Name | Date | Kind |
---|---|---|---|
4072816 | Gedney et al. | Feb 1978 | |
4225900 | Ciccio et al. | Sep 1980 | |
4332778 | Barbour et al. | Mar 1982 | |
4628411 | Balderes et al. | Dec 1986 | |
4685033 | Inoue | Aug 1987 | |
4803595 | Kraus et al. | Feb 1989 | |
4811076 | Tigelaar et al. | Mar 1989 | |
4816323 | Inoue | Mar 1989 | |
4816894 | Hattori | Mar 1989 | |
4866507 | Jacobs et al. | Sep 1989 | |
5136471 | Inasaka | Aug 1992 | |
5155302 | Nguyen | Oct 1992 | |
5177594 | Chance et al. | Jan 1993 |
Number | Date | Country |
---|---|---|
0045877A1 | Jul 1981 | EPX |
2096281A | Mar 1982 | GBX |
Entry |
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U.S. Ser. No. 07/605,806 filed Oct. 30, 1990. |
U.S. Ser. No. 07/840,428 filed Feb. 24, 1992. |
"Low-Cost Multichip Modules Push Limits of Packaging", Electronic Design International, Jul. 1990. |
Anderson et al., "Surface Mount Design and Assembly for High Density Complex Modules," 6th Annual International Electronics Packaging Society Conference, San Diego, Calif, Nov. 17-19, 1986, pp. 404-416. |