BRIEF DESCRIPTION OF THE DRAWINGS
The invention will become more fully understood from the detailed description given herein below illustration only, and thus is not limitative of the present invention, and wherein:
FIG. 1 is a flow chart showing a method of manufacturing a glass circuit board according to an embodiment of the invention;
FIGS. 2A to 2F are one set of schematic illustrations showing the glass circuit board corresponding to the flow of FIG. 1; and
FIG. 3 is a schematic illustration showing the glass circuit board corresponding to the step S03 in the flow of FIG. 1.
DETAILED DESCRIPTION OF THE INVENTION
The present invention will be apparent from the following detailed description, which proceeds with reference to the accompanying drawings, wherein the same references relate to the same elements.
Referring to FIG. 1, a method of manufacturing a glass circuit board according to an embodiment of the invention includes steps S01 to S05.
With reference to FIGS. 1 and 2A, in step S01, a glass substrate 11 is provided. Then, in step S02, a metal layer 12 is formed on a surface 111 of the glass substrate 11. The material of the metal layer 12 can be selected from at least one of the group consisting of titanium, a titanium-tungsten alloy, aluminum, a chromium-nickel alloy, copper, a nickel-vanadium alloy, a chromium-copper alloy, a nickel-titanium alloy and molybdenum. In this embodiment, the material of the metal layer 12 is copper.
As shown in FIG. 2B, a metal connecting layer 13 is formed on the metal layer 12. The metal connecting layer 13 can be a single-layer structure or a multi-layer structure. The material of the metal connecting layer 13 may be, without limitation to, at least one of the group consisting of titanium, nickel, vanadium, copper, aluminum and gold. In this embodiment, the metal connecting layer 13 has a single-layer structure, and the material of the metal connecting layer 13 is copper, which is the same as that of the metal layer 12. Of course, as shown in FIG. 3, if the metal connecting layer 13′ has a multi-layer structure, it may include a titanium metal layer 13a, a nickel metal layer 13b, a vanadium metal layer 13c and a copper metal layer 13d in order.
With reference to FIGS. 2C and 2D, step S04 is to pattern the metal layer 12 and the metal connecting layer 13 so as to form a patterned metal layer 121 and a patterned metal layer 131, which can expose a part of the surface 111 of the glass substrate 11. In this embodiment, the step S04 for forming the patterned metal layer 121 and the patterned metal connecting layer 131 includes the following sub-steps. First, a resist layer is formed on the metal connecting layer 13 and patterned to form a patterned resist layer 14. Next, the metal layer 12 and the metal connecting layer 13 are etched using the patterned resist layer 14 as a mask to remove a part of the metal layer 12 and a part of the metal connecting layer 13. Accordingly, the patterned metal layer 121 and the patterned metal connecting layer 131 are formed.
In step S05, as shown in FIG. 2E, an insulating layer 15 with an opening 151 is formed on the part of the surface 111 of the glass substrate 11 and the patterned metal connecting layer 121. Then, a glass circuit board 1 can be obtained. In this embodiment, the patterned metal connecting layer 131 is exposed from the opening 151 of the insulating layer 15.
As shown in FIG. 2F, an electronic device 2 or a connecting terminal (not shown) may be disposed on the patterned metal connecting layer 131 by way of surface mount technology (SMT), wire bonding or flip-chip bonding in this embodiment. The electronic device 2 may be an active device or a passive device. In more specific, the electronic device 2 may be a resistor, a capacitor, an inductor, a transistor, a diode, a chip or a bare chip.
The method of manufacturing the glass circuit board according to the preferred embodiment of the invention has been described in detail. It is to be noted that the structure and the composition of the glass circuit board of the invention also have been described, so no repeated description for the glass circuit board will be made.
In summary, the conventional printed circuit board having a substrate made of a resin material is replaced with a glass substrate in the glass circuit board and the manufacturing method thereof according to the invention. Compared with the conventional resin substrate and the ceramic substrate, the glass substrate of the invention can withstand high temperature and has the fewer surface voids. Thus, the glass circuit board can be easily applied to the precise pitch technology in order to reduce the size of the circuit board and thus satisfy the lightness, thin-profile, and compactness requirements of electronic product using the disclosed glass circuit board.
Although the invention has been described with reference to specific embodiments, this description is not meant to be construed in a limiting sense. Various modifications of the disclosed embodiments, as well as alternative embodiments, will be apparent to persons skilled in the art. It is, therefore, contemplated that the appended claims will cover all modifications that fall within the true scope of the invention.
Patent Application
20070243404
