Claims
- 1. A manufacturing apparatus of a semiconductor device, comprising:
an introducing section which introduces a transfer box holding a semiconductor substrate therein; a process section which takes in the semiconductor substrate put in the introducing section and applies a processing to the semiconductor substrate; and a withdrawing section which is arranged on a surface differing from the surface on which the introducing section is arranged and withdraws the transfer box holding the semiconductor substrate discharged from the process section.
- 2. The manufacturing apparatus of a semiconductor device according to claim 1, further comprising:
a reading apparatus which is mounted on the introducing section and reads the information on the semiconductor substrate put in the introducing section from a recording medium mounted on the transfer box; and a writing apparatus which is mounted on the withdrawing section and writes the information read by the reading apparatus and the information on the processing performed in the process section in a recording medium attached to the transfer box withdrawn from the withdrawing section.
- 3. The manufacturing apparatus of a semiconductor device according to claim 1,
wherein the information on the semiconductor substrate includes at least one of a discriminating code of the semiconductor substrate, the situation of the manufacturing process, and a transfer instructing information to the next process step.
- 4. A manufacturing system of a semiconductor device, comprising:
a plurality of manufacturing apparatuses of a semiconductor device each including an introducing section which introduces a transfer box holding a semiconductor substrate therein, a process section which takes in the semiconductor substrate put in the introducing section and applies a processing to the semiconductor substrate, and a withdrawing section which withdraws the transfer box holding the semiconductor substrate discharged from the process section, the withdrawing section of at least one of the manufacturing apparatuses being arranged to face the introducing section of the adjacent manufacturing apparatus, and the withdrawing section and the introducing section of at least one of the manufacturing apparatuses being arranged on different surfaces of the manufacturing apparatus.
- 5. The manufacturing system of a semiconductor device according to claim 4, further comprising:
a reading apparatus which is mounted on the introducing section and reads the information on the semiconductor substrate put in the introducing section from a recording medium mounted on the transfer box; and a writing apparatus which is mounted on the withdrawing section and write the information read by the reading apparatus and the information on the processing performed in the manufacturing apparatus in a recording medium attached to the transfer box withdrawn from the withdrawing section.
- 6. The manufacturing system of a semiconductor device according to claim 5,
wherein the information on the semiconductor substrate includes at least one of a discriminating code of the semiconductor substrate, the situation of the manufacturing process, and a transfer instructing information to the next process step.
- 7. A manufacturing system of a semiconductor device, comprising:
a first manufacturing apparatus of a semiconductor device including a process section which applies a prescribed processing to a semiconductor substrate, and a withdrawing section which withdraws a transfer box of a first cleanliness holding the semiconductor substrate discharged from the process section; a second manufacturing apparatus of a semiconductor device including an introducing section which is arranged to face the withdrawing section of the first manufacturing apparatus and receives the transfer box of the first cleanliness holding a semiconductor substrate, a process section which takes in the semiconductor substrate put on the introducing section and applies a prescribed treatment to the semiconductor substrate, and a withdrawing section which is arranged on the surface differing from the surface on which the introducing section is arranged and withdraws the transfer box having a second cleanliness differing from the first cleanliness and holding the semiconductor substrate withdrawn from the process section; and a third manufacturing apparatus of a semiconductor device including an introducing section which is arranged to face the withdrawing section of the second manufacturing apparatus and receives the transfer box of the second cleanliness holding a semiconductor substrate, and a process section which takes in the semiconductor substrate put on the introducing section and applies a prescribed processing to the semiconductor substrate, the transfer box reciprocated between the first and second manufacturing apparatuses substantially having the first cleanliness, and the transfer box reciprocated between the second and third manufacturing apparatuses substantially having the second cleanliness.
- 8. The manufacturing system of a semiconductor device according to claim 7, further comprising:
a first manufacturing process stage of a semiconductor device in which a plurality of the first manufacturing apparatuses is arranged; a second manufacturing process stage of a semiconductor device in which a plurality of the second manufacturing apparatuses is arranged; and a third manufacturing process stage of a semiconductor device in which a plurality of the third manufacturing apparatuses is arranged, the transfer box reciprocated between the first and second manufacturing process stages substantially having the first cleanliness, and the transfer box reciprocated between the second and third manufacturing process stages substantially having the second cleanliness.
- 9. The manufacturing system of a semiconductor device according to claim 7,
wherein at least one of the second manufacturing apparatuses is a cleaning apparatus which washes the semiconductor substrate processed in the first manufacturing apparatus; and the transfer box reciprocated between the second and third manufacturing apparatuses has the second cleanliness higher than the first cleanliness so as to maintain the cleanliness on the surface of the semiconductor substrate after the washing treatment performed in the cleaning apparatus.
- 10. The manufacturing system of a semiconductor device according to claim 7,
wherein each of the first to third manufacturing apparatus comprises:
a reading apparatus which is mounted on the introducing section and reads the information on the semiconductor substrate put in the introducing section from a recording medium mounted on the transfer box; and a writing apparatus which is mounted on the withdrawing section and writes the information read by the reading apparatus and the information on the processing performed in the manufacturing apparatus in a recording medium attached to the transfer box withdrawn through the withdrawing section.
- 11. The manufacturing system of a semiconductor device according to claim 7, further comprising
a film-deposition apparatus including an introducing section and a process section, wherein the first manufacturing apparatus is a lithography apparatus which applies a lithography treatment to the semiconductor substrate; the second manufacturing apparatus is one of an etching apparatus and an ion implantation apparatus, to respectively applies an etching treatment and an ion implantation treatment on the semiconductor substrate subjected to the lithography treatment, one of the etching apparatus and the ion implantation apparatus having the withdrawing section formed on a surface opposite to the surface on which the introducing section is arranged; the third manufacturing apparatus is a cleaning apparatus which washes the semiconductor substrate subjected to one of the etching treatment and the ion implantation treatment and further comprises a withdrawing section arranged on a surface opposite to the surface on which the introducing section is arranged, a transfer box having a third cleanliness differing from the second cleanliness and holding the semiconductor substrate withdrawn from the process section being withdrawn onto the withdrawing section; the introducing section of the film-deposition apparatus is arranged on the surface facing the withdrawing section of the cleaning section and receives the transfer box of the third cleanliness holding the semiconductor substrate washed in the cleaning apparatus; and the process section of the film-deposition apparatus takes in the semiconductor substrate put in the introducing section and applies a film-deposition treatment to the semiconductor substrate.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2001-092543 |
Mar 2001 |
JP |
|
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This is a Continuation Application of PCT Application No. PCT/JP02/02892, filed Mar. 26, 2002, which was not published under PCT Article 21(2) in English.
Continuations (1)
|
Number |
Date |
Country |
Parent |
PCT/JP02/02892 |
Mar 2002 |
US |
Child |
10305166 |
Nov 2002 |
US |