Claims
- 1. A method for fabricating a multi-layer substrate comprising the steps of:
- preparing a provisional supporting plate;
- forming bottom thin-film conductors on said provisional supporting plate in a desired pattern;
- attaching a high-insulation adhesive sheet to said provisional supporting plate so as to cover said bottom thin-film conductors;
- half-curing said high-insulation adhesive sheet;
- separating said high-insulation adhesive sheet from said provisional supporting plate in such a manner that said bottom thin-film conductors are mounted on said high-insulation adhesive sheet;
- disposing said separated high-insulation adhesive sheet on a metal plate in such a manner that said bottom thin-film conductors face outward;
- disposing high-insulation organic film on said high-insulation adhesive sheet in such a manner that said high-insulation organic film covers said bottom thin-film conductors;
- curing said high-insulation adhesive sheet to tightly connect said high-insulation adhesive sheet to said metal plate and said high-insulation organic film; and
- forming top conductors on said high-insulation organic film.
- 2. A method for fabricating a multi-layer structure comprising the steps of:
- providing a metal plate;
- attaching a partially cured high-insulation adhesive sheet to said plate;
- forming bottom thin-film conductors on said partially cured high-insulation adhesive sheet;
- covering said bottom thin-film conductors with a high-insulation organic film;
- completely curing said high-insulation adhesive sheet;
- forming through holes;
- forming a conductor pattern on said high-insulation orgnanic film subsequent to said step of forming said through holes.
- 3. The method of claim 2 wherein said step of completely curing said high-insulation adhesive sheet is performed by the application of high temperatures and pressures.
Priority Claims (2)
Number |
Date |
Country |
Kind |
51-132121 |
Nov 1976 |
JPX |
|
52-33064 |
Mar 1977 |
JPX |
|
Parent Case Info
This application is a divisional of copending application Ser. No. 042,951, filed on May 29, 1982 which is a continuation of Ser. No. 847,912, filed on Nov. 2, 1977, now abandoned.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
3152938 |
Osifchin et al. |
Oct 1964 |
|
3688396 |
Kilby et al. |
Sep 1972 |
|
3947957 |
Luttmer |
Apr 1976 |
|
Divisions (1)
|
Number |
Date |
Country |
Parent |
42951 |
May 1982 |
|
Continuations (1)
|
Number |
Date |
Country |
Parent |
847912 |
Nov 1977 |
|