Claims
- 1. A method of fabricating a programmable resistance memory element, comprising:providing a layer of a first material; forming a layer of a second material over said layer of said first material; forming a layer of a third material over said layer of said second material; forming an opening in said third material to expose said second material but without removing substantially any of said of said second material; forming a sidewall spacer of a fourth material on a sidewall surface of said opening of said third material; forming an opening in said second material to expose said first material; and forming a layer of a programmable resistance material in said opening of said second material, said programmable resistance material being in direct contact with said first material.
- 2. The method of claim 1, wherein said first material is a conductive material.
- 3. The method of claim 1, wherein second material is a dielectric material.
- 4. The method of claim 1, wherein said third material is a dielectric material or a polysilicon material.
- 5. The method of claim 1, wherein said fourth material is a dielectric material or a polysilicon material.
- 6. The method of claim 1, wherein said third material is the same as said fourth material.
- 7. The method of claim 1, wherein said opening in said second material is a hole.
- 8. The method of claim 1, wherein said programmable resistance material is a phase-change material.
- 9. The method of claim 1, wherein said programmable resistance material comprises a chalcogen element.
- 10. The method of claim 1, further comprising removing said fourth material before forming said layer of said programmable resistance material.
- 11. The method of claim 1, further comprising removing said fourth material and said third material before forming said layer of said programmable resistance material.
- 12. The method of claim 1, further comprising forming a layer of a conductive material over said programmable resistance material after forming said layer of said programmable resistance material.
RELATED APPLICATION INFORMATION
This application is a continuation-in-part of U.S. patent application Ser. No. 09/921,038, filed on Aug. 2, 2001, and incorporated by reference herein.
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
09/921038 |
Aug 2001 |
US |
Child |
09/955408 |
|
US |