Calcium [Ca]

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H01L2924/0102

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/0102Calcium [Ca]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic devices with through-substrate interconnects and as...
- Patent number 12,368,096
- Issue date Jul 22, 2025
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated silver-based contacting m...
- Patent number 12,363,878
- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,362,298
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a fan-out semiconductor assembly with an intermedi...
- Patent number 12,362,322
- Issue date Jul 15, 2025
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 12,362,219
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated gold contacting metal
- Patent number 12,363,877
- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,362,291
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device and method for manufacturing imaging device
- Patent number 12,356,753
- Issue date Jul 8, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masaya Nagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated tin-based contacting metal
- Patent number 12,356,553
- Issue date Jul 8, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 12,347,798
- Issue date Jul 1, 2025
- Sony Group Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,347,813
- Issue date Jul 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 12,347,731
- Issue date Jul 1, 2025
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure for wafer level bonding and bonded semicond...
- Patent number 12,334,462
- Issue date Jun 17, 2025
- United Microelectronics Corp.
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge removal for through-resist plating in an electro-plating cup a...
- Patent number 12,331,421
- Issue date Jun 17, 2025
- Lam Research Corporation
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 12,334,460
- Issue date Jun 17, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Takuya Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC with heat dissipation structure and warpage control
- Patent number 12,322,673
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Build-up package for integrated circuit devices, and methods of mak...
- Patent number 12,315,769
- Issue date May 27, 2025
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded structure with multi-height components comprising back...
- Patent number 12,300,561
- Issue date May 13, 2025
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 12,300,640
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloy bonding wire for semiconductor devices
- Patent number 12,300,658
- Issue date May 13, 2025
- Nippon Micrometal Corporation
- Daizo Oda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,295,225
- Issue date May 6, 2025
- Samsung Display Co., Ltd.
- Chungi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding structures, semiconductor devices having the same, a...
- Patent number 12,288,765
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper wire bond on gold bump on semiconductor die bond pad
- Patent number 12,283,559
- Issue date Apr 22, 2025
- Texas Instruments Incorporated
- Lin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reworkable inter-substrate bond structure
- Patent number 12,278,212
- Issue date Apr 15, 2025
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming metal gapfill with low resistivity
- Patent number 12,272,659
- Issue date Apr 8, 2025
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure with memory and metal...
- Patent number 12,272,586
- Issue date Apr 8, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for forming a semiconductor device including forming a first...
- Patent number 12,266,612
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package process and package structure
- Patent number 12,266,632
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IC PACKAGE WITH DIE AND COPPER POSTS
- Publication number 20250239507
- Publication date Jul 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- GUANGXU LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250239512
- Publication date Jul 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Che-Neng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY FOR PROVIDING AN ENHANCED MEMORY BANDWIDTH A...
- Publication number 20250239509
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Han-Jong Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20250233090
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20250233115
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPONENT AND METHOD FOR FORMING THE SAME
- Publication number 20250233082
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- LIANG-SHIUAN PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SUBSTRATE WITH EMBEDDED COMPONENT
- Publication number 20250226302
- Publication date Jul 10, 2025
- QUALCOMM Incorporated
- Yeoil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDABLE TILES CONTAINING PASSIVE DEVICES FOR PACKAGED SEMICONDUC...
- Publication number 20250226298
- Publication date Jul 10, 2025
- SARAS MICRO DEVICES, INC.
- Richard P. Sheridan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR EMBEDDING INTERCONNECT BRIDGES HAVING THR...
- Publication number 20250218953
- Publication date Jul 3, 2025
- Intel Corporation
- Zhixin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING STRUCTURE AND DISPLAY PANEL
- Publication number 20250219033
- Publication date Jul 3, 2025
- Industrial Technology Research Institute
- Jui-Wen Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT COUPLED WITH CONDUCTIVE VIAS ENCAPSULATED IN AN ELECTRONI...
- Publication number 20250218905
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250218890
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jen Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND METHODS OF FORMATION
- Publication number 20250218793
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufactacturing Company, Ltd.
- I-Chun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
- Publication number 20250218886
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES
- Publication number 20250218906
- Publication date Jul 3, 2025
- Intel Corporation
- Zhixin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH RETAINING FEATURES
- Publication number 20250218907
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jefferson LUGUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER FOR EMBEDDED COMPONENT IN CORE
- Publication number 20250218952
- Publication date Jul 3, 2025
- Intel Corporation
- Benjamin DUONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PATTERNS, PACKAGE, AND MANUFACTURING METHOD OF PA...
- Publication number 20250210564
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGING DEFECT FREE DIMPLE PROCESS AND DEVICE
- Publication number 20250210471
- Publication date Jun 26, 2025
- NXP B.V.
- Chanon SUWANKASAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20250210457
- Publication date Jun 26, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER DEVICE, AND POWER MODULE
- Publication number 20250210574
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR POWER CONTROL IN 3D STACKED DIE
- Publication number 20250210497
- Publication date Jun 26, 2025
- ADVANCED MICRO DEVICES, INC.
- Stephen Dussinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210542
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Wooyeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250201658
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
- Publication number 20250201617
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL LINES FOR SEMICONDUCTOR DEVICES
- Publication number 20250201693
- Publication date Jun 19, 2025
- Altera Corporation
- Arturo PACHON MUNOZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH BOUNDARY...
- Publication number 20250201767
- Publication date Jun 19, 2025
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250201650
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250201772
- Publication date Jun 19, 2025
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER SUBSTRATE INCLUDING OFFSET CORE LAYER
- Publication number 20250192010
- Publication date Jun 12, 2025
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS

Calcium [Ca]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectronic devices with through-substrate interconnects and as...

Thermocompression bonding with passivated silver-based contacting m...

Semiconductor device and method of manufacture

Method of making a fan-out semiconductor assembly with an intermedi...

3D semiconductor memory device and structure

Thermocompression bonding with passivated gold contacting metal

Semiconductor device and method

Imaging device and method for manufacturing imaging device

Thermocompression bonding with passivated tin-based contacting metal

Semiconductor device, manufacturing method, solid state image senso...

Semiconductor package and related methods

Semiconductor components having conductive vias with aligned back s...

Semiconductor structure for wafer level bonding and bonded semicond...

Edge removal for through-resist plating in an electro-plating cup a...

Semiconductor device and manufacturing method of semiconductor device

Device and method for UBM/RDL routing

3DIC with heat dissipation structure and warpage control

Build-up package for integrated circuit devices, and methods of mak...

Fully molded structure with multi-height components comprising back...

Semiconductor device and method of manufacturing thereof

Copper alloy bonding wire for semiconductor devices

Semiconductor packages and methods of forming same

Display device

Hybrid bonding structures, semiconductor devices having the same, a...

Copper wire bond on gold bump on semiconductor die bond pad

Reworkable inter-substrate bond structure

Methods for forming metal gapfill with low resistivity

3D semiconductor memory device and structure with memory and metal...

Method for forming a semiconductor device including forming a first...

Package process and package structure

Patents Applicationslast 30 patents

IC PACKAGE WITH DIE AND COPPER POSTS

PACKAGE STRUCTURE

SEMICONDUCTOR ASSEMBLY FOR PROVIDING AN ENHANCED MEMORY BANDWIDTH A...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

Semiconductor Packages and Methods of Forming Same

SEMICONDUCTOR PACKAGE COMPONENT AND METHOD FOR FORMING THE SAME

HYBRID SUBSTRATE WITH EMBEDDED COMPONENT

EMBEDDABLE TILES CONTAINING PASSIVE DEVICES FOR PACKAGED SEMICONDUC...

METHODS AND APPARATUS FOR EMBEDDING INTERCONNECT BRIDGES HAVING THR...

HYBRID BONDING STRUCTURE AND DISPLAY PANEL

COMPONENT COUPLED WITH CONDUCTIVE VIAS ENCAPSULATED IN AN ELECTRONI...

INTEGRATED CIRCUIT PACKAGES AND METHODS

SEMICONDUCTOR DIE AND METHODS OF FORMATION

ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES

RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES

LEADFRAME WITH RETAINING FEATURES

SPACER FOR EMBEDDED COMPONENT IN CORE

METHOD OF FORMING PATTERNS, PACKAGE, AND MANUFACTURING METHOD OF PA...

SEMICONDUCTOR CHIP PACKAGING DEFECT FREE DIMPLE PROCESS AND DEVICE

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

SEMICONDUCTOR DEVICE, POWER DEVICE, AND POWER MODULE

SYSTEMS AND METHODS FOR POWER CONTROL IN 3D STACKED DIE

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE

SIGNAL LINES FOR SEMICONDUCTOR DEVICES

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH BOUNDARY...

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INTERPOSER SUBSTRATE INCLUDING OFFSET CORE LAYER