Calcium [Ca]

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H01L2924/0102

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/0102Calcium [Ca]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods for forming metal gapfill with low resistivity
- Patent number 12,272,659
- Issue date Apr 8, 2025
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure with memory and metal...
- Patent number 12,272,586
- Issue date Apr 8, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for forming a semiconductor device including forming a first...
- Patent number 12,266,612
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package process and package structure
- Patent number 12,266,632
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-end-of-line strap for standard cell
- Patent number 12,261,113
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Hung Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 12,261,074
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metallization of integrated circuit packages
- Patent number 12,261,123
- Issue date Mar 25, 2025
- Advanced Technical Ceramics Company
- Aaron Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating a semiconductor device
- Patent number 12,261,144
- Issue date Mar 25, 2025
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure comprising via structure and redist...
- Patent number 12,255,166
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Neng-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices in semiconductor package cavities
- Patent number 12,255,115
- Issue date Mar 18, 2025
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 12,255,168
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding using metastable gas atoms
- Patent number 12,245,379
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding with passivated copper-based contacting m...
- Patent number 12,245,380
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding with passivated nickel-based contacting m...
- Patent number 12,245,381
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,243,765
- Issue date Mar 4, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit package having wirebonded multi-die stack
- Patent number 12,237,305
- Issue date Feb 25, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,237,239
- Issue date Feb 25, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Khim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-device graded embedding package substrate and manufacturing m...
- Patent number 12,230,581
- Issue date Feb 18, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die connection system and method
- Patent number 12,218,093
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds for quantum computing systems
- Patent number 12,218,091
- Issue date Feb 4, 2025
- Google LLC
- Zhimin Jamie Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resin composition, resin sheet, cured film, method for producing cu...
- Patent number 12,210,285
- Issue date Jan 28, 2025
- Toray Industries, Inc.
- Keika Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,211,813
- Issue date Jan 28, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with intermetallic-compound solder-joint comp...
- Patent number 12,206,056
- Issue date Jan 21, 2025
- Electronics and Telecommunications Research Institute
- Kwang-Seong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate and preparation method thereof, and display appar...
- Patent number 12,199,081
- Issue date Jan 14, 2025
- BOE Technology Group Co., Ltd.
- Wenqu Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 12,183,651
- Issue date Dec 31, 2024
- Amkor Technology Japan, Inc.
- Masao Hirobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 12,154,823
- Issue date Nov 26, 2024
- Renesas Electronics Corporation
- Katsuhiko Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,154,878
- Issue date Nov 26, 2024
- Intel Corporation
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 12,154,845
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPONENT AND FORMING METHOD THEREOF
- Publication number 20250118695
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-WEI PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS
- Publication number 20250118641
- Publication date Apr 10, 2025
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR IMPROVING EMBEDDED SUBSTRATE THERMALS
- Publication number 20250112113
- Publication date Apr 3, 2025
- ADVANCED MICRO DEVICES, INC.
- Sriram Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING
- Publication number 20250112124
- Publication date Apr 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE, METHOD OF MANUFACTURING AN ELEMENT PACKAGE AND...
- Publication number 20250112098
- Publication date Apr 3, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-TO-DIE INPUT/OUTPUT SIGNAL ROUTING UTILIZING OPPOSING DIE SURFA...
- Publication number 20250112205
- Publication date Apr 3, 2025
- Intel Corporation
- Prashant Majhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF FABRICATING THE SAME
- Publication number 20250105117
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Sangseok HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20250105172
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250096057
- Publication date Mar 20, 2025
- STMicroelectronics International N.V.
- Michael DE CRUZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
- Publication number 20250087563
- Publication date Mar 13, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME AND MANU...
- Publication number 20250087565
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Sehoon JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079254
- Publication date Mar 6, 2025
- Siliconware Precision Industries Co., Ltd.
- Po-Yuan SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH A COOLING...
- Publication number 20250079263
- Publication date Mar 6, 2025
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Face-Up Wafer-Level Packa...
- Publication number 20250079380
- Publication date Mar 6, 2025
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...
- Publication number 20250079354
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Steven Sze Hang Poon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079369
- Publication date Mar 6, 2025
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079251
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20250079267
- Publication date Mar 6, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YAN-WEI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250079403
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR CHIP AND A CONDUCTI...
- Publication number 20250079377
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Junghoo Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Switches in Interconnect Structures and the Method Forming th...
- Publication number 20250070011
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC WITH HEAT DISSIPATION STRUCTURE AND WARPAGE CONTROL
- Publication number 20250069985
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DEVICE WITH AIR GAP AND METHODS OF FORMING SAME
- Publication number 20250070045
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062265
- Publication date Feb 20, 2025
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- YUEH-MING TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20250054885
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Hsiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE, METHOD FOR MANUFA...
- Publication number 20250054830
- Publication date Feb 13, 2025
- Mitsubishi Electric Corporation
- Riki KAJIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING DIES ARRANGED FACE-TO-FACE
- Publication number 20250054912
- Publication date Feb 13, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Julius Kovats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250046653
- Publication date Feb 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20250046671
- Publication date Feb 6, 2025
- Fuji Electric Co., Ltd.
- Koji OSAKI
- H01 - BASIC ELECTRIC ELEMENTS

Calcium [Ca]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for forming metal gapfill with low resistivity

3D semiconductor memory device and structure with memory and metal...

Method for forming a semiconductor device including forming a first...

Package process and package structure

Middle-end-of-line strap for standard cell

Info structure with copper pillar having reversed profile

Selective metallization of integrated circuit packages

Semiconductor device and method for fabricating a semiconductor device

Semiconductor package structure comprising via structure and redist...

Electronic devices in semiconductor package cavities

Electronic device with multi-layer contact and system

Thermocompression bonding using metastable gas atoms

Thermocompression bonding with passivated copper-based contacting m...

Thermocompression bonding with passivated nickel-based contacting m...

3D semiconductor device and structure with metal layers and memory...

Integrated circuit package having wirebonded multi-die stack

Semiconductor device and manufacturing method thereof

Multi-device graded embedding package substrate and manufacturing m...

Semiconductor die connection system and method

Superconducting bump bonds for quantum computing systems

Resin composition, resin sheet, cured film, method for producing cu...

Package-on-package assembly with wire bond vias

Semiconductor structure and manufacturing method thereof

Semiconductor package with intermetallic-compound solder-joint comp...

Display substrate and preparation method thereof, and display appar...

Semiconductor device

Semiconductor device

Semiconductor device and a method of manufacturing the same

Semiconductor device

Semiconductor package with nickel-silver pre-plated leadframe

Patents Applicationslast 30 patents

PACKAGE COMPONENT AND FORMING METHOD THEREOF

PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

SYSTEMS AND METHODS FOR IMPROVING EMBEDDED SUBSTRATE THERMALS

DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING

PACKAGING SUBSTRATE, METHOD OF MANUFACTURING AN ELEMENT PACKAGE AND...

DIE-TO-DIE INPUT/OUTPUT SIGNAL ROUTING UTILIZING OPPOSING DIE SURFA...

SEMICONDUCTOR PACKAGES AND METHOD OF FABRICATING THE SAME

Semiconductor Device and Method

ELECTRONIC COMPONENT

SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME

WIRING STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME AND MANU...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH A COOLING...

Semiconductor Device and Method of Making Face-Up Wafer-Level Packa...

LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR CHIP AND A CONDUCTI...

Power Switches in Interconnect Structures and the Method Forming th...

3DIC WITH HEAT DISSIPATION STRUCTURE AND WARPAGE CONTROL

PACKAGED DEVICE WITH AIR GAP AND METHODS OF FORMING SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE, METHOD FOR MANUFA...

INTEGRATED CIRCUIT DEVICE INCLUDING DIES ARRANGED FACE-TO-FACE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...