Claims
- 1. A semiconductor integrated circuit chip capable of conductive attachment to a receiving surface comprising:
- a silicon chip body having at least one surface free of silicon dioxide,
- an alloy of aluminum and gold on said silicon dioxide free surface, and
- a gradient of gold with traces of aluminum extending into the silicon chip body adjacent to said silicon dioxide free surface.
- 2. The semiconductor integrated circuit chip of claim 1 wherein a conductive polymer layer is contacted to the alloy surface.
Parent Case Info
This is a continuation of copending application Ser. No. 278,829 filed June 29, 1981 now abandoned, which in turn was a division of application Ser. No. 959,344 filed Nov. 9, 1978, now U.S. Pat. No. 4,293,587 issued Oct. 6, 1981.
Foreign Referenced Citations (1)
Number |
Date |
Country |
48-13265 |
Apr 1973 |
JPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
959344 |
Nov 1978 |
|
Continuations (1)
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Number |
Date |
Country |
Parent |
278829 |
Jun 1981 |
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