Claims
- 1. A process for fabricating a substrate having metallic electrical interconnects, wherein said interconnects comprise a first metal overlying a second metal, said process comprising the steps of etching a region comprising a first layer of said first metal overlying a second layer of said second metal characterized in that both said first and second layers are etched using a solution comprising HF, cupric chloride, and hydrochloric acid.
- 2. The process of claim 1 wherein said first metal comprises copper.
- 3. The process of claim 2 wherein said second metal comprises titanium.
- 4. The process of claim 3 wherein said second metal includes palladium.
- 5. The process of claim 1 wherein said second metal comprises titanium.
- 6. The process of claim 5 wherein said second metal includes palladium.
CROSS-REFERENCE TO RELATED APPLICATION
This application is a Continuation-in-Part of allowed U.S. application Ser. No. 08/094,654, filed Jul. 19, 1993, now U.S. Pat. 5,298,117 which is hereby incorporated by reference.
US Referenced Citations (7)
Foreign Referenced Citations (1)
Number |
Date |
Country |
209792 |
Aug 1990 |
JPX |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
94654 |
Jul 1993 |
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