Patent Application
20130170133
This application claims all benefits accruing under 35 U.S.C. §119 from China Patent Application No. 201110447310.4, filed on Dec. 28, 2011 in the State Intellectual Property Office of China, the contents of the China application are hereby incorporated by reference.
1. Technical Field
The present disclosure generally relates to heat dissipating apparatuses, and particularly relates to a heat dissipating apparatus having two spaced fin assemblies.
2. Description of Related Art
Electronic components, such as central processing units (CPUs) in computers, generate a lot of heat during operations. Excess heat may cause deterioration in the operational stability of the electronic components and may damage the electronic components. Thus, excess heat must be removed quickly to maintain an acceptable operating temperature of the electronic components in the computer. One method for removing heat from an electronic component is by mounting a heat dissipating apparatus on the electronic component. However, the dissipating apparatus of related art may be inadequate to satisfy the ever-increasing demand for heat dissipation.
Therefore, there is room for improvement within the art.
Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one.”
The base 10 includes a bottom surface and a top surface. The bottom surface of the base 10 may contact a heat delivery surface of an electronic heat-generating component (not shown), such as a central processing unit (CPU) or a graphic processing unit (GPU), and take heat from the heat-generating component. The base 10 defines at least one receiving groove 12 on the top surface. The number of the at least one receiving groove 12 is equal to the number of the at least one heat pipe 30. Each of the at least one receiving groove 12 extends lengthwise along the base 10 and across the top surface of the base 10.
The first fin assembly 20 includes a plurality of parallel first fins. The first fin assembly 20 defines at least one cutout groove 22 in its bottom surface which matches the internal shape of the at least one receiving groove 12. The number of the at least one cutout groove 22 is equal to the number of the at least one receiving groove 12. Each of the at least one cutout groove 22 extends along a longer side of the first fin assembly 20 and is perpendicular to each of the plurality of first fins. The shape of the bottom surface of the first fin assembly 20 is substantially the same as the shape of the top surface of the base 10.
Each of the at least one heat pipe 30 is U-shaped and includes a connecting portion 32, a first contacting portion 34, and a second contacting portion 36. The first contacting portion 34 and the second contacting portion 36 are perpendicular to the connecting portion 32 and extend from two opposite ends of the connecting portion 32. The first contacting portion 34 and the second contacting portion 36 are parallel to each other. The connecting portion 32, the first contacting portion 34, and the second contacting portion 36 are substantially located in a same plane.
The second fin assembly 40 includes a plurality of second fins that are parallel to each other. The second fin assembly 40 defines at least one through hole 42. Each of the at least one through hole 42 extends through the second fin assembly 40. The number of the at least one through hole 42 is equal to the number of the at least one heat pipe 30. Each of the at least one through hole 42 extends along the longer dimension of the second fin assembly 40 and is perpendicular to each of the plurality of second fins. The height of the second fin assembly 40 may be greater than that of the first fin assembly 20.
The unidirectional fan module 50 includes an air outlet 52. The unidirectional fan module 50 may generate an airflow and output the airflow though the air outlet 52. The height of the air outlet 52 is substantially the same as the height of the second fin assembly 40.
In the embodiment shown in
Referring to
The second contacting portion 36 of each of the at least one heat pipe 30 is inserted into corresponding one of the at least one through hole 42 of the second fin assembly 40. The diameter of the cross section of the second contacting portion 36 is substantially the same as that of the at least one through hole 42 so that the second contacting portion 36 is in contact with the inner surface(s) of the at least one through hole 42 when the second contacting portion 36 is received in the at least one through hole 42.
The first fin assembly 20 and the second fin assembly 40 are separate from each other. The second fin assembly 40 is located in a horizontal position higher than the first fin assembly 20. The plane of each of the at least one heat pipe 30 is inclined upward from the top surface of the base 10.
The unidirectional fan module 50 is coupled to the second fin assembly 40. The air outlet 52 of the unidirectional fan module 50 faces to the second fin assembly 40 and is connected to a side of the second fin assembly 40. Thus, the airflow from the unidirectional fan module 50 blows towards and through the second fin assembly 14 through the air outlet 52 and removes heat from the second fin assembly 40. The unidirectional fan module 50 is above the first fin assembly 20. There is a space between the unidirectional fan module 50 and the first fin assembly 20.
Referring to
The bottom surface of the base 10 contacts the top surface of the electronic heat-generating component 82. A side of the second fin assembly 40 opposite to the unidirectional fan module 50 communicates with the air hole 72 of the enclosure 70. The airflow from the unidirectional fan module 50 passes through the second fin assembly 40 and the heated airflow exits the enclosure 70 via the air hole 72.
It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201110447310.4 | Dec 2011 | CN | national |
