Phipps, Thesis: Design And Development Of Microswitches For Micro-Electro-Mechanical Relay Matrices, Air Force Inst. of Tech., Wright-Patterson AFB, OH School of Engineering, 1995. |
Yamagata, et al., A Micro Mobile Mechanism Using Thermal Expansion And Its Theoretical Analysis—A Comparison With Impact Drive Mechanism Using Piezoelectric Elements, Proceedings of the IEEE Micro Electro Mechanical Systems, 1994, pp. 142-147. |
Oh, et al., Thin Film Heater On A Thermally Isolated Microstructure, Smart Materials Fabrication and Materials for Micro-Electro-Mechanical Systems, 1992, pp. 277-282. |
Safranek, The Properties Of Electrodeposited Metals & Alloys, Amer. Electroplaters & Surface Finishers Society, 1986, pp. 295-315. |
Klassen, et al., Silicon Fusion Bonding And Deep Reactive Ion Etching; A New Technology For Microstructures, Transducers '95—Eurosensors IX, The 8th International Conference On Solid State Sensors And Actuators, and Eurosensors IX, Stockholm, Sweden, Jun. 25-29, 1995, pp. 556-559. |
Noworolski, et al., Fabrication Of SOI Wafers With Buried Cavities Using Silicon Fusion Bonding And Electrochemical Etchback, Transducers '95—Eurosensors IX, The 8th International Conference On Solid State Sensors And Actuators, and Eurosensors IX, Stockholm, Sweden, Jun. 25-29, 1995, pp. 71-74. |
Single Crystal Silicon Actuators And Sensors Based On Silicon Fusion Bonding Technology, Semi-Annual Progress Report 1, Advanced Research Projects Agency, Lucas NovaSensor, Contract No. DAL 01-94-C-3411, Apr.—Jul. 1994. |
Single Crystal Silicon Actuators And Sensors Based On Silicon Fusion Bonding Technology, Semi-Annual Progress Report 2, Advanced Research Projects Agency, Lucas NovaSensor, Contract No. DAL 01-94-C-3411, Jul., 1994—Jan. 1995. |
Single Crystal Silicon Actuators And Sensors Based On Silicon Fusion Bonding Technology, Semi-Annual Progress Report, Advanced Research Projects Agency, Lucas NovaSensor, Contract No. DAL 01-94-C-3411, Jan.—Jul. 1995. |
Single Crystal Silicon Actuators And Sensors Based On Silicon Fusion Bonding Technology, Semi-Annual Progress Report, Advanced Research Projects Agency, Lucas NovaSensor, Contract No. DAL 01-94-C-3411, Jan.—Aug. 1996. |
J.W. Judy, T. Tamagawa and D.L. Polia, Surface Micromachined Linear Thermal Microactuator, International Electron Devices Meeting 1990. Technical Digest (CAT. No. 90CH2865-4, Dec. 1990, pp. 629-632, New York, New York. |
Gary K. Fedder and Roger T. Howe, Multimode Digital Control of a Suspended Polysilicon Microstructure, Journal of Microelectromechanical Systems, Dec. 1996, pp. 283-297, vol. 5, No. 4. |
John H. Comtois and Victor M. Bright, Applications for surface-micromachined polysilicon thermal actuators and arrays, Sensors and Actuators, Jan. 1997, pp. 19-25, vol. 58, No. 1. |
Liwei LIN and Shiao-Hong LIN, Vertically driven mcroactuators by electrothermal buckling effects, Sensors and Actuators, Nov. 1998, pp. 35-39, vol. 71, No. 1-2. |