INSPECTION APPARATUS, MANUFACTURING METHOD OF INTEGRATED CIRCUIT, AND INSPECTION METHOD

Abstract

An inspection apparatus for inspecting a semiconductor workpiece includes a testing stage, a first seal member, a testing clamp, a second seal member, a semiconductor workpiece, and a transducer. The testing stage has a cavity. The first seal member is disposed in the cavity. The first seal member is attached to a sidewall of the cavity. The testing clamp is movably coupled to the testing stage. The second seal member is attached to the testing clamp. The semiconductor workpiece is held between the testing stage and the testing clamp by the first seal member and the second seal member. The transducer is movably disposed above the testing stage.

Description

Claims

1. An inspection apparatus for inspecting a semiconductor workpiece, comprising: a testing stage having a cavity;a first seal member disposed in the cavity, wherein the first seal member is attached to a sidewall of the cavity;a testing clamp movably coupled to the testing stage;a second seal member attached to the testing clamp;a semiconductor workpiece held between the testing stage and the testing clamp by the first seal member and the second seal member; anda transducer movably disposed above the testing stage.

2. The inspection apparatus of claim 1, wherein the first seal member and the second seal member respectively exhibits a ring shape from a top view.

3. The inspection apparatus of claim 1, further comprising: a testing clamp guiding rail coupled to the testing clamp, wherein the testing clamp performs reciprocate movement along a lengthwise direction of the testing clamp guiding rail; anda transducer guiding rail coupled to the transducer, wherein the transducer performs reciprocate movement along a lengthwise direction and a widthwise direction of the transducer guiding rail.

4. The inspection apparatus of claim 3, further comprising a dryer coupled to the transducer guiding rail, wherein the dryer performs reciprocate movement along the lengthwise direction and the widthwise direction of the transducer guiding rail.

5. The inspection apparatus of claim 1, further comprising: a testing tank for accommodating a testing fluid, the testing stage, and the testing clamp; andfasteners, detachably fastening the testing clamp onto the testing stage.

6. The inspection apparatus of claim 1, further comprising a drying stage configured to spin dry the semiconductor workpiece.

7. A manufacturing method of an integrated circuit, comprising: providing a semiconductor wafer having an active surface and a rear surface opposite to the active surface;pre-bonding dies onto the semiconductor wafer, wherein each die has an active surface and a rear surface opposite to the active surface, and the active surface of the semiconductor wafer and the active surfaces of the dies form a bonding surface;performing a first inspection process for inspecting the bonding surface, comprising: transferring the semiconductor wafer and the dies onto a first testing stage, where the first testing stage has a cavity and the rear surfaces of the dies face the cavity;clamping the semiconductor wafer and the dies to the first testing stage by a testing clamp;inspecting the bonding surface by a first transducer, wherein a first testing fluid is provided between the first transducer and the rear surface of the semiconductor wafer; anddrying the rear surface of the semiconductor wafer;performing a thermal process on the dies and the semiconductor wafer after the first inspection process, so as to securely bond the dies onto the semiconductor wafer;forming an encapsulant on the semiconductor wafer to laterally encapsulate the dies;forming an interconnection structure and conductive vias over the rear surface of the semiconductor wafer; andsingulating the semiconductor wafer and the encapsulant.

8. The method of claim 7, further comprising a second inspection process for inspecting the bonding surface, comprising: transferring the semiconductor wafer and the dies onto a second testing stage, wherein the rear surface of the semiconductor wafer faces the second testing stage; andinspecting the bonding surface by a second transducer, wherein a second testing fluid is provided between the second transducer and the rear surface of the dies.

9. The method of claim 8, wherein the second inspection process is performed after the thermal process.

10. The method of claim 7, wherein the first testing fluid is ejected from the first transducer.

11. The method of claim 7, wherein after the semiconductor wafer and the dies are clamped to the first testing stage, an air gap is formed between the semiconductor wafer and the first testing stage, and the dies are sealed between the semiconductor wafer and the first testing stage and are surrounded by the air gap.

12. The method of claim 7, wherein the first testing stage and the testing clamp are located in a testing tank, and the first inspection process further comprises: after the semiconductor wafer and the dies are clamped to the first testing stage by the testing clamp, securely fixing the testing clamp onto the first testing stage through fasteners such that an air gap is formed between the semiconductor wafer and the first testing stage, and the dies are sealed between the semiconductor wafer and the first testing stage and are surrounded by the air gap; andfilling the testing tank with the first testing fluid.

13. The method of claim 7, wherein drying the rear surface of the semiconductor wafer comprises: blow drying the rear surface of the semiconductor wafer when the semiconductor wafer and the dies are clamped on the first testing stage;after blow drying the rear surface of the semiconductor wafer, transferring the semiconductor wafer and the dies onto a drying stage; andspin drying the semiconductor wafer and the dies.

14. The method of claim 7, wherein the first testing fluid comprises water.

15. An inspection method, comprising: providing a semiconductor workpiece, wherein the semiconductor workpiece comprises a semiconductor wafer and dies, the semiconductor wafer has an active surface and a rear surface opposite to the active surface, and the dies are bonded onto the active surface of the semiconductor wafer; anddetecting a defect of a bonding surface between the dies and the semiconductor wafer of the semiconductor workpiece using an inspection apparatus, wherein the inspection apparatus comprises a testing stage, a first seal member, a testing clamp, a second seal member, and a transducer, the testing stage has a cavity, the first seal member is disposed in the cavity, the second seal member is attached to the testing clamp, and detecting the defect comprises: transferring the semiconductor workpiece onto the testing stage, wherein the active surface of the semiconductor wafer is in contact with the first seal member;clamping the semiconductor workpiece to the testing stage by the testing clamp, wherein the rear surface of the semiconductor wafer is in contact with the second seal member; andinspecting the bonding surface by the transducer while providing a testing fluid between the transducer and the semiconductor workpiece.

16. The method of claim 15, wherein detecting the defect further comprises: blow drying the rear surface of the semiconductor wafer after the bonding surface is inspected.

17. The method of claim 16, wherein the inspection apparatus further comprises a drying stage adjacent to the testing stage, and detecting the defect further comprises: transferring the semiconductor workpiece onto a drying stage after the rear surface of the semiconductor wafer is blow dried; andspin drying the semiconductor workpiece.

18. The method of claim 15, wherein the testing fluid is ejected from the transducer.

19. The method of claim 15, wherein the inspection apparatus further comprises a testing tank, the testing stage and the testing clamp are located in the testing tank, and detecting the defect further comprises: after the semiconductor workpiece is clamped to the testing stage by the testing clamp, securely fixing the testing clamp onto the testing stage through fasteners such that an air gap is formed between the semiconductor wafer and the testing stage, and the dies are sealed between the semiconductor wafer and the testing stage and are surrounded by the air gap; andfilling the testing tank with the testing fluid.

20. The method of claim 15, wherein the testing fluid comprises water.