Claims
- 1. A polymer compound for photoresist wherein said polymer compound is formed of a polymer compound having at least one skeleton represented by the following general formula (1), general formula (2A), general formula (2B) or general formula (2C):
- 2. A polymer compound for photoresist wherein said polymer compound is formed of a polymer compound having at least one skeleton represented by the following general formula (3A), general formula (3B), general formula (3C) or general formula (3D):
- 3. A polymer compound for photoresist wherein said polymer compound is formed of a polymer compound having at least one skeleton represented by the following general formulas (4A), (4B), (4C), (4D), (4E), (4F), (4G) and (4H):
- 4. A polymer compound for photoresist wherein said polymer compound is formed of a polymer compound having a repeating unit represented by the following general formula (u-1):
- 5. A polymer compound for photoresist wherein said polymer compound is formed of a polymer compound having at least one repeating unit represented by the following general formulas (u-2a), (u-2b) and (u-2c):
- 6. A polymer compound for photoresist wherein said polymer compound is formed of a polymer compound having at least one repeating unit represented by the following general formulas (u-3a), (u-3b) and (u-3c):
- 7. A photosensitive resin composition wherein comprising the polymer compound for photoresist claimed in claim 1; and a photo-acid generating agent.
- 8. A photosensitive resin composition wherein comprising a polymer compound for photoresist, and a photo-acid generating agent; wherein said polymer compound is formed of a polymer compound having at least one repeating unit represented by the following general formula (u-1), any one of the following general formulas (u-2a), (u-2b) and (u-2c), or any one of the following general formulas (u-3a), (u-3b) and (u-3c):
- 9. A method of forming a pattern comprising:
forming a resin layer comprising the photosensitive resin composition claimed in claim 7 above a surface of a substrate; applying a patterned exposure to a predetermined region of said resin layer by F2 laser; heat-treating said resin layer that has been subjected to said patterned exposure; and subjecting the heat-treated resin layer to a developing process using an aqueous alkaline solution to selectively dissolve and remove exposure portions or unexposure portions, thereby forming the pattern.
- 10. A method of manufacturing electronic components comprising:
forming a resin layer comprising the photosensitive resin composition claimed in claim 7 above a surface of a substrate; applying a patterned exposure to a predetermined region of said resin layer by F2 laser; heat-treating said resin layer that has been subjected to said patterned exposure; subjecting the heat-treated resin layer to a developing process using an aqueous alkaline solution to selectively dissolve and remove exposure portions or unexposure portions, thereby forming a resist pattern; and etching said substrate by using the resist pattern as an etching mask.
- 11. A polymer compound for photoresist wherein said polymer compound is formed of a polymer compound having at least one skeleton represented by the following general formula (11), general formula (12A) or general formula (12B):
- 12. A monomer compound for forming a polymer for photoresist through a polymerization thereof characterized in that said monomer compound has a skeleton represented by the following general formula (m-1), general formula (m-2a), general formula (m-2b), general formula (m-3a), general formula (m-3b) or general formula (m-3c):
- 13. A photosensitive resin composition wherein comprising the polymer compound for photoresist claimed in claim 11; and a photo-acid generating agent.
- 14. A method of forming a pattern comprising:
forming a resin layer comprising the photosensitive resin composition claimed in claim 13 above a surface of a substrate; applying a patterned exposure to a predetermined region of said resin layer by F2 laser; heat-treating said resin layer that has been subjected to said patterned exposure; and subjecting the heat-treated resin layer to a developing process using an aqueous alkaline solution to selectively dissolve and remove exposure portions or unexposure portions, thereby forming the pattern.
- 15. A method of manufacturing electronic components comprising:
forming a resin layer comprising the photosensitive resin composition claimed in claim 13 above a surface of a substrate; applying a patterned exposure to a predetermined region of said resin layer by F2 laser; heat-treating said resin layer that has been subjected to said patterned exposure; subjecting the heat-treated resin layer to a developing process using an aqueous alkaline solution to selectively dissolve and remove exposure portions or unexposure portions, thereby forming a resist pattern; and etching said substrate by using the resist pattern as an etching mask.
Priority Claims (2)
Number |
Date |
Country |
Kind |
2000-332358 |
Oct 2000 |
JP |
|
2001-295012 |
Sep 2001 |
JP |
|
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This is a Continuation Application of PCT Application No. PCT/JP01/09567, filed Oct. 31, 2001, which was not published under PCT Article 21(2) in English.
Continuations (1)
|
Number |
Date |
Country |
Parent |
PCT/JP01/09567 |
Oct 2001 |
US |
Child |
10425848 |
Apr 2003 |
US |