Claims
- 1. Apparatus for use in the assembly of semiconductor devices, wherein a flexible film-supported interconnect pattern is bonded to a lead frame, comprising in combination:
- a. indexing means for moving the interconnect pattern into a position of alignment corresponding to its assembled relationship with the lead frame;
- b. a bonding tool having a tip geometry shaped to provide uniform simultaneous contact with each of a plurality of to-be-bonded locations on said lead frame;
- c. a punching means shaped to mate with said tip geometry;
- d. a shearing die located near said pattern and between said punching means and said bonding tool, aligned to coincide with said position of alignment of the pattern with the lead frame; and
- e. means for advancing said punching means in contact with the film supporting said interconnect pattern, then through said shearing die to a position which forces said pattern in contact with said lead frame, and which presses said frame against the bonding tool with a pressure sufficient to complete a bonding operation.
- 2. Apparatus as in claim 1 wherein the tip of said punching means includes means for holding the interconnect pattern in place thereon.
- 3. Apparatus as in claim 1 further including means for withdrawing said punch means, means for advancing another pattern into position, and means for advancing another lead frame into position.
Parent Case Info
This is a division, of application Ser. No. 320,349, filed Jan. 2, 1973, now patent No. 3,859,718.
US Referenced Citations (3)
Divisions (1)
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Number |
Date |
Country |
Parent |
320349 |
Jan 1973 |
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