Claims
- 1. The combination of a semiconductor die and a leadframe having a die mount pad thereon, comprising:
- a semiconductor die mounted on a metal die mount pad forming part of the leadframe;
- a self supporting contact area on die mount pad, formed from a part of the die mount pad raised above the semiconductor die; and
- a wire forming an electrical connection between the semiconductor die and said self supporting contact area on the die mount pad.
- 2. The combination according to claim 1, wherein the contact area is formed by stamping the contact area from the metal of the die mount pad.
- 3. The combination according to claim 2, wherein the contact area forms a pedestal with a contact area on the top thereon.
- 4. The combination according to claim 3 wherein the top of the pedestal is raised above one surface of the die mount pad from 0.005 inch to 0.2 inch.
Parent Case Info
This application is a continuation of application Ser. No. 07/7,370, filed Oct. 18, 1990, now abandoned.
US Referenced Citations (3)
Continuations (1)
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Number |
Date |
Country |
Parent |
600370 |
Oct 1990 |
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