Number | Name | Date | Kind |
---|---|---|---|
3320658 | Bolda et al. | May 1967 | |
3396894 | Ellis | May 1965 | |
3458925 | Napier et al. | Jan 1966 | |
3871015 | Lin et al. | Mar 1975 | |
4050621 | Bouley | Sep 1977 | |
4064552 | Angelucci et al. | Dec 1977 | |
4205099 | Jones et al. | May 1980 | |
4273859 | Mones | Jun 1981 | |
4354629 | Grassauer | Oct 1982 | |
4545610 | Lakritz et al. | Oct 1985 | |
4604644 | Beckham et al. | May 1986 | |
4605153 | Van Den Brekel et al. | Aug 1986 | |
4739917 | Baker | Apr 1988 | |
4761881 | Bora et al. | Aug 1988 | |
4774633 | Dehaine et al. | Sep 1988 | |
4914551 | Anschel et al. | Apr 1990 | |
4914814 | Behun et al. | Apr 1990 | |
4950623 | Dishon | Aug 1990 | |
4967950 | Legg et al. | Nov 1990 | |
5048747 | Clark et al. | Sep 1991 | |
5057969 | Ameen et al. | Oct 1991 |
Entry |
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IBM Technical Disclosure Bulletin, vol. 20, No. 12, May/1978, "Permalloy Solder Barrier For Devices With Gold Conductor Metallization", by Ahn et al. |
IBM Technical Disclosure Bulletin, vol. 32, No. 10B, Mar./1990, "Controlled C-4 Solder Joint Elongation For Improved Thermal-Mechanical Stress Relief", by Spalik. |