Claims
- 1. A bonding apparatus comprising:
- a base for supporting a printed circuit board;
- an atmosphere cover which has a concavity covering a semiconductor device mounted on the printed circuit board and which is formed of laser light transmitting material;
- driving means for moving the atmosphere cover upwards and downwards related to the base;
- pressing means provided in the atmosphere cover for pressing the semiconductor device toward the printed circuit board;
- atmosphere gas supplying means for supplying atmosphere gas into the concavity; and
- laser heating means for irradiating laser light through the atmosphere cover to bonding agent applied on junctions of the semiconductor device and the printed circuit board and heating and fusing the bonding agent.
- 2. A bonding apparatus in accordance with claim 1, wherein said laser light transmitting material is quartz.
- 3. A bonding apparatus in accordance with claim 1, wherein said atmosphere cover has a vertical bore in its center, and said pressing means comprise
- a pressing weight moving up and down through the bore;
- a supporting shaft for supporting the pressing weight; and
- a linear motor provided in the atmosphere cover for applying pressing force downwards to the supporting shaft.
- 4. A bonding apparatus in accordance with claim 1, wherein said bore is tapered in its lower portion while said pressing weight has such contours that it fits in the tapered portion of the bore.
- 5. A bonding apparatus in accordance with claim 1, wherein said atmosphere gas is nitride gas or a mixed gas of nitride gas with hydrogen gas.
- 6. A bonding apparatus in accordance with claim 1, wherein said atmosphere cover has a gas conduit connecting the outside to said concavity, and said atmosphere gas supplying means comprises:
- a tube connected to said gas conduit;
- an electromagnetic valve connected to the tube; and
- a gas bomb connected to the electromagnetic valve.
- 7. A bonding apparatus in accordance with claim 1, further comprising control means for controlling the operation of each of said driving means, said pressing means, said atmosphere gas supplying means and said laser heating means.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2-312194 |
Nov 1990 |
JPX |
|
Parent Case Info
This application is a division of application Ser. No. 07/780,495 filed Oct. 22, 1991, now U.S. Pat. No. 5,250,781.
US Referenced Citations (6)
Foreign Referenced Citations (4)
Number |
Date |
Country |
3238350A1 |
Jul 1982 |
DEX |
3701013C2 |
Mar 1987 |
DEX |
284892 |
Nov 1988 |
JPX |
268496 |
Nov 1990 |
JPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
780495 |
Oct 1991 |
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