MASK STRUCTURE FOR MANUFACTURE OF TRENCH TYPE SEMICONDUCTOR DEVICE

Abstract

A mask structure and process for forming trenches in a silicon carbide or other wafer, and for implanting impurities into the walls of the trenches using the same mask where the mask includes a thin aluminum layer and a patterned hard photoresist mask. A thin LTO oxide may be placed between the metal layer and the hard photoresist mask.

Description

DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a small portion of a starting wafer 10 in cross section. In FIG. 1, the wafer 10 is SiC although other materials could be used. Where the device to be made is a JFET, the starting wafer has an N⁺ substrate drain body 11 which may have a thickness of about 350 μm and a concentration of about 1.8 E 18. An N⁺ buffer layer 12 is atop drain region 11 and an N type drift region 13 is atop the buffer layer. An N⁺ source region 14 is atop the drift layer 13.

The first process step is shown in FIG. 2 and comprises the formation of oxide 20 (for example, LTO) atop the wafer 10. Oxide 20 may have a thickness of about 0.8 μm. An Aluminum layer 21 is then deposited atop oxide 10 to a thickness of about 0.5 μm.

Other options for the layers 20 and 21 which reduce the total mask thickness are, for example, 0.1 to 1.0 μm oxide and 0.1 to 1.0 μm of aluminum or some other suitable metal.

Note that in some cases, the oxide barrier 20 may be completely removed.

Thereafter, a photoresist (PR) layer 30 (FIG. 3) is formed atop metal layer 21 and is marked and developed as shown, forming spaced etch windows 40 atop the layer 21.

Photo resist 30 is preferably a positive PR, and is employed in the novel hard mask structure of the invention for the subsequent trench/implant steps to be performed.

Thereafter, and as shown in FIG. 4, the metal layer 21 and oxide layer portions exposed by windows 40 are plasma etched to the SiC surface of wafer.

Finally, as shown in FIG. 5, a dry plasma etch is employed to etch spaced trenches 50 into the SiC drift layer 13.

Photo resist 40 may be removed and the remaining hard mask 20/21 is left in place for a subsequent ion implant into the trench walls of trenches 50.

The trench walls of trenches 50 may be vertical or may form an angle of 80° to 90° (vertical) to the wafer surface. That is, the walls of the trenches may be up to 10° C. to a vertical line through the center of the trench and perpendicular to the plane of the wafer.

Although the present invention has been described in relation to particular embodiments thereof, many other variations and modifications and other uses will become apparent to those skilled in the art. It is preferred, therefore, that the present invention be limited not by the specific disclosure herein.

Claims

1. A hard mask for processing a semiconductor wafer comprising a thin metal layer atop said wafer and a photoresist atop said metal layer.

2. The hard mask of claim 1, which includes an oxide layer between said metal layer and said wafer.

3. The hard mask of claim 1, wherein said wafer is silicon carbide.

4. The hard mask of claim 2, wherein said wafer is silicon carbide.

5. The hard mask of claim 1, wherein said mask defines a trench etch for forming a trench in said wafer and an ion implant for forming an implant into the walls of said trench.

6. The hard mask of claim 5, which includes an oxide layer between said metal layer and said wafer.

7. The hard mask of claim 5, wherein said wafer is silicon carbide.

8. The hard mask of claim 4, wherein said mask defines a trench etch for forming a trench in said wafer and an ion implant for forming an implant into the walls of said trench.

9. The hard mask of claim 5, wherein the walls of said trench form an angle of 0° to 10° to a vertical line through said trench which is perpendicular to the plane of said wafer.

10. The mask of claim 1, wherein said thin metal layer is aluminum having a thickness of from about 0.1 μm to about 1 μm.

11. The mask of claim 2, wherein said oxide layer has a thickness of about 0.1 μm to about 10 μm.

12. The mask of claim 10, wherein said oxide layer has a thickness of about 0.1 μm to about 1.0 μm.

13. The hard mask of claim 10, wherein said mask defines a trench etch for forming a trench in said wafer and an ion implant for forming an implant into the walls of said trench.

14. The hard mask of claim 11, wherein said mask defines a trench etch for forming a trench in said wafer and an ion implant for forming an implant into the walls of said trench.

15. The hard mask of claim 12, wherein said mask defines a trench etch for forming a trench in said wafer and an ion implant for forming an implant into the walls of said trench.

16. The process of forming a trench in a semiconductor wafer comprising the steps of depositing a thin metal layer atop a top surface of said wafer; depositing a photoresist atop said metal layer, applying a patterned mask atop said photoresist and photolithographically developing said photoresist to form a hard photoresist mask which contains windows corresponding the pattern of said mask, removing the areas of said thin metal layer which are exposed through said windows, and forming a trench into the top surface of said wafer which is exposed by the area removed from said metal layer.

17. The process of claim 16, which includes the step of forming a thin oxide layer atop said wafer surface and thereafter depositing said thin metal layer atop said thin oxide layer; and removing the areas of said thin oxide layer which are exposed after removal of corresponding areas of said thin metal layer before forming said trench.

18. The process of claim 16, wherein said thin metal layer is aluminum having a thickness of about 0.1 μm to about 1.0 μm.

19. The process of claim 17, wherein said oxide has a thickness of about 0.1 μm to 1.0 μm.

20. The process of claim 16, which includes the further step of implanting a controlled impurity into the walls of said trench and masking the surface of said wafer against the implant by the hard mask comprised of said photoresist and thin metal layer.

21. The process of claim 17, which includes the further step of implanting a controlled impurity into the walls of said trench and masking the surface of said wafer against the implant by the hard mask comprised of said photoresist and thin metal layer.

22. The mask of claim 1, wherein said thin metal layer is selected from the group consisting of aluminum, nickel, tungsten and tantalum and has a thickness of from about 0.1 μm to about 1.0 μm.

23. The process of claim 16, wherein said thin metal layer is selected from the group consisting of aluminum, nickel, tungsten and tantalum and has a thickness of from about 0.1 μm to about 1.0 μm.