1. Field of the Invention
The present invention relates to a holding apparatus that holds a substrate.
2. Description of the Related Art
Extreme-ultraviolet (EUV) exposure apparatuses and electron-beam exposure (drawing) apparatuses that have been under development as next-generation semiconductor exposure apparatuses perform exposure on substrates in vacuums. In a vacuum, heat transfer caused by convection does not occur, and heat therefore tends to be accumulated in an object. Hence, it is important in the development of the above exposure apparatuses to provide measures for dealing with heat (measures for cooling the object).
In a case where a substrate to be subjected to exposure is cooled, a method is employed in which heat transfer from the substrate to a substrate holding member (hereinafter also simply referred to as holding member) is promoted by using a gas contained between the substrate and the holding member. In a substrate holding apparatus (hereinafter also simply referred to as holding apparatus) disclosed by International Publication No. 2009/011574, since an enhanced promotion of heat transfer is desired for improvement of resolving power and overlay precision, a liquid is contained between a substrate and a holding member, whereby the substrate is held on the holding member. Specifically, a layer of the liquid has a negative pressure, as a capillary pressure of the liquid, with respect to a vacuum atmosphere. This phenomenon is utilized in holding the substrate on the holding member.
In the holding apparatus disclosed by International Publication No. 2009/011574, since the liquid evaporates quickly in a vacuum, the force for holding the substrate is reduced with the quick evaporation of the liquid. To deal with this problem, in a holding apparatus disclosed by International Publication No. 2010/094800, a holding member is provided with grooves having different depths, whereby the holding force at a necessary level is maintained for a longer period of time.
In the holding apparatus disclosed by International Publication No. 2010/094800, the area of a portion of the gap between the substrate and the holding member in which no liquid is present increases with time because of the evaporation of the liquid. Hence, necessary heat transfer may not occur in some areas, and the substrate may undergo thermal deformation.
The present invention provides, for example, a holding apparatus advantageous in heat transfer between a substrate and a holding member.
According to one aspect of the present invention, there is provided a holding apparatus that holds a substrate. The apparatus includes a base having burls that support the substrate, a pool whose capacity is variable and from which a liquid is to be supplied into a gap between the base and the substrate supported by the burls, and a regulator configured to regulate the capacity of the pool.
Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings.
Embodiments of the present invention will now be described with reference to the attached drawings. Basically, like elements are denoted by like reference numerals in all the drawings, and redundant description thereof is omitted.
The substrate holding apparatus according to the present invention is applicable to a drawing apparatus that performs drawing on a substrate with a charged particle beam, as described below, and to a wide variety of other apparatuses.
The liquid 12, having a certain thermal conductivity, not only contributes to the generation of a force for holding the substrate 2 but also contributes to the reduction in the thermal deformation of the substrate 2 by conducting heat applied to the substrate 2 during drawing to the base 11. When, however, the liquid 12 evaporates with time and the area of contact between the substrate 2 and the liquid 12 is reduced, the thermal deformation of the substrate 2 increases. To suppress the reduction in the area of contact, the supply mechanism is provided. The supply mechanism supplies the liquid 12 into the gap via a hole 14 provided in a central portion of the base 11. The supply mechanism includes a pool 17, a driving device 15, and a controller 16. The capacity of the pool 17 is variable. The liquid 12 is supplied from the pool 17 into the gap. The driving device 15 changes the capacity of the pool 17. The controller 16 controls the driving device 15. A combination of the driving device 15 and the controller 16 is also referred to as a regulator. The pool 17 includes, for example, a bellows 17a and a bottom plate 17b. The driving device 15 includes, for example, an actuator that moves the bottom plate 17b up and down. The pool 17 is not limited to that described above and only needs to have a variable capacity by, for example, including a cylinder and a piston. The driving device 15 is not limited to that described below and only needs to be capable of driving an element (for example, a piston) of the pool 17 in such a manner as to change the capacity of the pool 17 in cooperation with the pool 17.
In the above configuration, the controller 16 controls the driving device 15 to regulate the capacity of the pool 17 and to supply the liquid 12 stored in the pool 17 into the hole 14 so that the area of contact between the substrate 2 and the liquid 12 is not reduced with the evaporation of the liquid 12. To realize such an operation, the controller 16 controls the operation of the driving device 15 on the basis of elapsed time. For example, the controller 16 stores in advance relationships between different elapsed times and different amounts of evaporation of the liquid 12 (or values representing different instructions to the driving device 15 that correspond to different amounts of evaporation of the liquid 12), and controls the operation of the driving device 15 on the basis of the elapsed time and the relationships.
In the configuration according to the first embodiment, for example, a holding apparatus in which heat is effectively transferred between a substrate and a holding member is provided. Hence, a holding apparatus in which the force for holding the substrate 2 on the base 11 and the shape and size of the substrate 2 are effectively maintained even if the liquid 12 evaporates is provided. Furthermore, a drawing apparatus including such a holding apparatus is provided.
The detector 18 is not limited to but may be a known length measuring device (length meter) that is capable of measuring the position of the side surface of the liquid 12. For example, an optical length measuring device such as a (length measuring) laser interferometer may be used.
In the configuration according to the second embodiment, for example, a holding apparatus in which heat is effectively transferred between a substrate and a holding member is provided. Hence, a holding apparatus in which the force for holding the substrate 2 on the base 11 and the shape and size of the substrate 2 are effectively maintained even if the liquid 12 evaporates is provided. Furthermore, a drawing apparatus including such a holding apparatus is provided.
A method of manufacturing an article according to a third embodiment of the present invention is suitable for manufacturing articles such as microdevices, including semiconductor devices, and devices having microstructures. The method includes forming a latent pattern in a photoresist on a substrate (performing drawing on a substrate) by using the above drawing apparatus, and developing the latent pattern thus formed on the substrate. The method further includes other known steps (oxidization, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, and so forth). The method of manufacturing an article according to the third embodiment is superior to known methods in terms of at least one of the performance, the quality, the ease of production, and the costs of production of the article.
While several embodiments of the present invention have been described above, the following exemplary modifications and changes can be made thereto.
As illustrated in
In such a case, the regulator that generates the constant force may be configured as illustrated in
In some of the above configurations, the top surface of the base 11 is configured such that the capillary pressure of the liquid 12 provided in the gap between the substrate 2 and the base 11 increases with the reduction in the amount of liquid 12 in the gap. Furthermore, the regulator is configured such that a force acting in a direction opposite to a direction in which the capillary pressure acts is applied to the surface of the liquid 12 provided in the gap. In other ones of the above configurations, the top surface of the base 11 is configured such that the gap between the base 11 and the substrate 2 or the angle of contact between the substrate 2 and the liquid 12 is reduced from the periphery thereof toward the center thereof. In a case where the liquid 12 is contained in a plurality of dispersed areas defined in the gap between the substrate 2 and the base 11, the top surface of the base 11 may also be configured as described above in each area of the base 11 that is in contact with the liquid 12 provided in the gap.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
This application claims the benefit of Japanese Patent Application No. 2011-272505 filed Dec. 13, 2011, which is hereby incorporated by reference herein in its entirety.
Number | Date | Country | Kind |
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2011-272505 | Dec 2011 | JP | national |