Claims
- 1. A substrate holding structure for a vacuum processing apparatus, which comprises:a vacuum processing chamber; a gas introduction device; and a specimen table for loading a substrate in said vacuum processing chamber, wherein said substrate is held by electrostatic attraction force on said specimen table and a heat conduction gas is introduced between said substrate and said specimen table to control the temperature of said substrate, wherein said specimen table includes a ring-shaped protruded portion having a smooth surface disposed at a position corresponding to the periphery of said substrate and plural contact holding portions disposed between a position corresponding to the periphery of said substrate and plural contact holding portions disposed between a position corresponding to the center of said substrate and a position corresponding to the periphery of said substrate, and further includes an electrostatic attraction device for fixing said substrate by bringing said substrate into contact with said ring-shaped protrusion and said contact holding portions, wherein said electrostatic attraction device includes a dielectric substance affixed or formed on the surface of said specimen table including said ring-shaped protrusion and said contact holding portions and has a function of contacting the surface of said ring-shaped protrusion and said contact holding portions with the back surface of said substrate by electrostatic attraction force, wherein said contact holding portion has a through hole and a pin for pushing-up said substrate disposed in said through hole, and wherein a gas supply hole as the gas introduction device is disposed at a position remote from said through hole of said contact holding portion of said specimen table.
- 2. A substrate holding structure for a vacuum processing apparatus, comprising:a vacuum processing chamber; a gas introduction device; and a specimen table for loading a substrate in said vacuum processing chamber, wherein said substrate is held by electrostatic attraction force on said specimen table and a heat conduction gas is introduced between said substrate and said specimen table to control the temperature of said substrate, wherein said specimen table includes a ring-shaped protruded portion having a smooth surface disposed at a position corresponding to the periphery of said substrate and plural contact holding portions disposed between a position corresponding to the center of said substrate and plural contact holding portions disposed between a position corresponding to the center of said substrate and a position corresponding to the periphery of said substrate, and further includes an electrostatic attraction device for fixing said substrate by bringing said substrate into contact with said ring-shaped protrusion and said contact holding portions, wherein said electrostatic attraction device includes a dielectric substance affixed or formed on the surface of said specimen table including said ring-shaped protrusion and said contact holding portions and has a function of contacting the surface of said ring-shaped protrusion and said contact holding portions with the back surface of said substrate by electrostatic attraction force, wherein a gas supply hole as the gas introduction device is disposed at a non-contact portion of said specimen table with said substrate, and wherein a pin for pushing up said substrate is disposed at a position remote from said gas supply hole of said specimen table.
Priority Claims (2)
Number |
Date |
Country |
Kind |
5-230187 |
Sep 1993 |
JP |
|
6-48286 |
Mar 1994 |
JP |
|
CROSS-REFERENCE TO RELATED APPLICATIONS
This is a divisional of application Ser. No. 09/849,405, filed May 7, 2001 (now U.S. Pat. No. 6,524,428); which is a continuation of Ser. No. 09/778,780, filed Feb. 8, 2001 (now U.S. Pat. No. 6,544,379); which is a continuation of application Ser. No. 09/109,178, filed on Jul. 2, 1998 (now U.S. Pat. No. 6,336,991); which is a continuation of application Ser. No. 08/904,623, filed on Aug. 1, 1997 (now U.S. Pat. No. 5,961,774); which is a continuation of application Ser. No. 08/670,180, filed on Jun. 20, 1996 (now U.S. Pat. No. 6,048,434); which is a divisional of application Ser. No. 08/307,238, filed on Sep. 16, 1994 (now U.S. Pat. No. 5,792,304), the entire disclosures of which are hereby incorporated by reference.
US Referenced Citations (28)
Foreign Referenced Citations (25)
Number |
Date |
Country |
074 691 |
Mar 1983 |
EP |
0357424 |
Aug 1989 |
EP |
357 424 |
Jul 1990 |
EP |
452 222 |
Nov 1991 |
EP |
0 644 578 |
Mar 1995 |
EP |
58-32410 |
Feb 1983 |
JP |
62-193141 |
Aug 1987 |
JP |
01-251735 |
Oct 1989 |
JP |
02-120832 |
May 1990 |
JP |
02-135753 |
May 1990 |
JP |
03-102820 |
Apr 1991 |
JP |
04-003927 |
Jan 1992 |
JP |
04-211146 |
Aug 1992 |
JP |
04-249341 |
Sep 1992 |
JP |
05-006933 |
Jan 1993 |
JP |
05-047906 |
Feb 1993 |
JP |
5226292 |
Mar 1993 |
JP |
05-175318 |
Jul 1993 |
JP |
05-226292 |
Sep 1993 |
JP |
05-234944 |
Sep 1993 |
JP |
06 44 578 |
Mar 1995 |
JP |
7-94496 |
Apr 1995 |
JP |
7-263528 |
Oct 1995 |
JP |
2000-114359 |
Apr 2001 |
JP |
2001-223258 |
Aug 2001 |
JP |
Non-Patent Literature Citations (4)
Entry |
IBM Technical Disclosure Bulletin, “Electrostatic Wafer Holder for Wafer Cooling During Reactive Ion Etching,” vol. 31, No. 1, Jun. 1988. |
“Vakuumtechnik” W. Pupp—H.K. Hartmann 1991. |
05-006933—English translation of specification and drawings. |
3-169041—English translation of specification and drawings. |
Continuations (4)
|
Number |
Date |
Country |
Parent |
09/778780 |
Feb 2001 |
US |
Child |
09/849405 |
|
US |
Parent |
09/109178 |
Jul 1998 |
US |
Child |
09/778780 |
|
US |
Parent |
08/904623 |
Aug 1997 |
US |
Child |
09/109178 |
|
US |
Parent |
08/670180 |
Jun 1996 |
US |
Child |
08/904623 |
|
US |