Electronic component mounting structure

Abstract

An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objectives, features and advantages of the present invention will become more apparent from the following detailed description made with reference to the accompanying drawings. In the drawings:

FIG. 1 is a side view of a board and an electronic component mounted to the board according to a first embodiment of the present invention;

FIG. 2A is a side view of the electronic component of FIG. 1, and FIG. 2B is a front view of the electronic component of FIG. 1;

FIG. 3 is a cross-sectional view of connection area between the board and the electronic component of FIG. 1;

FIG. 4 is a front view of an electronic component according to a second embodiment of the present invention;

FIG. 5A is a plan view of a board according to a third embodiment of the present invention, and FIG. 5B is a cross-sectional view taken along line VB-VB in FIG. 5A;

FIGS. 6A and 6B are cross-sectional views showing air flow in a blind hole of the board according to the third embodiment, and FIG. 6C is a cross-sectional view showing air flow in a blind hole of the board according to the first embodiment;

FIG. 7 is a cross-sectional view of a board according to a modification of the third embodiment;

FIGS. 8A and 8B are plan views of blind holes according to a modification of the third embodiment;

FIG. 9A is a plan view of a board according to a modification of the third embodiment, and FIG. 9B is a cross-sectional view taken along line IXB-IXB in FIG. 9A;

FIG. 10A is a plan view of a screen used in a screen printing process, and FIG. 10B is a plan view showing a positional relationship between a land and a terminal;

FIG. 11A is a cross sectional view of a blind hole that is filled with a solder paste by using the screen of FIG. 10A, and FIG. 11B is a cross sectional view of the blind hole of FIG. 11A after the terminal is inserted in the blind hole;

FIG. 12A is a front view of an electronic component according to a fourth embodiment of the present invention, and FIG. 12B is a plan view of a board according to the fourth embodiment;

FIG. 13 is a plan view of a board according to a fifth embodiment of the present invention;

FIG. 14A is a plan view of a board according to a sixth embodiment of the present invention; FIG. 14B is a side view of an electronic component according to the sixth embodiment, and FIG. 14C is a plan view of the board according to the first embodiment;

FIG. 15A is a plan view of a board according to a modification of the sixth embodiment, and FIG. 15B is an enlarged view of FIG. 15A;

FIG. 16A is a cross-sectional view of connection area between a board and an electronic component according to a seventh embodiment of the present invention, and FIG. 16B is a plan view of the board of FIG. 16A;

FIG. 17 is a cross-sectional view of connection area between a board and an electronic component according to an eighth embodiment of the present invention;

FIG. 18A is a cross-sectional view of connection area between a board and an electronic component according to a modification of the eighth embodiment, and FIG. 18B is a plan view of a land of the board of FIG. 18A;

FIG. 19 is a cross-sectional view of connection area between a board and an electronic component according to a modification of the present invention;

FIG. 20 is a side view of an electronic component according to a modification of the present invention; and

FIG. 21 is a cross-sectional view of connection area between a board and an electronic component according to a modification of the present invention.

Claims

1. An electronic component mounting structure comprising: a board including a plurality of lands; andan electronic component mounded on a surface of the board, the electronic component including a body and a plurality of terminals extending from the body, each of the plurality of terminals being electrically connected to a corresponding one of the plurality of lands of the board, whereinthe plurality of terminals include a first terminal that has both a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board, andthe plurality of lands include a first land that has a land portion electrically soldered to the first terminal portion of the first terminal and a blind hole for receiving the second terminal portion of the first terminal, the blind hole having an opening on the surface of the board, a bottom wall inside the board, and a side wall defined by the opening and the bottom wall.

2. The mounting structure according to claim 1, wherein the land portion of the first land extends to the blind hole, andthe second terminal portion is electrically soldered to the land portion inside the blind hole.

3. The mounting structure according to claim 1, wherein the body of the electronic component has a length direction along the surface of the board,the plurality of terminals are arranged in the length direction, andthe plurality of lands are arranged in the length direction.

4. The mounting structure according to claim 3, wherein the first land arranged on end side in the length direction has the blind hole with a first opening width,the first land arranged on middle side in the length direction has the blind hole with a second opening width, andthe first opening width is greater than the second opening width.

5. The mounting structure according to claim 3, wherein the first land is positioned with respect to the body such that the land potion is near to the body and the blind hole is far from the body.

6. The mounting structure according to claim 3, wherein the first land is positioned with respect to the body such that the land potion is far from the body and the blind hole is near to the body.

7. The mounting structure according to claim 3, wherein the first land includes a first land member and a second land member,the first land member is positioned with respect to the body such that the land potion is far from the body and the blind hole is near to the body,the second land member is positioned with respect to the body such that the land potion is near to the body and the blind hole is far from the body, andthe first and second land members are alternately arranged in the length direction.

8. The mounting structure according to claim 1, wherein the plurality of terminals further include a second terminal having the first terminal portion, andthe plurality of lands further include a second land having the land portion, andthe first terminal portion of the second terminal is electrically soldered to the land portion of the second land.

9. The mounting structure according to claim 8, wherein the body of the electronic component has a length direction along the surface of the board,the first terminal is arranged on end side in the length direction, andthe second terminal is arranged on middle side in the length direction.

10. The mounting structure according to claim 8, wherein the body of the electronic component has a length direction along the surface of the board, andthe first and second terminals are alternately arranged in the length direction.

11. The mounting structure according to claim 1, wherein the second terminal portion includes a plurality of terminal members that are spaced from each other in a direction along the surface of the board.

12. The mounting structure according to claim 11, wherein the plurality of terminal members are received in the same blind hole.

13. The mounting structure according to claim 11, wherein the blind hole includes a plurality of hole members each of which receives a corresponding one of the plurality of terminal members.

14. The mounting structure according to claim 11, wherein the plurality of terminal members of the second terminal portion are unitary with the first terminal portion.

15. The mounting structure according to claim 2, wherein the side and bottom walls of the blind hole are coated with the land portion such that the blind hole has a taper shape and decreases in width toward the bottom wall,the opening of the blind hole has a first width,the bottom wall has a second width less than the first width, andthe side wall forms an obtuse angle with the bottom wall.

16. The mounting structure according to claim 15, wherein the blind hole has a depth less than the first width of the opening.

17. The mounting structure according to claim 16, wherein the depth of the blind hole is less than the second width of the bottom wall.

18. The mounting structure according to claim 15, wherein the second terminal portion has the taper shape and decreases in width toward its tip.

19. The mounting structure according to claim 15, wherein the side and bottom walls of the blind hole are coated with the land portion by a plating process.

20. The mounting structure according to claim 2, wherein the board includes a plurality of inner layers, andat least one of the plurality of inner layers has a wiring pattern electrically connected to the land portion inside the blind hole.

21. The mounting structure according to claim 1, wherein the first terminal includes a spring portion between the body and the first and second terminal portions, andthe spring portion is elastically deformable to absorb stress.

22. The mounting structure according to claim 1, wherein the board further includes at least one of a ground pattern, a wiring pattern electrically connected to the land potion of the first land, a dummy wiring pattern, and a silk pattern that are disposed near the first land.

23. The mounting structure according to claim 1, wherein the electronic component is a connector.