Patent Application
20210349404
The description herein relates generally to improving and optimizing lithography processes. More particularly, the disclosure includes apparatus, methods, and computer programs for increasing a depth of focus of a lithography system by modifying an optical spectrum, mask pattern, and/or pupil design.
A lithographic projection apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In such a case, a patterning device (e.g., a mask) may contain or provide a pattern corresponding to an individual layer of the IC (“design layout”), and this pattern can be transferred onto a target portion (e.g. comprising one or more dies) on a substrate (e.g., silicon wafer) that has been coated with a layer of radiation-sensitive material (“resist”), by methods such as irradiating the target portion through the pattern on the patterning device. In general, a single substrate contains a plurality of adjacent target portions to which the pattern is transferred successively by the lithographic projection apparatus, one target portion at a time. In one type of lithographic projection apparatuses, the pattern on the entire patterning device is transferred onto one target portion in one go; such an apparatus may also be referred to as a stepper. In an alternative apparatus, a step-and-scan apparatus can cause a projection beam to scan over the patterning device in a given reference direction (the “scanning” direction) while synchronously moving the substrate parallel or anti-parallel to this reference direction. Different portions of the pattern on the patterning device are transferred to one target portion progressively. Since, in general, the lithographic projection apparatus will have a reduction ratio M (e.g., 4), the speed F at which the substrate is moved will be 1/M times that at which the projection beam scans the patterning device. More information with regard to lithographic devices can be found in, for example, U.S. Pat. No. 6,046,792, incorporated herein by reference.
Prior to transferring the pattern from the patterning device to the substrate, the substrate may undergo various procedures, such as priming, resist coating and a soft bake. After exposure, the substrate may be subjected to other procedures (“post-exposure procedures”), such as a post-exposure bake (PEB), development, a hard bake and measurement/inspection of the transferred pattern. This array of procedures is used as a basis to make an individual layer of a device, e.g., an IC. The substrate may then undergo various processes such as etching, ion-implantation (doping), metallization, oxidation, chemo-mechanical polishing, etc., all intended to finish off the individual layer of the device. If several layers are required in the device, then the whole procedure, or a variant thereof, is repeated for each layer. Eventually, a device will be present in each target portion on the substrate. These devices are then separated from one another by a technique such as dicing or sawing, whence the individual devices can be mounted on a carrier, connected to pins, etc.
Thus, manufacturing devices, such as semiconductor devices, typically involves processing a substrate (e.g., a semiconductor wafer) using a number of fabrication processes to form various features and multiple layers of the devices. Such layers and features are typically manufactured and processed using, e.g., deposition, lithography, etch, chemical-mechanical polishing, and ion implantation. Multiple devices may be fabricated on a plurality of dies on a substrate and then separated into individual devices. This device manufacturing process may be considered a patterning process. A patterning process involves a patterning step, such as optical and/or nanoimprint lithography using a patterning device in a lithographic apparatus, to transfer a pattern on the patterning device to a substrate and typically, but optionally, involves one or more related pattern processing steps, such as resist development by a development apparatus, baking of the substrate using a bake tool, etching using the pattern using an etch apparatus, etc.
As noted, lithography is a central step in the manufacturing of device such as ICs, where patterns formed on substrates define functional elements of the devices, such as microprocessors, memory chips, etc. Similar lithographic techniques are also used in the formation of flat panel displays, micro-electro mechanical systems (MEMS) and other devices.
As semiconductor manufacturing processes continue to advance, the dimensions of functional elements have continually been reduced while the amount of functional elements, such as transistors, per device has been steadily increasing over decades, following a trend referred to as “Moore's law.” At the current state of technology, layers of devices are manufactured using lithographic projection apparatuses that project a design layout onto a substrate using illumination from a deep-ultraviolet illumination source, creating individual functional elements having dimensions well below 100 nm, i.e. less than half the wavelength of the radiation from the illumination source (e.g., a 193 nm illumination source).
This process in which features with dimensions smaller than the classical resolution limit of a lithographic projection apparatus are printed, is can be referred to as low-k1 lithography, according to the resolution formula CD=k1×λ/NA, where λ is the wavelength of radiation employed (e.g., 248 nm or 193 nm), NA is the numerical aperture of projection optics in the lithographic projection apparatus, CD is the “critical dimension”—generally the smallest feature size printed—and k1 is an empirical resolution factor. In general, the smaller k1 the more difficult it becomes to reproduce a pattern on the substrate that resembles the shape and dimensions planned by a designer in order to achieve particular electrical functionality and performance. To overcome these difficulties, sophisticated fine-tuning steps are applied to the lithographic projection apparatus, the design layout, or the patterning device. These include, for example, but not limited to, optimization of NA and optical coherence settings, customized illumination schemes, use of phase shifting patterning devices, optical proximity correction (OPC, sometimes also referred to as “optical and process correction”) in the design layout, or other methods generally defined as “resolution enhancement techniques” (RET). The term “projection optics” as used herein should be broadly interpreted as encompassing various types of optical systems, including refractive optics, reflective optics, apertures and catadioptric optics, for example. The term “projection optics” may also include components operating according to any of these design types for directing, shaping or controlling the projection beam of radiation, collectively or singularly. The term “projection optics” may include any optical component in the lithographic projection apparatus, no matter where the optical component is located on an optical path of the lithographic projection apparatus. Projection optics may include optical components for shaping, adjusting and/or projecting radiation from the source before the radiation passes the patterning device, and/or optical components for shaping, adjusting and/or projecting the radiation after the radiation passes the patterning device. The projection optics generally exclude the source and the patterning device.
Systems, methods, and computer programs for increasing a depth of focus for a lithography system are disclosed. In one aspect, a method includes providing an optical spectrum, a mask pattern, and a pupil design, that together are configured to provide the lithography system with a depth of focus. The method also includes iteratively varying the optical spectrum and an assist feature in the mask pattern to provide a modified optical spectrum and a modified mask pattern that increases the depth of focus. The method further includes configuring a component of the lithography system based on the modified optical spectrum and the modified mask pattern that increases the depth of focus.
In some variations, the iterative variation can further include iteratively varying, concurrently, the optical spectrum, the mask pattern, and the pupil design to provide the modified optical spectrum, a modified mask pattern, and a modified pupil design.
Also, the optical spectrum can be provided in a series of pulses, with a center wavelength in at least one peak in the optical spectrum further varied in every other pulse to shift by approximately 500 fm.
In other variations, the optical spectrum can include a multi-color optical spectrum and the multi-color optical spectrum can include at least two different peaks having a peak separation. The method can also include delivering light corresponding to the multi-color spectrum by a light source, wherein the multiple colors of light can be delivered at different times.
In yet other variations, the iterative variation can further include iteratively varying a bandwidth of a peak in the optical spectrum or iteratively varying a peak separation between two peaks in the optical spectrum.
In some variations, the iterative variation can further include varying a main feature in the mask pattern to increase the depth of focus, and the main feature can include an edge location and a mask bias location, and the iterative variation can further include varying at least one of the edge location or the mask bias location. Two mask bias locations can be symmetrically varied about a center of the main feature. The iterative variation can further include varying a sub-resolution assist feature in the mask pattern to increase the depth of focus. Also, the iterative variation can further include varying of the sub-resolution assist feature by changing at least one of a position or width of the sub-resolution assist feature.
In other variations, the iterative variation can further include performing the iterative variation at least until a process window, based on an area defined at least partly by a dose and an exposure latitude, is increased. The iterative variation can further include performing the variation at least until a product of the depth of focus and an exposure latitude is increased. Also, the iterative variation can further include constraining the variation to increase a contrast at the aerial image when the variation of the optical spectrum results in an increase in bandwidth of a peak in the optical spectrum.
In yet other variations, the component can be a laser and the laser can be configured to provide light based on the modified optical spectrum. The component can be a mask, and a method can further include manufacturing the mask based on the modified mask pattern. The component can be a pupil comprising a diffracted optical element, and the method further can include manufacturing the pupil based on the modified pupil design. The component can be a pupil comprising a mirror array, and the method can further include configuring the pupil based on the modified pupil design. Also, the method can include configuring a pupil including a mirror array based on the modified pupil design and manufacturing a mask based on the modified mask pattern.
In an interrelated aspect, a method for increasing a depth of focus for a lithography system includes providing an optical spectrum, a mask pattern, and a pupil design, that together are configured to provide the lithography system with a depth of focus. The method also includes iteratively varying the optical spectrum and a configuration of one or more mirrors in a mirror array to provide a modified optical spectrum and a modified pupil design that increases the depth of focus. The method also includes configuring the one or more mirrors of the mirror array based on the modified optical spectrum and the modified pupil design that increases the depth of focus.
In some variations, the optical spectrum comprises a multi-color optical spectrum and the multi-color optical spectrum can include at least two different peaks having a peak separation. The method further includes delivering light corresponding to the multi-color spectrum by a light source, wherein the multiple colors of light can be delivered at different times. The iterative variation can further include iteratively varying a bandwidth of a peak in the optical spectrum, iteratively varying a peak separation between two peaks in the optical spectrum, performing the iterative variation at least until a process window, based on an area defined at least partly by a dose and an exposure latitude, is increased, performing the variation at least until a product of the depth of focus and an exposure latitude is increased, or constraining the variation to increase a contrast at the aerial image when the variation of the optical spectrum results in an increase in bandwidth of a peak in the optical spectrum.
In other variations, the method can include generating, by an iterative process, the optical spectrum that will result in the increased depth of focus. The iterative process can include at least iteratively varying a separation between at least two peaks in the optical spectrum, obtaining a plurality of setup parameters that specify aspects of the lithography system, generating a point source model that results in the optical spectrum, the generating comprising specifying a process window, generating an unconstrained pupil design and a mask pattern, applying a freeform pupil map or a parametric pupil map to the unconstrained pupil design to define features of the unconstrained pupil design and generate a constrained pupil design, applying at least one of a mask constraint specifying a mask transmission, mask phase, and location of a sub resolution assist feature seed to generate a modified mask pattern, and concurrently modifying the constrained pupil design with the applied mask constraint to generate the modified pupil design and the modified mask pattern.
Furthermore, according to an embodiment, there is provided a computer program product comprising a non-transitory computer readable medium having instructions recorded thereon, the instructions when executed by a computer implementing the methods listed above.
The accompanying drawings, which are incorporated in and constitute a part of this specification, show certain aspects of the subject matter disclosed herein and, together with the description, help explain some of the principles associated with the disclosed implementations. In the drawings,
Although specific reference may be made in this text to the manufacture of ICs, it should be explicitly understood that the description herein has many other possible applications. For example, it may be employed in the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, liquid-crystal display panels, thin-film magnetic heads, etc. The skilled artisan will appreciate that, in the context of such alternative applications, any use of the terms “reticle”, “wafer” or “die” in this text should be considered as interchangeable with the more general terms “mask”, “substrate” and “target portion”, respectively.
In the present document, the terms “radiation” and “beam” are used to encompass all types of electromagnetic radiation, including ultraviolet radiation (e.g. with a wavelength of 365, 248, 193, 157 or 126 nm) and EUV (extreme ultra-violet radiation, e.g. having a wavelength in the range of about 5-100 nm).
The patterning device can comprise, or can form, one or more design layouts. The design layout can be generated utilizing CAD (computer-aided design) programs, this process often being referred to as EDA (electronic design automation). Most CAD programs follow a set of predetermined design rules in order to create functional design layouts/patterning devices. These rules are set by processing and design limitations. For example, design rules define the space tolerance between devices (such as gates, capacitors, etc.) or interconnect lines, so as to ensure that the devices or lines do not interact with one another in an undesirable way. One or more of the design rule limitations may be referred to as “critical dimension” (CD). A critical dimension of a device can be defined as the smallest width of a line or hole or the smallest space between two lines or two holes. Thus, the CD determines the overall size and density of the designed device. Of course, one of the goals in device fabrication is to faithfully reproduce the original design intent on the substrate (via the patterning device).
The term “mask” or “patterning device” as employed in this text may be broadly interpreted as referring to a generic patterning device that can be used to endow an incoming radiation beam with a patterned cross-section, corresponding to a pattern that is to be created in a target portion of the substrate; the term “light valve” can also be used in this context. Besides the classic mask (transmissive or reflective; binary, phase-shifting, hybrid, etc.), examples of other such patterning devices include a programmable mirror array and a programmable LCD array.
An example of a programmable mirror array can be a matrix-addressable surface having a viscoelastic control layer and a reflective surface. The basic principle behind such an apparatus is that (for example) addressed areas of the reflective surface reflect incident radiation as diffracted radiation, whereas unaddressed areas reflect incident radiation as undiffracted radiation. Using an appropriate filter, the said undiffracted radiation can be filtered out of the reflected beam, leaving only the diffracted radiation behind; in this manner, the beam becomes patterned according to the addressing pattern of the matrix-addressable surface. The required matrix addressing can be performed using suitable electronic methods.
An example of a programmable LCD array is given in U.S. Pat. No. 5,229,872, which is incorporated herein by reference.
A pupil 20A can be included with transmission optics 16Ac. In some embodiments, there can be one or more pupils before and/or after mask 18A. As described in further detail herein, pupil 20A can provide patterning of the light that ultimately reaches substrate plane 22A. An adjustable filter or aperture at the pupil plane of the projection optics may restrict the range of beam angles that impinge on the substrate plane 22A, where the largest possible angle defines the numerical aperture of the projection optics NA=n sin(Θmax), wherein n is the refractive index of the media between the substrate and the last element of the projection optics, and Θmax is the largest angle of the beam exiting from the projection optics that can still impinge on the substrate plane 22A.
In a lithographic projection apparatus, a source provides illumination (i.e. radiation) to a patterning device and projection optics direct and shape the illumination, via the patterning device, onto a substrate. The projection optics may include at least some of the components 14A, 16Aa, 16Ab and 16Ac. An aerial image (AI) is the radiation intensity distribution at substrate level. A resist model can be used to calculate the resist image from the aerial image, an example of which can be found in U.S. Patent Application Publication No. US 2009-0157630, the disclosure of which is hereby incorporated by reference in its entirety. The resist model is related only to properties of the resist layer (e.g., effects of chemical processes which occur during exposure, post-exposure bake (PEB) and development). Optical properties of the lithographic projection apparatus (e.g., properties of the illumination, the patterning device and the projection optics) dictate the aerial image and can be defined in an optical model. Since the patterning device used in the lithographic projection apparatus can be changed, it is desirable to separate the optical properties of the patterning device from the optical properties of the rest of the lithographic projection apparatus including at least the source and the projection optics. Details of techniques and models used to transform a design layout into various lithographic images (e.g., an aerial image, a resist image, etc.), apply OPC using those techniques and models and evaluate performance (e.g., in terms of process window) are described in U.S. Patent Application Publication Nos. US 2008-0301620, 2007-0050749, 2007-0031745, 2008-0309897, 2010-0162197, and 2010-0180251, the disclosure of each which is hereby incorporated by reference in its entirety.
One aspect of understanding a lithographic process is understanding the interaction of the radiation and the patterning device. The electromagnetic field of the radiation after the radiation passes the patterning device may be determined from the electromagnetic field of the radiation before the radiation reaches the patterning device and a function that characterizes the interaction. This function may be referred to as the mask transmission function (which can be used to describe the interaction by a transmissive patterning device and/or a reflective patterning device).
The mask transmission function may have a variety of different forms. One form is binary. A binary mask transmission function has either of two values (e.g., zero and a positive constant) at any given location on the patterning device. A mask transmission function in the binary form may be referred to as a binary mask. Another form is continuous. Namely, the modulus of the transmittance (or reflectance) of the patterning device is a continuous function of the location on the patterning device. The phase of the transmittance (or reflectance) may also be a continuous function of the location on the patterning device. A mask transmission function in the continuous form may be referred to as a continuous tone mask or a continuous transmission mask (CTM). For example, the CTM may be represented as a pixelated image, where each pixel may be assigned a value between 0 and 1 (e.g., 0.1, 0.2, 0.3, etc.) instead of binary value of either 0 or 1. In an embodiment, CTM may be a pixelated gray scale image, where each pixel having values (e.g., within a range [−255, 255], normalized values within a range [0, 1] or [-1, 1] or other appropriate ranges).
The thin-mask approximation, also called the Kirchhoff boundary condition, is widely used to simplify the determination of the interaction of the radiation and the patterning device. The thin-mask approximation assumes that the thickness of the structures on the patterning device is very small compared with the wavelength and that the widths of the structures on the mask are very large compared with the wavelength. Therefore, the thin-mask approximation assumes the electromagnetic field after the patterning device is the multiplication of the incident electromagnetic field with the mask transmission function. However, as lithographic processes use radiation of shorter and shorter wavelengths, and the structures on the patterning device become smaller and smaller, the assumption of the thin-mask approximation can break down. For example, interaction of the radiation with the structures (e.g., edges between the top surface and a sidewall) because of their finite thicknesses (“mask 3D effect” or “M3D”) may become significant. Encompassing this scattering in the mask transmission function may enable the mask transmission function to better capture the interaction of the radiation with the patterning device. A mask transmission function under the thin-mask approximation may be referred to as a thin-mask transmission function. A mask transmission function encompassing M3D may be referred to as a M3D mask transmission function.
According to an embodiment of the present disclosure, one or more images may be generated. The images includes various types of signal that may be characterized by pixel values or intensity values of each pixel. Depending on the relative values of the pixel within the image, the signal may be referred as, for example, a weak signal or a strong signal, as may be understood by a person of ordinary skill in the art. The term “strong” and “weak” are relative terms based on intensity values of pixels within an image and specific values of intensity may not limit scope of the present disclosure. In an embodiment, the strong and weak signal may be identified based on a selected threshold value. In an embodiment, the threshold value may be fixed (e.g., a midpoint of a highest intensity and a lowest intensity of pixel within the image. In an embodiment, a strong signal may refer to a signal with values greater than or equal to an average signal value across the image and a weak signal may refer to signal with values less than the average signal value. In an embodiment, the relative intensity value may be based on percentage. For example, the weak signal may be signal having intensity less than 50% of the highest intensity of the pixel (e.g., pixels corresponding to target pattern may be considered pixels with highest intensity) within the image. Furthermore, each pixel within an image may considered as a variable. According to the present embodiment, derivatives or partial derivative may be determined with respect to each pixel within the image and the values of each pixel may be determined or modified according to a cost function based evaluation and/or gradient based computation of the cost function. For example, a CTM image may include pixels, where each pixel is a variable that can take any real value.
More specifically, it is noted that source model 31 can represent the optical characteristics of the source that include, but not limited to, numerical aperture settings, illumination sigma (σ) settings as well as any particular illumination shape (e.g. off-axis radiation sources such as annular, quadrupole, dipole, etc.). Projection optics model 32 can represent the optical characteristics of the projection optics, including aberration, distortion, one or more refractive indexes, one or more physical sizes, one or more physical dimensions, etc. Design layout model 35 can represent one or more physical properties of a physical patterning device, as described, for example, in U.S. Pat. No. 7,587,704, which is incorporated by reference in its entirety. The objective of the simulation is to accurately predict, for example, edge placement, aerial image intensity slope and/or CD, which can then be compared against an intended design. The intended design is generally defined as a pre-OPC design layout which can be provided in a standardized digital file format such as GDSII or OASIS or other file format.
From this design layout, one or more portions may be identified, which are referred to as “clips”. In an embodiment, a set of clips is extracted, which represents the complicated patterns in the design layout (typically about 50 to 1000 clips, although any number of clips may be used). These patterns or clips represent small portions (i.e. circuits, cells or patterns) of the design and more specifically, the clips typically represent small portions for which particular attention and/or verification is needed. In other words, clips may be the portions of the design layout, or may be similar or have a similar behavior of portions of the design layout, where one or more critical features are identified either by experience (including clips provided by a customer), by trial and error, or by running a full-chip simulation. Clips may contain one or more test patterns or gauge patterns.
An initial larger set of clips may be provided a priori by a customer based on one or more known critical feature areas in a design layout which require particular image optimization. Alternatively, in another embodiment, an initial larger set of clips may be extracted from the entire design layout by using some kind of automated (such as machine vision) or manual algorithm that identifies the one or more critical feature areas.
In a lithographic projection apparatus, as an example, a cost function may be expressed as
CF(z1,z2, . . . zN)=Σp=1Pwpfp2(z1,z2, . . . , zN) (Eq. 1)
where (z1, z2, . . . , zN) are N design variables or values thereof. fp (z1, Z2, . . . , zN) can be a function of the design variables (z1, z2, . . . , zN) such as a difference between an actual value and an intended value of a characteristic for a set of values of the design variables of (z1, z2, . . . , zN). wp is a weight constant associated with fp (z1, z2, . . . , zN). For example, the characteristic may be a position of an edge of a pattern, measured at a given point on the edge. Different fp(z1z2, . . . , zN) may have different weight wp. For example, if a particular edge has a narrow range of permitted positions, the weight wp for the fp(z1, Z2, . . . , zN) representing the difference between the actual position and the intended position of the edge may be given a higher value. fp (z1, z2, . . . , zN) can also be a function of an interlayer characteristic, which is in turn a function of the design variables (z1, z2, . . . , zN). Of course, CF(z1, z2, . . . , zN) is not limited to the form in Eq. 1. CF(z1, z2, . . . , zN) can be in any other suitable form.
The cost function may represent any one or more suitable characteristics of the lithographic projection apparatus, lithographic process or the substrate, for instance, focus, CD, image shift, image distortion, image rotation, stochastic variation, throughput, local CD variation, process window, an interlayer characteristic, or a combination thereof. In one embodiment, the design variables (z1, z2, . . . , zN) comprise one or more selected from dose, global bias of the patterning device, and/or shape of illumination. Since it is the resist image that often dictates the pattern on a substrate, the cost function may include a function that represents one or more characteristics of the resist image. For example, fp(z1, z2, . . . , zN) can be simply a distance between a point in the resist image to an intended position of that point (i.e., edge placement error EPEp(z1, z2, . . . , zN). The design variables can include any adjustable parameter such as an adjustable parameter of the source, the patterning device, the projection optics, dose, focus, etc.
The lithographic apparatus may include components collectively called a “wavefront manipulator” that can be used to adjust the shape of a wavefront and intensity distribution and/or phase shift of a radiation beam. In an embodiment, the lithographic apparatus can adjust a wavefront and intensity distribution at any location along an optical path of the lithographic projection apparatus, such as before the patterning device, near a pupil plane, near an image plane, and/or near a focal plane. The wavefront manipulator can be used to correct or compensate for certain distortions of the wavefront and intensity distribution and/or phase shift caused by, for example, the source, the patterning device, temperature variation in the lithographic projection apparatus, thermal expansion of components of the lithographic projection apparatus, etc. Adjusting the wavefront and intensity distribution and/or phase shift can change values of the characteristics represented by the cost function. Such changes can be simulated from a model or actually measured. The design variables can include parameters of the wavefront manipulator.
The design variables may have constraints, which can be expressed as (z1, z2, . . . , zN)∈Z, where Z is a set of possible values of the design variables. One possible constraint on the design variables may be imposed by a desired throughput of the lithographic projection apparatus. Without such a constraint imposed by the desired throughput, the optimization may yield a set of values of the design variables that are unrealistic. For example, if the dose is a design variable, without such a constraint, the optimization may yield a dose value that makes the throughput economically impossible. However, the usefulness of constraints should not be interpreted as a necessity. For example, the throughput may be affected by the pupil fill ratio. For some illumination designs, a low pupil fill ratio may discard radiation, leading to lower throughput. Throughput may also be affected by the resist chemistry. Slower resist (e.g., a resist that requires higher amount of radiation to be properly exposed) leads to lower throughput.
As used herein, the term “process model” means a model that includes one or more models that simulate a patterning process. For example, a process model can include any combination of: an optical model (e.g., that models a lens system/projection system used to deliver light in a lithography process and may include modelling the final optical image of light that goes onto a photoresist), a resist model (e.g., that models physical effects of the resist, such as chemical effects due to the light), an optical proximity correction (OPC) model (e.g., that can be used to make masks or reticles and may include sub-resolution resist features (SRAFs), etc.).
As used herein, the term “concurrently,” for example when referring to “concurrently varying” means that two or more things are occurring at approximately, but not necessarily exactly, at the same time. For example, varying a pupil design concurrently with a mask pattern can mean making a small modification to a pupil design, then making a small adjustment to a mask pattern, and then another modification to the pupil design, and so on. However, the present disclosure contemplates that in some parallel processing applications, concurrency can refer to operations occurring at the same time, or having some overlapping in time.
By way of introduction, the present disclosure provides systems, methods and computer program products which, among other things, relate to modifying or optimizing features of a lithography system in order to increase performance and manufacturing efficiency. The features that can be modified can include an optical spectrum of light used in the lithography process, a mask, a pupil, etc. Any combination of these features (and possibly others) can be implemented in order to improve, for example, a depth of focus, a process window, a contrast, or the like, of a lithography system. Of particular importance is the fact that, in some embodiments, modification of one feature affects the other features. In this way, to achieve the desired improvements, multiple features can be concurrently modified/varied, as described below.
In an embodiment, laser light or plasma emission having a single wavelength of light (i.e., having a central wavelength) can be used for a lithography process. One example of such a single-wavelength optical spectrum 310 is illustrated by the top panel of
In another embodiment, light having a multiple-wavelength optical spectrum 340 (also referred to herein as a multi-color optical spectrum) can be used. An example of such is illustrated in
The bottom portion of
In some embodiments, the light can be delivered with further variations in the center wavelength (beyond just making the spectra “two-color). This has the effect of “blurring” the light delivered, but also can cause the beneficial effect of increasing the exposure latitude at only a slight cost to the depth of focus. For example, any center wavelengths of the peaks of the optical spectrum can be varied (e.g., increased or decreased) by approximately 1 fm, 10 fm, 50 fm, 100 fm 200 fm, 500 fm, 1000 fm, etc. The variation can be set to a specific value, or can be selected such that the increase in the exposure latitude is maximized relative to the decrease in depth of focus. Also, in some embodiments, the variation can be applied to every other pulse (i.e., alternating), but can also be applied to every third pulse, fourth pulse, etc. In this way, the optical spectrum can be provided in a series of pulses, with a center wavelength in at least one peak in the optical spectrum further varied in every other pulse to shift by approximately 500 fm.
In an embodiment, lithography system can include one or more pupils. As part of a lithography process, the light can be converted into a prescribed pattern (e.g., having a particular spatial distribution of intensity and/or phase) before it passes through the mask. As used herein, the term “pupil design” refers to the pattern of light that is generated by the physical construction or configuration of the pupil. Throughout the present disclosure, pupil designs are referred to with images representing and intensity of light of the pupil design. One example of pupil design 410 is illustrated in the top portion of
In an embodiment, a pupil can be a glass disc, referred to herein as a diffractive optical element (DOE) 420. The material structure of the DOE 420 can cause the light to deflect and combine to form a particular pupil design. Because the pupil design is set by the structure of the DOE 420, each desired pupil design can require a different DOE 420.
In another embodiment, the pupil can be mirror array 430 that is made up of many small mirrors which can be individually controlled to generate the pupil design. Examples of DOE 420 and mirror array 430 are illustrated in the bottom portion of
In many lithographic processes, is desired to use a mask to perform selective blocking of light to effect a particular pattern on a photoresist or a substrate. As used herein, a “mask” refers to an actual physical mask itself. In contrast, as used herein, a “mask pattern” refers to the shape of the features of the mask. Such features can include, for example, channels, slots, holes, ridges, varying areas of different optical transmission (e.g. in a continuous transmission mask), or the like. An ideal mask pattern 510 is illustrated in the top portion of
The present disclosure provides, among other things, a method for increasing a depth of focus for a lithography system. The method can include providing an optical spectrum, a mask pattern, and a pupil design, that together are configured to provide the lithography system with a depth of focus. The method can also include iteratively varying the optical spectrum and a configuration of one or more mirrors in a mirror array to provide a modified optical spectrum and a modified pupil design that increases the depth of focus. One or more of the mirrors of the mirror array can then be configured based on the modified pupil design and the modified mask pattern that increases the depth of focus. As used herein, “depth of focus” means a distance over which light at a desired location (e.g., at the substrate, at a photoresist, etc.) is considered to be “in focus.” The particular numbers corresponding to whether light is in focus can be defined automatically, by a user, and can vary as requested for a given application, and such can be referred to as a “specification.”
In
The modified optical spectrum (or any “modified” feature) need not be a final or optimized feature, although it may be. For example, the modified optical spectrum can be an intermediate step where an initial optical spectrum has been modified but may not be at a final solution. However, the modified features, as described herein, can be an optimized or best solution of the particular aspect involved (e.g., the modified optical spectrum, modified mask pattern, or modified pupil design). This is further discussed with reference to
In some embodiments of the present disclosure, the concurrent variations can be implemented by computer-implemented process collectively referred to herein as an optimization module. An optimization module can co-optimize and analyze any number of aspects of the lithography system, for example, the optical spectra, mask pattern, pupil design, main features, SRAFs, etc. The optimization module can include any number of computer programs distributed across any number of computing systems. Predictive modeling and machine learning techniques (e.g. trained models that are part of optimization module) can also be included. Optimization module can provide improved solutions in the form of graphical displays, data files, and the like. These solutions can include, for example, mask patterns, photoresist parameters, light source settings, pupil configurations, etc.
In some embodiments, the optimization module can modify and/or optimize the optical spectrum, for example to increase or maximize a depth-of-focus. Accordingly, in an embodiment, the iterative variation can include varying a bandwidth of a peak in the optical spectrum 340. Similarly, in another embodiment, the iterative variation further can include varying a peak separation 346 between two (or more) peaks in optical spectrum 340.
Due to the interdependence between some components of the lithography system, and as accounted for with the co-optimization by optimization module, changing one aspect of the lithography system may affect another aspect. For example, when increasing a depth of focus, changing optical spectrum 340 can result in a change in pupil design 410 so that, for example, contrast loss can be reduced. As used herein, the illustrations shown of optical spectra, pupil designs, and mask patterns can refer equally initial or modified versions, and for simplicity are both referred to herein by similar reference numbers. Modified pupil design 410 can be realized as a data file containing programming instructions or operation sequences of the mirror array. For example, the modified pupil design can specify the angles or orientations of the mirrors in mirror array 430 such that the desired modified pupil design 410 is created.
A simplified example of a portion of mask pattern 710 is shown in the top panel of
Similar to the embodiments described above where changes in the optical spectrum can result in changes to the pupil design, the method can include providing an optical spectrum, a mask pattern 710, and a pupil design, that together are configured to provide the lithography system with a depth of focus. The method can also include iteratively varying the optical spectrum and an assist feature in the mask pattern to provide a modified optical spectrum and a modified mask pattern that increases the depth of focus. A component of the lithography system can then be configured based on the modified optical spectrum and the modified mask pattern 710 that increases the depth of focus. The component can include, for example, any combination of the mask, the light source, the pupil, or other components of the lithography system.
Mask pattern 710 can be iteratively varied concurrently with the optical spectrum to provide the modified optical spectrum and a modified mask pattern 710. The iterative variation can also include varying a main feature 720 in the mask pattern 710 to increase the depth of focus. A main feature 720 can include an edge location and/or a mask bias 740, and the iterative variation can also vary at least one of the edge location or the mask bias location. In some embodiments, two mask bias locations can be symmetrically varied about center 735 of main feature 720. As used in such embodiments, symmetrically varied means making the corresponding variation in mask bias location on either side of center 735 of main feature 720 such that the mask bias locations have the same distance from the center 735 of main feature 720.
The modified mask pattern 710 can include changes to features added by performing OPC on the mask (similar to what is illustrated in
Optimization of a combination of the aspects of the lithography system as described herein can result in the benefits to the performance of lithography system as illustrated in
Any sort or number of metrics can be increased or optimized by the methods disclosed herein. While there can be a trade-offs between some parameters increasing and other parameters decreasing (e.g., DOF vs. EF) as a result of the variations, in some embodiments, the iterative variation can include performing the variation at least until a product of the depth of focus and an exposure latitude is increased. Similarly, the iterative variation can include performing the iterative variation at least until a process window, based on an area defined at least partly by a dose and an exposure latitude, is increased.
The embodiment illustrated in
In addition to the varying the center wavelengths of a two-color optical spectrum, a bandwidth of one or more peaks of an optical spectrum can also be varied as part of the optimization process. As a simplified example,
As apparent from the present disclosure, there are many possible optimizations that can result from varying aspects of the lithography system concurrently. While not every permutation has been described in detail, all such permutations are considered within the scope of the present disclosure. For example, optical spectrum, bandwidth, peak separation, mask pattern, main features, assist features, pupil design, process models (OPC, resist, etc.), can be varied in any combination to improve the lithography system. Similarly, the variations can be performed to improve any combination of depth of focus, exposure latitude, dose, focus, contrast, NILS, process window, etc. Additionally, the variations can be performed to reduce any combination of edge placement error, mask error enhancement factor (MEEF), etc.
As described herein, embodiments of the present disclosure can be used to provide prescriptions for configuration of a lithography system. As such, based on solutions provided by the optimization process, components of the optical system can be constructed and/or configured to realize the determined benefits. For example, in an embodiment, the component can be a laser configured to provide light based on the modified optical spectrum. In an embodiment, the component can be a mask manufactured based on the modified mask pattern. In an embodiment, the component can be a pupil in the form of a diffracted optical element manufactured based on the modified pupil design. In another embodiment, the pupil can be a mirror array configured based on the modified pupil design. Another embodiment can include both configuring a mirror array based on the modified pupil design, and also manufacturing a mask based on the modified mask pattern.
In an embodiment, a method for increasing a depth of focus for a lithography system can include, at 1110, providing an optical spectrum, a mask pattern, and a pupil design, that together are configured to provide the lithography system with a depth of focus. The method can, at 1120, iteratively varying the optical spectrum and an assist feature in the mask pattern to provide a modified optical spectrum and a modified mask pattern that increases the depth of focus. At 1120, a component of the lithography system can based on the modified optical spectrum and the modified mask pattern that increases the depth of focus.
In an embodiment, a method for increasing a depth of focus for a lithography system can include, at 1210, providing an optical spectrum, a mask pattern, and a pupil design, that together are configured to provide the lithography system with a depth of focus. The method can, at 1220, iteratively varying the optical spectrum and a configuration of one or more mirrors in a mirror array to provide a modified optical spectrum and a modified pupil design that increases the depth of focus. At 1220, one or more mirrors of the mirror array can be configured based on the modified optical spectrum and the modified pupil design that increases the depth of focus.
Performing a co-optimization (or concurrent optimization process) involving varying features of two or more of an optical spectrum, a pupil design, or a mask pattern, can be iteratively performed to generate, for example, a modified optical spectrum, modified pupil design, or modified mask pattern that will result in an increased depth of focus. For example, when a desired metric is not met (e.g., 150 nm DOF at 5% EL), a spacing between two or more of the peaks in the optical spectrum can be varied to determine a spacing that achieves the desired metric. Additionally, constraints can be applied such that the optical spectrum, pupil design, and mask pattern meet certain process requirements, such as a mask having a particular transmission or a pupil having particular physical properties. One example implementation of a co-optimization of the spectrum, pupil design, and mask pattern, including examples of such constraints, is described below.
At 1310, setup parameters that specify aspects of the lithography system can be obtained/set for computational simulations (e.g., to perform the co-optimization processes) as described herein. The setup parameters can include any combination of imaging conditions, including polarizations of light from the light source, the configuration of film stacks that the photoresist is coated over, mask rule check (MRC) parameters, the photoresist, the photoresist thickness, the film stack that the photoresist is coated over, the capability of the scanner (e.g., numerical aperture, polarization, Zernike coefficients), etc. These parameters can be received from another computer and be in the form of data files, and can also include default setup parameters containing default values of any of the above. Optionally, the setup parameters can be defined by a user and stored as a data file or in temporary computer memory.
At 1320, an optical spectrum (e.g., as shown by elements 310 or 340 in
At 1330, a process window based point-source model can be generated. This can model the light source as a point source, but in some implementations can include more complicated source models such as finite-sized source approximations. The process window conditions can be defined, for example, optimizing to achieve a process window having 150 nm depth of focus at 5% exposure latitude, or approaching such a target process window until a best convergence is reached based on the other constraints of the simulation. Such numbers are intended as examples only, for example the process window can be based on any combination of process windows having depths of focus of more than 1, 5, 10, 20, 50, 75, 150, 200, 300, 500, or 1000 nm. Similarly, the exposure latitude can be defined to be less than 1%, 3%, 8%, 10%, 15%, 20%, 30%, or 50%.
At 1340, an unconstrained pupil design 1440 (a graphical example of such as shown in
At 1350, a pupil map can be applied to unconstrained pupil design 1440. The pupil map can define features (see the examples below) of the pupil that are currently unconstrained. Two examples of pupil maps are a freeform pupil map 1450 or parametric pupil map 1455, the applying of which can result in a constrained pupil design.
A freeform optimization can include applying freeform pupil map 1450 to, for example, specify a pupil resolution (e.g., as set by the resolution of a diffractive optical element, which can be made up of hundreds or thousands of mirror, each conforming to a pixel in a pupil map). This is illustrated by comparing the example of the coarse unconstrained pupil design 1440 to freeform pupil map 1450. Here, we see that the freeform optimization does not change the general light pattern at the pupil, but increases the resolution.
A parametric optimization can include constraining features of the pupil as illustrated by parametric pupil map 1455. One example of a feature that can be specified as a constraint is the value of sigma, or pupil fill factor. Various regions (also referred to as poles 1457) of the parametric pupil map 1455 are shown that have sigma expressed in terms of, for example, the pole intensity (i.e., the value of sigma in the region), a pole angle (i.e., angle at the center of the region), “pole width (i.e., angular extent of the region), sigma_in (i.e., the inner radius), and sigma_out (i.e., the outer radius). It should be understood that the examples shown in
Mask and/or physical pupil constraints can also be generated and applied in conjunction with the freeform or parametric optimization. The mask constraints can be used to generate a modified mask pattern, as described herein. Mask constraints can include, for example, mask transmission, phase effects on the mask, locations for SRAF seeding, OPC features, etc.
At 1360 (when a freeform source was defined at 1350) concurrent modification (or optimization) of the constrained pupil design with the applied mask constraints can generate the modified pupil design and the modified mask pattern.
Similarly, at 1370 (when a parametric source map was defined at 1350), concurrent modification (or optimization) of the constrained pupil design with the applied mask constraints can occur to generate the modified pupil design and the modified mask pattern. One example of the resulting modified pupil and modified mask pattern is shown. It can be seen that the resulting pupils (1460 and 1470) and mask patterns (1465 and 1475) are different due to the differences in the co-optimization mode selected.
At 1380, a process window and/or optionally MEEF can be calculated based on the modified mask pattern and pupil design. As mentioned above with regard to an example desired metric (e.g., a process window), if the process window does not meet the process window conditions defined initially at 1320, the optical spectrum can be modified, for example by changing a bandwidth, peak separation, number of peaks, or the like. The modified optical spectrum can be input as a setup parameter for the process to repeat such that closer agreement to the desired process window is achieved. Any of the other setup parameters can optionally be changed as well. In this way, after 1380, the iterative process can return to any prior step described above, for example, 1310 or 1320.
When the process window is met, the results of the modified optical spectrum, mask pattern, and/or pupil design can be provided as data output to one or more computing systems. In some implementations, the process can stop at a best convergence toward a specified process window after a predefined number of iterations.
Computer system CS includes a bus BS or other communication mechanism for communicating information, and a processor PRO (or multiple processor) coupled with bus BS for processing information. Computer system CS also includes a main memory MM, such as a random access memory (RAM) or other dynamic storage device, coupled to bus BS for storing information and instructions to be executed by processor PRO. Main memory MM also may be used for storing temporary variables or other intermediate information during execution of instructions to be executed by processor PRO. Computer system CS further includes a read only memory (ROM) ROM or other static storage device coupled to bus BS for storing static information and instructions for processor PRO. A storage device SD, such as a magnetic disk or optical disk, is provided and coupled to bus BS for storing information and instructions.
Computer system CS may be coupled via bus BS to a display DS, such as a cathode ray tube (CRT) or flat panel or touch panel display for displaying information to a computer user. An input device ID, including alphanumeric and other keys, is coupled to bus BS for communicating information and command selections to processor PRO. Another type of user input device is cursor control CC, such as a mouse, a trackball, or cursor direction keys for communicating direction information and command selections to processor PRO and for controlling cursor movement on display DS. This input device typically has two degrees of freedom in two axes, a first axis (e.g., x) and a second axis (e.g., y), that allows the device to specify positions in a plane. A touch panel (screen) display may also be used as an input device.
According to one embodiment, portions of one or more methods described herein may be performed by computer system CS in response to processor PRO executing one or more sequences of one or more instructions contained in main memory MM. Such instructions may be read into main memory MM from another computer-readable medium, such as storage device SD. Execution of the sequences of instructions contained in main memory MM causes processor PRO to perform the process steps described herein. One or more processors in a multi-processing arrangement may also be employed to execute the sequences of instructions contained in main memory MM. In an alternative embodiment, hard-wired circuitry may be used in place of or in combination with software instructions. Thus, the description herein is not limited to any specific combination of hardware circuitry and software.
The term “computer-readable medium” as used herein refers to any medium that participates in providing instructions to processor PRO for execution. Such a medium may take many forms, including but not limited to, non-volatile media, volatile media, and transmission media. Non-volatile media include, for example, optical or magnetic disks, such as storage device SD. Volatile media include dynamic memory, such as main memory MM. Transmission media include coaxial cables, copper wire and fiber optics, including the wires that comprise bus BS. Transmission media can also take the form of acoustic or light waves, such as those generated during radio frequency (RF) and infrared (IR) data communications. Computer-readable media can be non-transitory, for example, a floppy disk, a flexible disk, hard disk, magnetic tape, any other magnetic medium, a CD-ROM, DVD, any other optical medium, punch cards, paper tape, any other physical medium with patterns of holes, a RAM, a PROM, and EPROM, a FLASH-EPROM, any other memory chip or cartridge. Non-transitory computer readable media can have instructions recorded thereon. The instructions, when executed by a computer, can implement any of the features described herein. Transitory computer-readable media can include a carrier wave or other propagating electromagnetic signal.
Various forms of computer readable media may be involved in carrying one or more sequences of one or more instructions to processor PRO for execution. For example, the instructions may initially be borne on a magnetic disk of a remote computer. The remote computer can load the instructions into its dynamic memory and send the instructions over a telephone line using a modem. A modem local to computer system CS can receive the data on the telephone line and use an infrared transmitter to convert the data to an infrared signal. An infrared detector coupled to bus BS can receive the data carried in the infrared signal and place the data on bus BS. Bus BS carries the data to main memory MM, from which processor PRO retrieves and executes the instructions. The instructions received by main memory MM may optionally be stored on storage device SD either before or after execution by processor PRO.
Computer system CS may also include a communication interface CI coupled to bus BS. Communication interface CI provides a two-way data communication coupling to a network link NDL that is connected to a local network LAN. For example, communication interface CI may be an integrated services digital network (ISDN) card or a modem to provide a data communication connection to a corresponding type of telephone line. As another example, communication interface CI may be a local area network (LAN) card to provide a data communication connection to a compatible LAN. Wireless links may also be implemented. In any such implementation, communication interface CI sends and receives electrical, electromagnetic or optical signals that carry digital data streams representing various types of information.
Network link NDL typically provides data communication through one or more networks to other data devices. For example, network link NDL may provide a connection through local network LAN to a host computer HC. This can include data communication services provided through the worldwide packet data communication network, now commonly referred to as the “Internet” INT. Local network LAN (Internet) both use electrical, electromagnetic or optical signals that carry digital data streams. The signals through the various networks and the signals on network data link NDL and through communication interface CI, which carry the digital data to and from computer system CS, are exemplary forms of carrier waves transporting the information.
Computer system CS can send messages and receive data, including program code, through the network(s), network data link NDL, and communication interface CI. In the Internet example, host computer HC might transmit a requested code for an application program through Internet INT, network data link NDL, local network LAN and communication interface CI. One such downloaded application may provide all or part of a method described herein, for example. The received code may be executed by processor PRO as it is received, and/or stored in storage device SD, or other non-volatile storage for later execution. In this manner, computer system CS may obtain application code in the form of a carrier wave.
The lithographic projection apparatus can include an illumination system IL, a first object table MT, a second object table WT, and a projection system PS.
Illumination system IL, can condition a beam B of radiation. In this particular case, the illumination system also comprises a radiation source SO.
First object table (e.g., patterning device table) MT can be provided with a patterning device holder to hold a patterning device MA (e.g., a reticle), and connected to a first positioner to accurately position the patterning device with respect to item PS.
Second object table (substrate table) WT can be provided with a substrate holder to hold a substrate W (e.g., a resist-coated silicon wafer), and connected to a second positioner to accurately position the substrate with respect to item PS.
Projection system (“lens”) PS (e.g., a refractive, catoptric or catadioptric optical system) can image an irradiated portion of the patterning device MA onto a target portion C (e.g., comprising one or more dies) of the substrate W.
As depicted herein, the apparatus can be of a transmissive type (i.e., has a transmissive patterning device). However, in general, it may also be of a reflective type, for example (with a reflective patterning device). The apparatus may employ a different kind of patterning device to classic mask; examples include a programmable mirror array or LCD matrix.
The source SO (e.g., a mercury lamp or excimer laser, LPP (laser produced plasma) EUV source) produces a beam of radiation. This beam is fed into an illumination system (illuminator) IL, either directly or after having traversed conditioning apparatuses, such as a beam expander Ex, for example. The illuminator IL may comprise adjusting device AD for setting the outer and/or inner radial extent (commonly referred to as a-outer and a-inner, respectively) of the intensity distribution in the beam. In addition, it will generally comprise various other components, such as an integrator IN and a condenser CO. In this way, the beam B impinging on the patterning device MA has a desired uniformity and intensity distribution in its cross-section.
In some embodiments, source SO may be within the housing of the lithographic projection apparatus (as is often the case when source SO is a mercury lamp, for example), but that it may also be remote from the lithographic projection apparatus, the radiation beam that it produces being led into the apparatus (e.g., with the aid of suitable directing mirrors); this latter scenario can be the case when source SO is an excimer laser (e.g., based on KrF, ArF or F2 lasing).
The beam PB can subsequently intercept patterning device MA, which is held on a patterning device table MT. Having traversed patterning device MA, the beam B can pass through the lens PL, which focuses beam B onto target portion C of substrate W. With the aid of the second positioning apparatus (and interferometric measuring apparatus IF), the substrate table WT can be moved accurately, e.g. so as to position different target portions C in the path of beam PB. Similarly, the first positioning apparatus can be used to accurately position patterning device MA with respect to the path of beam B, e.g., after mechanical retrieval of the patterning device MA from a patterning device library, or during a scan. In general, movement of the object tables MT, WT can be realized with the aid of a long-stroke module (coarse positioning) and a short-stroke module (fine positioning). However, in the case of a stepper (as opposed to a step-and-scan tool) patterning device table MT may just be connected to a short stroke actuator, or may be fixed.
The depicted tool can be used in two different modes, step mode and scan mode. In step mode, patterning device table MT is kept essentially stationary, and an entire patterning device image is projected in one go (i.e., a single “flash”) onto a target portion C. Substrate table WT can be shifted in the x and/or y directions so that a different target portion C can be irradiated by beam PB.
In scan mode, essentially the same scenario applies, except that a given target portion C is not exposed in a single “flash.” Instead, patterning device table MT is movable in a given direction (the so-called “scan direction”, e.g., the y direction) with a speed v, so that projection beam B is caused to scan over a patterning device image; concurrently, substrate table WT is simultaneously moved in the same or opposite direction at a speed V=Mv, in which M is the magnification of the lens PL (typically, M=¼ or ⅕). In this manner, a relatively large target portion C can be exposed, without having to compromise on resolution.
LPA can include source collector module SO, illumination system (illuminator) IL configured to condition a radiation beam B (e.g. EUV radiation), support structure MT, substrate table WT, and projection system PS.
Support structure (e.g. a patterning device table) MT can be constructed to support a patterning device (e.g. a mask or a reticle) MA and connected to a first positioner PM configured to accurately position the patterning device;
Substrate table (e.g. a wafer table) WT can be constructed to hold a substrate (e.g. a resist coated wafer) W and connected to a second positioner PW configured to accurately position the substrate.
Projection system (e.g. a reflective projection system) PS can be configured to project a pattern imparted to the radiation beam B by patterning device MA onto a target portion C (e.g. comprising one or more dies) of the substrate W.
As here depicted, LPA can be of a reflective type (e.g. employing a reflective patterning device). It is to be noted that because most materials are absorptive within the EUV wavelength range, the patterning device may have multilayer reflectors comprising, for example, a multi-stack of molybdenum and silicon. In one example, the multi-stack reflector has a 40 layer pairs of molybdenum and silicon where the thickness of each layer is a quarter wavelength. Even smaller wavelengths may be produced with X-ray lithography. Since most material is absorptive at EUV and x-ray wavelengths, a thin piece of patterned absorbing material on the patterning device topography (e.g., a TaN absorber on top of the multi-layer reflector) defines where features would print (positive resist) or not print (negative resist).
Illuminator IL can receive an extreme ultra violet radiation beam from source collector module SO. Methods to produce EUV radiation include, but are not necessarily limited to, converting a material into a plasma state that has at least one element, e.g., xenon, lithium or tin, with one or more emission lines in the EUV range. In one such method, often termed laser produced plasma (“LPP”) the plasma can be produced by irradiating a fuel, such as a droplet, stream or cluster of material having the line-emitting element, with a laser beam. Source collector module SO may be part of an EUV radiation system including a laser for providing the laser beam exciting the fuel. The resulting plasma emits output radiation, e.g., EUV radiation, which is collected using a radiation collector, disposed in the source collector module. The laser and the source collector module may be separate entities, for example when a CO2 laser is used to provide the laser beam for fuel excitation.
In such cases, the laser may not be considered to form part of the lithographic apparatus and the radiation beam can be passed from the laser to the source collector module with the aid of a beam delivery system comprising, for example, suitable directing mirrors and/or a beam expander. In other cases, the source may be an integral part of the source collector module, for example when the source is a discharge produced plasma EUV generator, often termed as a DPP source.
Illuminator IL may comprise an adjuster for adjusting the angular intensity distribution of the radiation beam. Generally, at least the outer and/or inner radial extent (commonly referred to as σ-outer and σ-inner, respectively) of the intensity distribution in a pupil plane of the illuminator can be adjusted. In addition, the illuminator IL may comprise various other components, such as facetted field and pupil mirror devices. The illuminator may be used to condition the radiation beam, to have a desired uniformity and intensity distribution in its cross section.
The radiation beam B can be incident on the patterning device (e.g., mask) MA, which is held on the support structure (e.g., patterning device table) MT, and is patterned by the patterning device. After being reflected from the patterning device (e.g. mask) MA, the radiation beam B passes through the projection system PS, which focuses the beam onto a target portion C of the substrate W. With the aid of the second positioner PW and position sensor PS2 (e.g. an interferometric device, linear encoder or capacitive sensor), the substrate table WT can be moved accurately, e.g. so as to position different target portions C in the path of radiation beam B. Similarly, the first positioner PM and another position sensor PS1 can be used to accurately position the patterning device (e.g. mask) MA with respect to the path of the radiation beam B. Patterning device (e.g. mask) MA and substrate W may be aligned using patterning device alignment marks M1, M2 and substrate alignment marks P1, P2.
The depicted apparatus LPA could be used in at least one of the following modes, step mode, scan mode, and stationary mode.
In step mode, the support structure (e.g. patterning device table) MT and the substrate table WT are kept essentially stationary, while an entire pattern imparted to the radiation beam is projected onto a target portion C at one time (i.e. a single static exposure). The substrate table WT is then shifted in the X and/or Y direction so that a different target portion C can be exposed.
In scan mode, the support structure (e.g. patterning device table) MT and the substrate table WT are scanned synchronously while a pattern imparted to the radiation beam is projected onto target portion C (i.e. a single dynamic exposure). The velocity and direction of substrate table WT relative to the support structure (e.g. patterning device table) MT may be determined by the (de-) magnification and image reversal characteristics of the projection system PS.
In stationary mode, the support structure (e.g. patterning device table) MT is kept essentially stationary holding a programmable patterning device, and substrate table WT is moved or scanned while a pattern imparted to the radiation beam is projected onto a target portion C. In this mode, generally a pulsed radiation source is employed and the programmable patterning device is updated as required after each movement of the substrate table WT or in between successive radiation pulses during a scan. This mode of operation can be readily applied to maskless lithography that utilizes programmable patterning device, such as a programmable mirror array.
As shown, LPA can include the source collector module SO, the illumination system IL, and the projection system PS. The source collector module SO is constructed and arranged such that a vacuum environment can be maintained in an enclosing structure ES of the source collector module SO. An EUV radiation emitting hot plasma HP may be formed by a discharge produced plasma source. EUV radiation may be produced by a gas or vapor, for example Xe gas, Li vapor or Sn vapor in which the hot plasma HP is created to emit radiation in the EUV range of the electromagnetic spectrum. The hot plasma HP is created by, for example, an electrical discharge causing at least partially ionized plasma. Partial pressures of, for example, 10 Pa of Xe, Li, Sn vapor or any other suitable gas or vapor may be required for efficient generation of the radiation. In an embodiment, a plasma of excited tin (Sn) is provided to produce EUV radiation.
The radiation emitted by the hot plasma HP is passed from a source chamber SC into a collector chamber CC via an optional gas barrier or contaminant trap CT (in some cases also referred to as contaminant barrier or foil trap) which is positioned in or behind an opening in source chamber SC. The contaminant trap CT may include a channel structure. Contamination trap CT may also include a gas barrier or a combination of a gas barrier and a channel structure. The contaminant trap or contaminant barrier CT further indicated herein at least includes a channel structure, as known in the art.
The collector chamber CC may include a radiation collector CO which may be a so-called grazing incidence collector. Radiation collector CO has an upstream radiation collector side US and a downstream radiation collector side DS. Radiation that traverses radiation collector CO can be reflected off a grating spectral filter SF to be focused in a virtual source point IF along the optical axis indicated by the dot-dashed line ‘O’. The virtual source point IF can be referred to as the intermediate focus, and the source collector module can be arranged such that the intermediate focus IF is located at or near an opening OP in the enclosing structure ES. The virtual source point IF is an image of the radiation emitting plasma HP.
Subsequently the radiation traverses the illumination system IL, which may include a facetted field mirror device FM and a facetted pupil mirror device pm arranged to provide a desired angular distribution of the radiation beam B, at the patterning device MA, as well as a desired uniformity of radiation amplitude at the patterning device MA. Upon reflection of the beam of radiation B at the patterning device MA, held by the support structure MT, a patterned beam PB is formed and the patterned beam PB is imaged by the projection system PS via reflective elements RE onto a substrate W held by the substrate table WT.
More elements than shown may generally be present in illumination optics unit IL and projection system PS. The grating spectral filter SF may optionally be present, depending upon the type of lithographic apparatus. Further, there may be more mirrors present than those shown in the figures, for example there may be 1-6 additional reflective elements present in the projection system PS.
Collector optic CO can be a nested collector with grazing incidence reflectors GR, just as an example of a collector (or collector mirror). The grazing incidence reflectors GR are disposed axially symmetric around the optical axis 0 and a collector optic CO of this type may be used in combination with a discharge produced plasma source, often called a DPP source.
Source collector module SO may be part of an LPA radiation system. A laser LA can be arranged to deposit laser energy into a fuel, such as xenon (Xe), tin (Sn) or lithium (Li), creating the highly ionized plasma HP with electron temperatures of several 10's of eV. The energetic radiation generated during de-excitation and recombination of these ions is emitted from the plasma, collected by a near normal incidence collector optic CO and focused onto the opening OP in the enclosing structure ES.
The invention may further be described using the following clauses:
1. A method for increasing a depth of focus for a lithography system, the method comprising:
2. The method of clause 1, the iterative variation further comprising iteratively varying, concurrently, the optical spectrum, the mask pattern, and the pupil design to provide the modified optical spectrum, a modified mask pattern, and a modified pupil design.
3. The method of clause 1, wherein the optical spectrum is provided in a series of pulses, wherein a center wavelength in at least one peak in the optical spectrum is further varied in every other pulse to shift by approximately 500 fm.
4. The method of clause 1, wherein the optical spectrum comprises a multi-color optical spectrum.
5. The method of clause 4, wherein the multi-color optical spectrum includes at least two different peaks having a peak separation.
6. The method of clause 4, further comprising delivering light corresponding to the multi-color spectrum by a light source, wherein the multiple colors of light are delivered at different times.
7. The method of clause 1, the iterative variation further comprising iteratively varying a bandwidth of a peak in the optical spectrum.
8. The method of clause 1, the iterative variation further comprising iteratively varying a peak separation between two peaks in the optical spectrum.
9. The method of clause 1, the iterative variation further comprising varying a main feature in the mask pattern to increase the depth of focus.
10. The method of clause 9, wherein the main feature includes an edge location and a mask bias location, and the iterative variation further comprises varying at least one of the edge location or the mask bias location.
11. The method of clause 9, wherein two mask bias locations can be symmetrically varied about a center of the main feature.
12. The method of clause 1, the iterative variation further comprising varying a sub-resolution assist feature in the mask pattern to increase the depth of focus.
13. The method of clause 12, the iterative variation further comprising varying of the sub-resolution assist feature by changing at least one of a position or width of the sub-resolution assist feature.
14. The method of clause 1, the iterative variation further comprising performing the iterative variation at least until a process window, based on an area defined at least partly by a dose and an exposure latitude, is increased.
15. The method of clause 1, the iterative variation further comprising performing the variation at least until a product of the depth of focus and an exposure latitude is increased.
16. The method of clause 1, the iterative variation further comprising constraining the variation to increase a contrast at the aerial image when the variation of the optical spectrum results in an increase in bandwidth of a peak in the optical spectrum.
17. The method of clause 1, wherein the component is a laser and the laser is configured to provide light based on the modified optical spectrum.
18. The method of clause 1, wherein the component is a mask, and the method further includes manufacturing the mask based on the modified mask pattern.
19. The method of clause 1, wherein the component is a pupil comprising a diffracted optical element, and the method further includes manufacturing the pupil based on the modified pupil design.
20. The method of clause 1, wherein the component is a pupil comprising a mirror array, and the method further includes configuring the pupil based on the modified pupil design.
21. The method of clause 2, further comprising:
22. A method for increasing a depth of focus for a lithography system, the method comprising:
23. The method of clause Error! Reference source not found., wherein the optical spectrum comprises a multi-color optical spectrum.
24. The method of clause Error! Reference source not found., wherein the multi-color optical spectrum includes at least two different peaks having a peak separation.
25. The method of clause Error! Reference source not found., further comprising delivering light corresponding to the multi-color spectrum by a light source, wherein the multiple colors of light are delivered at different times.
26. The method of clause Error! Reference source not found., the iterative variation further comprising iteratively varying a bandwidth of a peak in the optical spectrum.
27. The method of clause Error! Reference source not found., the iterative variation further comprising iteratively varying a peak separation between two peaks in the optical spectrum.
28. The method of clause Error! Reference source not found., the iterative variation further comprising performing the iterative variation at least until a process window, based on an area defined at least partly by a dose and an exposure latitude, is increased.
29. The method of clause Error! Reference source not found., the iterative variation further comprising performing the variation at least until a product of the depth of focus and an exposure latitude is increased.
30. The method of clause Error! Reference source not found., the iterative variation further comprising constraining the variation to increase a contrast at the aerial image when the variation of the optical spectrum results in an increase in bandwidth of a peak in the optical spectrum.
31. The method of clause Error! Reference source not found., further comprising:
32. A computer program product comprising a non-transitory computer readable medium having instructions recorded thereon, the instructions when executed by a computer implementing the method of any of the above clauses.
The concepts disclosed herein may simulate or mathematically model any generic imaging system for imaging sub wavelength features, and may be especially useful with emerging imaging technologies capable of producing increasingly shorter wavelengths. Emerging technologies already in use include EUV (extreme ultra violet), DUV lithography that is capable of producing a 193 nm wavelength with the use of an ArF laser, and even a 157 nm wavelength with the use of a Fluorine laser. Moreover, EUV lithography is capable of producing wavelengths within a range of 20-50 nm by using a synchrotron or by hitting a material (either solid or a plasma) with high energy electrons in order to produce photons within this range.
While the concepts disclosed herein may be used for imaging on a substrate such as a silicon wafer, it shall be understood that the disclosed concepts may be used with any type of lithographic imaging systems, e.g., those used for imaging on substrates other than silicon wafers.
The descriptions above are intended to be illustrative, not limiting. Thus, it will be apparent to one skilled in the art that modifications may be made as described without departing from the scope of the claims set out below.
This application claims priority of U.S. application 62/747,951 which was filed on Oct. 19, 2018 and which is incorporated herein in its entirety by reference.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/EP2019/077587 | 10/11/2019 | WO | 00 |
| Number | Date | Country | |
|---|---|---|---|
| 62747951 | Oct 2018 | US |
