the micromechanical device and the control or processing electronics being separate parts in the same package

Industry

CPC
B81B2207/012

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2207/00Micro-structural systems or auxiliary parts thereof

Current Industry

B81B2207/012the micromechanical device and the control or processing electronics being separate parts in the same package

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 12,157,667
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor device and sensor
- Patent number 12,140,430
- Issue date Nov 12, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideki Ueda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics package with vertically stacked MEMS device and co...
- Patent number 12,129,168
- Issue date Oct 29, 2024
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device for supporting MEMS and/or ASIC components
- Patent number 12,116,270
- Issue date Oct 15, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Ismael Brunner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor and package assembly thereof
- Patent number 12,091,312
- Issue date Sep 17, 2024
- Robert Bosch GmbH
- Ken Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
SOC PMUT suitable for high-density system integration, array chip,...
- Patent number 12,060,264
- Issue date Aug 13, 2024
- NANJING SHENGXI XINYING TECHNOLOGY CO., LTD
- Hui Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Waterproof MEMS button device, input device comprising the MEMS but...
- Patent number 12,050,102
- Issue date Jul 30, 2024
- STMicroelectronics S.r.l.
- Gabriele Gattere
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low-height optoelectronic modules and packages
- Patent number 12,037,238
- Issue date Jul 16, 2024
- ams Sensors Singapore Pte. Ltd.
- Javier Miguel Sànchez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a wafer connection
- Patent number 12,030,773
- Issue date Jul 9, 2024
- Robert Bosch GmbH
- Friedjof Heuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor integrated device with electrical contacts between st...
- Patent number 12,024,422
- Issue date Jul 2, 2024
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing device and method for manufacturing sensing device
- Patent number 12,024,420
- Issue date Jul 2, 2024
- Mitsumi Electric Co., Ltd.
- Etsuji Hayakawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing electronic devices and corresponding electr...
- Patent number 12,017,910
- Issue date Jun 25, 2024
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor module having conductive bonding members with varying meltin...
- Patent number 12,000,857
- Issue date Jun 4, 2024
- Seiko Epson Corporation
- Masayasu Sakuma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,973,048
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Nong Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Blood pressure detection device
- Patent number 11,944,412
- Issue date Apr 2, 2024
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for providing getters in microelectromechanical...
- Patent number 11,945,713
- Issue date Apr 2, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Signal processing circuit for triple-membrane MEMS device
- Patent number 11,932,533
- Issue date Mar 19, 2024
- Infineon Technologies AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heat dissipation system with microelectromechanical system (MEMS) f...
- Patent number 11,910,568
- Issue date Feb 20, 2024
- Cisco Technology, Inc.
- Joel Richard Goergen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ovenized MEMS
- Patent number 11,909,354
- Issue date Feb 20, 2024
- SiTime Corporation
- Carl Arft
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical sensor device having an ASIC chip integrated into a...
- Patent number 11,906,383
- Issue date Feb 20, 2024
- Robert Bosch GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capless semiconductor package with a micro-electromechanical system...
- Patent number 11,897,763
- Issue date Feb 13, 2024
- STMicroelectronics, Inc.
- Jefferson Sismundo Talledo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 11,897,759
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Po Chen Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Robust method for gyroscope drive amplitude measurement
- Patent number 11,867,509
- Issue date Jan 9, 2024
- Invensense, Inc.
- Damiano Milani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system (MEMS) sensor packages and methods fo...
- Patent number 11,851,322
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heterogenous integration of complementary metal-oxide-semiconductor...
- Patent number 11,845,653
- Issue date Dec 19, 2023
- MERIDIAN INNOVATION PTE LTD
- Wan Chia Ang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated piezoelectric microelectromechanical ultrasound transduc...
- Patent number 11,847,851
- Issue date Dec 19, 2023
- Invensense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with built-in vibration isolation, thermal st...
- Patent number 11,834,328
- Issue date Dec 5, 2023
- Invensense, Inc.
- Hamid Eslampour
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezoelectric anti-stiction structure for microelectromechanical sy...
- Patent number 11,834,325
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support structure for MEMS device with particle filter
- Patent number 11,807,521
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
COMBINED SOUND TRANSDUCER AND PRESSURE SENSOR PACKAGE
- Publication number 20240425363
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Bernhard Rieder
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OVER-THE-SINK DRYING ELEMENT
- Publication number 20240406640
- Publication date Dec 5, 2024
- DORAI HOME, INC.
- Jason Klug
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS COMPONENT WITH UPSIDE-DOWN CHIP
- Publication number 20240391759
- Publication date Nov 28, 2024
- Murata Manufacturing Co., Ltd.
- Sami NURMI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240383005
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC CIGARETTE
- Publication number 20240327202
- Publication date Oct 3, 2024
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Jinyang Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE, MICROPHONE UNIT AND ELE...
- Publication number 20240334132
- Publication date Oct 3, 2024
- GOERTEK MICROELECTRONICS INC.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A MEMS TRANSDUCER DEVICE WITH THIN MEMBRAN...
- Publication number 20240327203
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Mark Andrew SHAW
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS
- Publication number 20240272004
- Publication date Aug 15, 2024
- STMicroelectronics International N.V.
- Enri DUQI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240228264
- Publication date Jul 11, 2024
- STMicroelectronics International N.V.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE
- Publication number 20240199411
- Publication date Jun 20, 2024
- Qorvo US, Inc.
- Robertus Petrus Van Kampen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SIGNAL PROCESSING CIRCUIT FOR TRIPLE-MEMBRANE MEMS DEVICE
- Publication number 20240174514
- Publication date May 30, 2024
- INFINEON TECHNOLOGIES AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240140782
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- PO CHEN YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...
- Publication number 20240140783
- Publication date May 2, 2024
- STMicroelectronics S.r.l.
- Mark Andrew SHAW
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL DEVICE COMPRISING A HYDROGEN DRAINAGE LAYER
- Publication number 20240124296
- Publication date Apr 18, 2024
- ROBERT BOSCH GmbH
- Johannes Boy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...
- Publication number 20240124300
- Publication date Apr 18, 2024
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240109768
- Publication date Apr 4, 2024
- Advanced Semiconductor Engineering, Inc.
- Chieh-An YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Support Device for One or More MEMS Components
- Publication number 20240101412
- Publication date Mar 28, 2024
- ROBERT BOSCH GmbH
- Joachim Friedl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED MEMS ELECTROSTATIC MICRO-SPEAKER DEVICE AND METHOD
- Publication number 20240092629
- Publication date Mar 21, 2024
- Vibrant Microsystems Inc.
- Steven NASIRI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Haptic Device with Multiple Fluidically-Controlled Voids
- Publication number 20240019934
- Publication date Jan 18, 2024
- Meta Platforms Technologies, LLC
- Sean Jason Keller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PRESSURE SENSOR
- Publication number 20230417614
- Publication date Dec 28, 2023
- MEI Micro, Inc.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20230399225
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- PO CHEN YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED ULTRASONIC TRANSDUCERS
- Publication number 20230389897
- Publication date Dec 7, 2023
- Exo Imaging, Inc.
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC ANTI-STICTION STRUCTURE FOR MICROELECTROMECHANICAL SY...
- Publication number 20230373780
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE
- Publication number 20230357002
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE and fabrication metho...
- Publication number 20230348259
- Publication date Nov 2, 2023
- Vanguard International Semiconductor Corporation
- WAI MUN CHONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE WITH INTEGRATED DEVICE DIE AT LEAST DISPOSED WITHIN CARRIER
- Publication number 20230345182
- Publication date Oct 26, 2023
- Skyworks Solutions, Inc.
- Takanori Yasuda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE PACKAGE
- Publication number 20230345184
- Publication date Oct 26, 2023
- Fortemedia, Inc.
- Yen-Son Paul HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microphone
- Publication number 20230339744
- Publication date Oct 26, 2023
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Siewseong Tan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND SYSTEMS FOR FABRICATION OF ULTRASOUND TRANSDUCER DEVICES
- Publication number 20230303389
- Publication date Sep 28, 2023
- eXo Imaging, Inc.
- Liang WANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY

the micromechanical device and the control or processing electronics being separate parts in the same package

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Anti-stiction process for MEMS device

Sensor device and sensor

Microelectronics package with vertically stacked MEMS device and co...

Device for supporting MEMS and/or ASIC components

Bonded structures

Sensor and package assembly thereof

SOC PMUT suitable for high-density system integration, array chip,...

Waterproof MEMS button device, input device comprising the MEMS but...

Low-height optoelectronic modules and packages

Method for producing a wafer connection

Semiconductor integrated device with electrical contacts between st...

Sensing device and method for manufacturing sensing device

Method of manufacturing electronic devices and corresponding electr...

Sensor module having conductive bonding members with varying meltin...

Semiconductor package and method for manufacturing the same

Blood pressure detection device

Systems and methods for providing getters in microelectromechanical...

Signal processing circuit for triple-membrane MEMS device

Heat dissipation system with microelectromechanical system (MEMS) f...

Ovenized MEMS

Micromechanical sensor device having an ASIC chip integrated into a...

Capless semiconductor package with a micro-electromechanical system...

Semiconductor device and method for forming the same

Robust method for gyroscope drive amplitude measurement

Microelectromechanical system (MEMS) sensor packages and methods fo...

Heterogenous integration of complementary metal-oxide-semiconductor...

Integrated piezoelectric microelectromechanical ultrasound transduc...

Semiconductor package with built-in vibration isolation, thermal st...

Piezoelectric anti-stiction structure for microelectromechanical sy...

Support structure for MEMS device with particle filter

Patents Applicationslast 30 patents

COMBINED SOUND TRANSDUCER AND PRESSURE SENSOR PACKAGE

OVER-THE-SINK DRYING ELEMENT

MEMS COMPONENT WITH UPSIDE-DOWN CHIP

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

ELECTRONIC CIGARETTE

MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE, MICROPHONE UNIT AND ELE...

METHOD FOR MANUFACTURING A MEMS TRANSDUCER DEVICE WITH THIN MEMBRAN...

PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE

SIGNAL PROCESSING CIRCUIT FOR TRIPLE-MEMBRANE MEMS DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

MICROMECHANICAL DEVICE COMPRISING A HYDROGEN DRAINAGE LAYER

CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...

SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Support Device for One or More MEMS Components

INTEGRATED MEMS ELECTROSTATIC MICRO-SPEAKER DEVICE AND METHOD

Haptic Device with Multiple Fluidically-Controlled Voids

MEMS PRESSURE SENSOR

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

INTEGRATED ULTRASONIC TRANSDUCERS

PIEZOELECTRIC ANTI-STICTION STRUCTURE FOR MICROELECTROMECHANICAL SY...

PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE

MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE and fabrication metho...

PACKAGE WITH INTEGRATED DEVICE DIE AT LEAST DISPOSED WITHIN CARRIER

MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE PACKAGE

Microphone

METHODS AND SYSTEMS FOR FABRICATION OF ULTRASOUND TRANSDUCER DEVICES