Methods for Sample Preparation and Observation, Charged Particle Apparatus

Abstract

In an SEM observation in a depth direction of a cross section processed by repeated FIB cross-sectioning and SEM observation to correct a deviation in an observation field of view and a deviation in focus, are corrected, the deviations occurring when a processed cross section moves in the depth direction thereof; information on a height and a tilt of a surface of cross section processing area is calculated before the processing, the above information is used, the deviation in a field of view and the deviation in focus in SEM observation, which correspond to an amount of movement of the cross section at a time of the processing, are predicted, and the SEM is controlled based on the predicted values.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to methods of: processing a continuous cross section in a local area of a sample surface of a semiconductor device, a new material or the like by using a focused ion beam (hereinafter referred to as an FIB); and observing the continuous cross section by using a scanning electron microscope (hereinafter referred to as an SEM) and the like. The present invention also relates to a charged particle beam apparatus used for the methods.

2. Description of the Related Art

In Kato and Otsuka [2003] THE TRC NEWS, No. 84, pp. 40-43, Toray Research Center, a dual beam apparatus is described in which both irradiation axes in an FIB system and an electron beam system cross at an acute angle, and in which an image of a single area can be displayed in the form of scanning images of the two beams, that is, an image taken by a scanning ion microscope (hereinafter referred to as an “SIM image”) and an SEM image. As can be expected from the case of the electron beam system, by processing and forming a cross section with the FIB (which is hereinafter referred to as “FIB cross-sectioning”), observation of the processed cross section using the SEM (the observation with the SEM is hereinafter referred to as “SEM observation”) can be performed without tilting a sample. By repeatedly performing the FIB cross-sectioning and the SEM observation, it is possible to accumulate sequentially cross-sectioned images in a depth direction of a processed surface. That is, three dimensional (hereinafter referred to as 3D) observation can be performed. In Japanese Patent No. 2852078, a technology is disclosed in which heights of a sample surface at a plurality of points are detected using a laser beam, and a tilt of the sample surface is calculated by using the information on heights at the plurality of points.

In the SEM observation in a depth direction of a processed cross section, by repeatedly performing the FIB cross-sectioning and the SEM observation, since the processed cross section moves in the depth direction, a deviation in an observation field of view and a deviation in focus occur in the SEM observation due to the movement of the processed cross section.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a method by which a deviation in an observation field of view and a deviation in focus in the SEM observation are corrected, and the SEM observation is continuously performed.

As a method by which a field of view and a focus in an SEM observation are caused to track the move of a processed cross section, one may consider a method by which a structure, serving as a mark within a moving cross section of a sample, is searched and tracked so that the position of the field of view is corrected and automatic focusing is achieved by automatically adjusting a focus on a cross section under observation as needed. However, the correction of the position of the field of view and the automatic focusing described above require searching operations (operations in a control computer) to achieve optimum states, respectively. Since such searching operations generally need several seconds to several tens of seconds to be completed, it is not possible during this time to perform the SEM observation on the processed cross section which is in a correct field of view and in focus.

In the present invention, to solve the above problem, for example, a height to a surface of a cross section processing area and a slope of the surface are calculated in advance, and using the above information, a deviation in a field of view and a deviation in focus in an SEM observation, which correspond to an amount of movement of a cross section at a time of processing, are predicted and corrected. A tracking device of the present invention is one by which the field of view and the focus are controlled to come to a predicted state. Since an SEM is to only track a predicted state, FIB cross-sectioning and SEM observation on a processed cross section can be not only repeatedly but also simultaneously performed.

In methods of making and observing a sample of the present invention in which a cross section formed on a sample surface by processing the sample surface using, for example, an FIB is moved in a direction the cross section moves backward; the cross section is irradiated with an electron beam from a direction of an axis which obliquely crosses an irradiation axis of the FIB; and the sample cross section moving as above is observed with the SEM, tilting information on the sample surface is obtained; using an angle formed by an irradiation axis of the FIB and an irradiation axis of the electron beam and the tilting information on the sample surface, correction coefficients are obtained which correspond to an amount of movement of a field of view of the SEM and an amount of a deviation of a focus position of the same, the movement of a field of view and the deviation of a focus position occurring due to moving of the sample cross section at a time of processing the same; and the movement of a field of view and the deviation of a focus position of the SEM are corrected using the correction coefficients, and the field of view and the focus position are caused to track the moving of the sample cross section.

The tilting information on the sample surface is obtained by using a relationship between a coordinate position of an SIM image of a mark formed, for example, on the sample surface and a coordinate position of the SEM image of the same. In a rectangular coordinate system with an irradiation axis of the FIB set as a Z_i axis and with a plane perpendicular to the Z_i axis set as a X_iY_i plane, when setting an X_i axis within a plane containing the irradiation axis of the FIB and the irradiation axis of the electron beam, the tilting information on the sample surface corresponds to tilting angles of the sample surface, the sample surface being tilted relative to the X_i axis with respect to the Y_i axis as an axis of rotation. The tilting angle is obtained by using positions of mark images in the SIM image observed for two marks having different X_i axis directional components, positions of mark images in an SEM image observed for the two marks, and an angle formed by the irradiation axis of the FIB and the irradiation axis of the electron beam.

A charged particle beam apparatus of the present invention in which a cross section formed on a sample surface by processing the sample surface using the FIB is moved in a direction the cross section moves backward; and the sample cross section moving as above is observed with an SEM includes: a sample stage for holding a sample; an FIB system in which the FIB is irradiated on the sample held on the sample stage and a sample cross section is processed; an electron beam system having an irradiation axis which crosses an irradiation axis of the FIB on the sample; a detector for detecting a sample signal emitted from the sample due to an irradiation of the FIB or an electron beam; a displaying section for displaying an SIM image and/or an SEM image; and a beam control section for controlling the FIB system and the electron beam system. Further, in the charged particle beam apparatus of the present invention, the beam control section holds correction coefficients for an amount of movement of a field of view of the SEM and an amount of a deviation of a focus position of the same, the movement of a field of view and the deviation of a focus position occurring due to moving of the sample cross section at a time of processing the same; corrects the movement of a field of view and the deviation of a focus position of the SEM using the correction coefficients; and controls the field of view and the focus position to track the moving of the sample cross section.

The beam control section obtains the tilting information on the sample surface by using a relationship between a coordinate position of an SIM image of a mark formed on the sample surface and a coordinate position of a SEM image of the same; and can obtain the correction coefficients for the amount of movement of a field of view of the SEM and the amount of a deviation of a focus position of the same by using the angle formed by the irradiation axis of the FIB and the irradiation axis of the electron beam and the tilting information on the sample surface.

The present invention is capable of causing a field of view and a focus in an SEM observation to track a processed cross section even if the processed cross section moves in its depth direction during the repeated performing of FIB cross-sectioning and SEM observation of the processed cross section.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic block diagram of a charged particle beam apparatus of the present invention.

FIG. 2 is an explanatory view showing examples of a method of making a cross section sample using an FIB and that of performing an SEM observation (the case where a sample surface is flat, and consistent with an X_iY_i plane).

FIG. 3 is an explanatory view showing other examples of a method of making a cross section sample using an FIB and that of performing an SEM observation (the case where a to-be-analyzed surface of a sample is parallel to an X_i-axis and is tilted at an angle θ relative to the X_iY_i plane).

FIGS. 4A to 4C are explanatory views showing still other examples of a method of making a cross section sample using an FIB and that of performing an SEM observation (the case where although a to-be-analyzed surface of a sample can be approximated by a plane, it is not parallel to the X_i and Y_i axes and tilted relative to both axes at angles θ_x and θ_y, respectively.)

FIG. 5 is a diagrammatic view showing a measuring apparatus, in which a laser microscope is used and a height to a sample surface is denoted as Z.

FIGS. 6A to 6C are explanatory views showing bar-like marks.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Embodiments of the present invention are described hereinafter with reference to accompanying drawings.

First Embodiment

Referring to FIGS. 1 to 4, an example of a constitution of a charged particle beam apparatus is described. FIG. 1 is a schematic block diagram of a charged particle beam apparatus of a first embodiment. Hereinafter, as coordinate systems for an FIB system 1, an electron beam system 3, and a sample 6, rectangular coordinate systems are adopted with coordinates (X, Y, Z) while the coordinates for the irradiation system 1, the irradiation system 3, and the sample 6 are differentiated from each other by attaching lower indices i, e, and s, respectively. The FIB system 1 and the electron beam system 3 are attached to a sample chamber 5, and an FIB irradiation axis (−Z_i) and an electron beam irradiation axis (−Z_e) cross over the sample 6 at an acute angle α (60 degrees in the present embodiment). The angle α at the above crossing is a fixed value determined by an apparatus and is known in advance. At this point of the crossing, coordinate origins O_i and O_e for the both coordinates are respectively set. For the sample coordinates, an X_s-Y_s plane is put over a sample surface, and the coordinate axis X_s is put within a plane spanned by two coordinate axes Zi and Ze. An origin O_s is located so that the position thereof coincides with those of the origins O_i and O_e.

Charged particles and an X-rays emitted from the sample are detected by a charged-particle detector 7 and an X-ray detector 8. Since the position of the X-ray detector 8 to be provided is hidden behind the electron beam system 3, the detector 8 is shown under the apparatus in FIG. 1 with that removed from the apparatus. An irradiation system position-adjusting section 9 is mechanically moved and adjusted in a plane parallel to an X_iY_i plane with the FIB system 1 put over the sample chamber 5, whereby the FIB irradiation axis 2 and the electron beam irradiation axis 4 approximately cross. In an adjustment carried out through a mechanical movement, there is a dislocation on the order of tens of microns left after completely crossing. This dislocation was eliminated by shifting at least one of beam deflection irradiation areas of an irradiation ion beam and an irradiation electron beam. The amount of the above shifting does not come into a transformation between coordinates of distance in the following respective coordinates. The sample 6 is mounted on a sample stage 10 on which the sample 6 is capable of moving (in the three directions of the X_i, Y_i, and Z_i-axes of the FIB system), rotating (with respect to the Z_i-axis as a rotational axis), and tilting (the Y_i-axis being a tilting axis). A surface of the sample 6 is adjusted to the crossing point (the origins O_i and O_e) of the both irradiation axes as described above. A beam control section 15 controls irradiating, scanning, and the like of a an FIB and an electron beam, and further also controls imaging for an SEM image, an SIM image, and an X-ray image with charged particles, X-rays, and the like, which emit from the sample in synchronization with the scanning and which serve as luminance signals. These images are displayed on an image display device 13 along with a window image plane for a beam control. In the present embodiment in the drawing, an SIM image 14a and an SEM image 14b are displayed on the image display device 13. A vacuum pumping system 11 with which the sample chamber is evacuated is driven by a vacuum pumping system power. A SEM observation-field-of-view tracking section 16 to be described later is included in the beam control section 15.

FIGS. 2 to 4 are explanatory views for a method of making of a cross section sample using an FIB and for a method of performing SEM observation in the present embodiment. FIG. 2 is an aspect of the present embodiment in which a local observation surface (X_s-Y_s plane) of the sample coincides with the X_iY_i plane of the ion irradiation system coordinates. A region 21 of the sample on which a three dimensional (3D) analysis is intended to be performed is approximated by a rectangular parallelepiped having a width W, a depth D, and a length L, with a cross section 20 being an end. Typical sizes of W, D, and L are 8 μm, 8 μm, and 20 μm, respectively.

First, an FIB cross-sectioning is performed on a rectangular opening (width W, depth D, length Lo) 22 so that the cross section 20 is exposed. This cross section is an initial one on which an SEM observation is performed, and an observation field of view and a focus of an SEM image are adjusted to the above cross section. The cross section 20 is formed in a rigorous manner so that it is tilted at an angle of 1 to 3 degrees relative to a Y_i-Z_i plane due to sputtering characteristics of ion. The rectangular opening 22 is used as an incidence path for an electron beam to perform the SEM observation on the cross section 20. Accordingly, the length Lo of the opening needs to be at least one on the order of D·tan α.

Next, to perform 3D observation, the processed cross section 20 is moved in a continuous or stepwise manner to −X_i direction (in FIG. 2, X_i,s→X_i,2) by a beam deflection shift in a scanning area of FIB cross-sectioning. When the amount of the movement is large, the field of view of the SEM observation is displaced to a large extent from the position X_i,s of the cross section, resulting in an out-of-focus SEM image. A point of the present invention is that an observation field of view and a focus of an SEM image are caused to track a moving cross section as the cross section moves. To enable the above the tracking, amounts of correction for a deviation in an observation field of view and for a deviation in focus in the SEM observation, the amounts of which correspond to the amount of movement of the processed cross section, are measured prior to the operations of cross-sectioning and an observation, and an SEM state may be set as needed according to the above described amount of correction when performing an operation of cross-sectioning. A method of measuring the above amounts of correction is described, hereinafter.

In FIG. 2, when denoting the amount of movement of the cross section 20 as ΔX_i (>0), values ΔY_e and ΔZ_e for movement are expressed as follows in terms of the crossing angle α, which is formed by the electron beam axis and the FIB axis in the electron beam coordinates.

ΔY_e=cos α·ΔX_i  (1)

ΔZ_e=−sin α·ΔX_i  (2)

That is, as the amounts of correction for the observation field of view and the focus of the SEM observation, ΔY_e and ΔZ_e calculated from the above respective equations may be set according to the amount of the beam deflection shift in the scanning area for FIB cross-sectioning.

In FIGS. 2 to 4, and FIG. 6, coordinate axes X_e′, Y_e′, and Z_e′ correspond to those obtained by moving the X_e, Y_e, and Z_e axes in the electron beam system through the translating of the origin O_e over the Z_e-axis. To avoid overlapping of an explanatory view on the X_eY_e plane and another view, a description is given by using the X_e′-Y_e′ plane which has been translated in parallel over the Z_e-axis. The X_eY_e plane and the X_e′-Y_e′ plane are completely equivalent. Further, to obtain information on the tilted angle of a local surface of a to-be-analyzed target portion, symbols b₁ to b₄ are provided as marks on a sample surface in the vicinity of the local area. These marks are formed on corners of a rectangle having edges which are parallel to the X_i and Y_i axes, as remains of FIB cross-sectioning or deposited layers having used FIB-assisted deposition. Symbols a₁ to a₄ are projections of b₁ to b₄ projected on the X_iY_i plane. Symbols c₁ to c₄ and d₁ to d₄ are projections of a₁ to a₄ and b₁ to b₄ projected on the X_eY_e plane (or X_e′-Y_e′ plane), respectively. As in Eqs. (1) and (2), when the X_s-Y_s plane for the sample surface coincides with the X_iY_i plane, amounts of correction, ΔY_e and ΔZ_e, can be calculated even if there are no marks.

Next, referring to FIG. 3, a description is given for the case where a local surface of a to-be-analyzed target portion of the sample is in parallel to the Y_i-axis (i.e. a tilted angle θ_y=0 where θ_y denotes an angle tilted relative to the Y_i-axis) and is, however, tilted at a small angle θ_x relative to the X_i-axis. Since the tilted angle θ_x is an unknown value, it is necessary to find in advance the value of the tilted angle θ_x and seek in advance amounts of correction for a deviation of an observation field of view and for a deviation in focus in order to track the cross section 20 under the SEM observation. To find out the above tilted angle θ_x, at least two different kinds of marks having different X_i values are provided on a sample surface in the vicinity of the position of a sample cross section to be made. A local area on the sample to which the marks are provided can be approximated by a plane. FIG. 3 is an example in which four marks b₁ to b₄ are provided to a sample surface. Since a mark plane (X_s-Y_s plane) is tilted at an angle θ_x relative to the XS-YS plane, when denoting as B an angle which is formed by the mark plane and the Y_e axis in the electron beam coordinates, the following relationship between β, θ_x and α is established.

β=α−θ_x  (3)

For the distance between the marks b₁ and b₄ on the sample (hereinafter the distance between marks is denoted with an underline, e.g., b₁b₄), and for the distances between the marks a₁a₄ and between the marks d₁d₄, in which, using an SIM image and an SEM image, correction is made with image magnification, and thereafter measurement is made. Then relationships among the above distances b₁b₄, a₁a₄ and d₁d₄ are respectively expressed by using θ_x and β as follows.

a ₁ a ₄=cos θ_x·b₁b₄  (4)

d ₁ d ₄=cos β·b₁b₄  (5)

Using Eqs. (3) to (5), the following is obtained.

cos(α−θ_x)/cos θ_x=d₁d₄/a₁a₄  (6)

From the equation above, θ_x can be expressed by the following equation.

θ_x=arctan [{1−(d₁d₄/a₁a₄)/cos α} tan α]  (7)

Since the distances d₁d₄ and a₁a₄ are measured values obtained by using the both images, and α is a known value determined with a charged beam apparatus, the angle θ_x can be calculated using Eq. (7). As long as there are two marks having different X_i values such as b₁ and b₄, θ_x can be calculated. That is, any other one of the marks b₁ and b₃, b₂ and b₃, and b₂ and b₄ may be accepted. This is because the distances of projected marks, a₁a₃, a₂a₃, and a₂a₄, the projected marks being projections of the above marks projected on the X_iY_i plane, have components in the direction of the X_i-axis which all coincide with the distance a₁a₄.

Using a calculated value θ_x obtained by Eq. (7), an amount of the movement of a field of view denoted as ΔY_e and an amount of the deviation of a focus position denoted as ΔZ_e in the electron beam coordinates, the both amounts corresponding to the amount of movement of the cross section 20 denoted by ΔX_i, are expressed by Eqs. (8) and (9) being similar to Eqs. (1) and (2), and are predictable in advance according to ΔX_i (while ΔX_e=0).

ΔY_e=K_y·ΔX_i  (8)

ΔZ_e=K_z·ΔX_i  (9)

where

K _y=cos(α−θ_x)/cos θ_x  (10)

K _z=−sin(α−θ_x)/cos θ_x  (11)

Here, K_y and K_z respectively denote correction coefficients of ΔY_e which is the amount of the movement of a field of view and ΔZ_e which is the amount of the deviation of a focus position. It is noted, in particular, that if θ_x is set as θ_x=0 in Eqs. (8) and (9), these equations coincide with Eqs. (1) and (2). Moreover, ΔZ_i corresponding to ΔX_i is expressed as follows.

ΔZ_i=ΔX_i·tan θ_x  (12)

Last, referring to FIG. 4, a description is given for the case where small tilted angle components to the X_i and Y_i axes on the local surface of the to-be-analyzed target portion of the sample are θ_x and θ_y, respectively. FIG. 4A is a perspective diagram showing a relationship between the marks b₁ to b₄ formed on the sample surface and the respective coordinate systems. FIG. 4B is a diagram showing projected images of the marks b₁ to b₄ projected on the X_iY_i plane. FIG. 4C is a diagram showing projected images of marks a₁ to a₄ and marks b₁ to b₄, all being projected on the X_eY_e plane. As in the case of FIG. 3, the symbols a₁ to a₄ indicate projected positions (refer to FIG. 4B) of the marks b₁ to b₄ projected on the X_iY_i plane; and the symbols c₁ to c₄ and d₁ to d₄ indicate projected positions (refer to FIG. 4C) of the symbols a₁ to a₄ and b₁ to b₄ projected on the X_eY_e plane. Even if the symbols a₁ to a₄ form a rectangle, the symbols b₁ to b₄ and d₁ to d₄ form parallelograms because of the presence of the tilts θ_x and θ_y. An angle θ_e,y, which is formed by a tilt of a line segment d₁d₄ in an SEM image to the X_e-axis, has a relationship with θ_y as expressed by the following equation.

θ_y=arctan [tan θ_e,y/sin α]  (13)

Setting the positional coordinates of points d_j (j=1 to 4) in an SEM image as (X_e,j, Y_e,j), tan θ_e,y can be calculated by the following equation.

tan θ_e,y=(Y_e,2−Y_e,1)/(X_e,2−X_e,1)  (14)

Here, since the distance ratio, (Y_e,2−Y_e,1)/(X_e,2−X_e,1), corresponds to a distance ratio, d₂c₂/c₂c₁, in FIG. 4C, θ_y can be calculated by Eqs. (13) and (14). An amount of the movement of a field of view denoted as ΔY_e and an amount of the deviation of a focus position denoted as ΔZ_e in the electron beam coordinates, the both amounts corresponding to the amount of movement of the cross section 20 denoted by ΔX_i, are expressed by the same equations as Eqs. (8) and (9). θ_y is not included in equations for calculating ΔY_e and ΔZ_e. There need to be at least three out of the marks b₁ to b₄ in order to measure a local surface (a plane approximation) tilted in an arbitrary direction, i.e., θ_y and θ_y. However, there needs to be a calculation of only θ_x in order to predict ΔY_e and ΔZ_e. Accordingly, it suffices if there are at least two marks having different X_i values, i.e., a pair of marks out of b₁ and b₄, b₁ and b₃, b₂ and b₃, or b₂ and b₃. In a calculation of θ_x, if the pair is b₁ and b₄, θ_x is the same as the one obtained by Eq. (7). For the other pairs (denoted as b_i, b_j in general), if a component of the distance a_ia_j in the X_i-direction and a component of the distance d_id_i in the Y_e-direction are, respectively, expressed as (a_ia_j)_x and (d_id_j)_y, these components can be measured. Accordingly, the following equation, which is equivalent to Eq. (7), may be used.

θ_x=arctan [{1−((d_id_j)_y/(a_ia_j)_x)/cos α}/tan α]  (15)

Next, a description is given for a procedure of 3D observation in which FIB cross-sectioning and SEM observation for observing a processed cross section are repeatedly (or sequentially) performed.

(i) Setting of a 3D Observation Target Area and Positional Adjustment of a Sample Stage

A size (width W, depth D, length L) and a position of a 3D observation target area are determined, and the 3D observation target area is adjusted to the vicinity of an intersection of both beams by performing XYZ movement of a sample stage. Next, with a to-be-formed cross section placed parallel to the X_iY_i plane, and with a Y_i component of the cross section's movement set to the value 0, the sample stage is rotated so that the cross section moves in the direction of −X_i axis.

(ii) Forming of Marks

Four marks are formed in the vicinity of (or to surround) a surface of a setting area in the 3D observation target area. Respective marks are formed at positions corresponding to corners of a rectangle on the X_iY_i plane, edges of the rectangle being parallel to the X_i and Y_i axes. Although the number of marks is generally four, which is the same as the number of corners of a rectangle, it suffices if there are at least three marks out of the four marks. When a local surface of an observation area is in parallel to the X_iY_i plane in particular, marks are not necessary. When the surface is slightly tilted only in a direction of the X_i axis, it suffices if there are at least two marks having different X_i values. Although the shape of the mark is normally a round-shaped opening, or a groove having an “X”-like shape or a “+”-like shape, being cut out by performing FIB cross-sectioning, it may be a deposited layer locally formed by performing an FIB-assisted deposition.

(iii) Registration of Positional Coordinates (X_i, Y_i) of Formed Marks Positional coordinates (X_i, Y_i) of the formed marks are registered. When the marks are formed by performing FIB cross-sectioning, coordinate data in the cross-sectioning can be used as positional coordinates (X_i, Y_i) of the marks.

(iv) Observation of an SEM Image of a Mark, and Registration of Positional Coordinates (X_e, Y_e) thereof.

An SEM image of a mark is observed, and positional coordinates (X_e, Y_e) thereof are registered.

(v) Calculation of Tilted Angles θ (θ_x, θ_y) of a To-be-Observed Local Sample Surface

Tilted angles θ (θ_x, θ_y) are calculated using Eqs. (7), (13) and (14).

(vi) Calculation of Correction Coefficients K_y and K_z

Correction coefficients K_y and K_z for an amount of the movement of a field of view, ΔY_e, and an amount of the deviation of a focus position, ΔZ_e, are respectively calculated by using Eqs. (10) and (11).

(vii) Setting of Conditions of FIB Cross-Sectioning and a Movement Speed of the Cross Section

FIB conditions (conditions of a beam diameter, a beam current, and irradiation) and a movement speed V_t of the cross section are registered.

(viii) Setting of an Initial Value and a Final Value of X_i on the Moving Cross Section

An initial value X_i,s and a final value X_i,e of X_i on the moving cross section are set.

(ix) Forming of a Start Cross Section

In an example of FIG. 2, a left end of the rectangular opening 22 is set in a position a little short of a position represented by the initial value X_i, X_i,s, for processing the rectangular opening. Then, the side surface of the opening is moved to the position represented by the value X_i,s by processing the unprocessed portion up to the position represented by the value X_i,s under the conditions of the FIB cross-sectioning and irradiation (or scanning). The side surface of the opening thus moved is a start cross section.

(x) Registration of Information of a Field of View and a Focus Position of an SEM Observation Image of a Start Cross Section

An SEM observation image is adjusted to a start cross section under 3D observation, and start values (X_e,s, Y_e,s, Z_e,s) for information on an observation field of view (X_e, Y_e) and that of focus position Z_e are registered. Start values (X_i,s, Y_i,s) and final values (X_i,e, Y_i,e) for positional information (X_i, Y_i) of a cross section formed by the FIB cross-sectioning are also registered. As the kind of signal for an observation image of an SEM cross section, at least one of secondary electrons, reflected electrons, and X-rays is selected, and registered along with the observation conditions. Then, the observation image of the start cross section is obtained and registered.

(xi) Moving-and-Processing of a Cross Section

A cross section is moved and processed using the FIB for processing which is registered in (vii) described above. Concurrently with the processing time t, an FIB irradiation area is moved in the −X_i direction, and in synchronization therewith, the processed cross section is also moved. An amount of the movement (>0) is set as ΔX_i. ΔX_i can be expressed by the product of the movement speed of a cross section Vs and the processing time t[ΔX_i=V_s·t].

(xii) Calculation of Amount of Correction for Information of an Observation Field of View and a Focus Position in SEM Observation

ΔY_e and ΔZ_e of amounts of correction (ΔX_e, ΔY_e, ΔZ_e) for information (X_e, Y_e, Z_e) of an observation field of view and a focus position in an SEM observation are calculated using Eqs. (8) and (9), respectively. For correction coefficients K_y and K_z, calculated values in (vi) are used. ΔX_e is constantly set to the value 0.

(xiii) Setting of Coordinates of an Observation Field of View and a Focus Position of an SEM Observation Image

Coordinate values (X_e+ΔX_e, Y_e+ΔY_e, Z_e+ΔZ_e) of an observation field of view and a focus position of an SEM observation image are set.

(xiv) Obtaining of SEM Observation Image

An observation image of an SEM cross section is obtained, and recorded as a function of an amount ΔX_i of movement of a cross section. Amounts of movement, ΔY_i and ΔZ_i, of the cross section in the Y_i and Z_i directions, which correspond to ΔX_i, are, respectively, zero and an amount obtained by using Eq. (12) as a function of ΔX_i.

(xv) End of Moving-and-Processing

When the processed cross section is moved to the final position (X_i=X_i,e) set in (viii), the operation of the moving-and-processing is terminated.

(xvi) 3D Analysis of SEM Images

3D images are generated using a sequence of SEM images of cross sections recorded in (xiii) as functions of the amounts of movement (ΔX_i, ΔY_i, ΔZ_i) or ΔX_i of cross sections.

The SEM observation-field-of-view tracking section 16 includes beam control calculation software for achieving the processes (i) to (xv), and a process-observation flow display window. An example of items in the process-observation flowchart display window of the SEM observation-field-of-view tracking section 16 is shown in Table 1. The above described procedures for respective items are described in the column of Contents. Contents of the beam control calculation software are to execute calculations shown in the respective items of the procedures.

Window Items                  Contents
1. Positional Adjustment of a (i) Setting of a 3D Observation Target
Sample Stage                  Area and Positional Adjustment of a
                              Sample Stage
2. Marking                    (ii) Forming of Marks
                              (iii) Registration of Positional Coordinates
                              (Xi, Yi) of Formed Marks
3. Observation of SEM Image   (iv) Observation of an SEM Image of a
                              Mark, and Registration of Positional
                              Coordinates (Xe, Ye) thereof
                              (v) Calculation of Tilted Angles θ (θx, θy)
                              of a To-be-Observed Local Sample
                              Surface
                              (vi) Calculation of Correction Coefficients
                              Ky and Kz
4. Registration of Conditions (vii) Setting of Conditions of FIB
of FIB Cross-Sectioning       Cross-Sectioning and a Movement Speed
                              of the Cross-Section
                              (viii) Setting of an Initial Value and a
                              Final Value of Xi on the Moving Cross
                              Section
5. Forming of Start Cross     (ix) Forming of a Start Cross Section
Section
6. Registration of Conditions (x) Registration of Information of a Field
of SEM Observation            of View and a Focus Position of an SEM
                              Observation Image of a Start
                              Cross-Section
7. Moving-and-Processing of   (xi) Moving-and-Processing of a Cross
Cross Section, and SEM        Section
Observation                   (xii) Calculation of Amount of Correction
                              for Information of an Observation Field
                              of View and a Focus Position in SEM
                              Observation
                              (xiii) Setting of Coordinates of an
                              Observation Field of View and a Focus
                              Position of an SEM Observation Image
                              (xiv) Obtaining of SEM Observation
                              Image
8. End of                     (xv) End of Moving-and-Processing
Moving-and-Processing

A kind of luminance signal in an observation process of an SEM image of the above moving cross section is described. As the kind of signal, at least one of a secondary electron, a reflected electron, and an X-ray is selected. When using a secondary electron, since a secondary electron due to an FIB is mixed with a secondary electron due to an electron beam irradiation of an SEM, temporary interruption of an FIB irradiation is necessary while obtaining SEM images. That is, operations of FIB cross-sectioning and SEM observation were repeatedly performed. On the other hand, when using reflected electrons and X-rays for a luminance signal for SEM images, since there is no signal excitation due to an FIB irradiation, temporary interruption of an FIB irradiation was not necessary, and sequential operations of FIB cross-sectioning and SEM observation were performed.

Referring to FIGS. 6A to 6C, other examples for the shapes of the marks are described. FIG. 6A is a perspective diagram showing relationships between marks b₁ to b₄ formed on a sample surface and the respective coordinate systems; FIG. 6B is a diagram showing projected images of the marks b₁ to b₄ projected on the X_iY_i plane; and FIG. 6C is a diagram showing projected images of marks a₁ to a₄ and the marks b₁ to b₄ projected on the X_eY_e plane. FIGS. 2, 3, and 4A to 4C are diagrams in the case where marks indicate respective representative positions, and are isolated. FIG. 6 shows an example in which at least two marks having different X_i values are connected, substantially forming one mark. For example, two marks, b₂ and b₃, and b₄ and b₁, respectively having different X_i values in FIG. 4 are respectively connected, resulting in bar-like marks b₂b₃ and b₄b₁ as shown in FIG. 6. The values X_i at both ends of a single bar-like mark correspond to information on the X_i values of respective marks. Accordingly, a mark may be one representing a single typical point, one bar-like mark representing two points, or one which is a combination of one mark and one bar-like mark.

Second Embodiment

Tilting information on a sample surface in a 3D observation target area can be obtained using a laser microscope. FIG. 5 is a diagrammatic view showing a measuring device, in which a laser microscope is used and a height to a sample surface is denoted as Z. A sample 6 is placed on a XYZ samples stage 31. A surface of the sample 6 is irradiated with illumination light from an illumination lamp 40 through a lens 39, a half mirror 35, and an objective lens 34. In the meantime, an image of the surface of the sample 6 is formed on an image pickup device 36 through the objective lens 34. An image signal from the image pickup device 36 is mirrored on a monitor device 38 through an image processing device 37. The image processing device 37, which is connected to a computer 43, outputs an image of the sample surface on the monitor device 38. The Z-axis of the XYZ stage 31 is moved up and down, and thereby an automatic focusing on the surface of the sample 6 is performed while viewing the monitor device 38. Reference numeral 41 denotes a displacement detector which reads an XYZ position of the XYZ stage 31, and a value in an XYZ coordinate system, which corresponds to an arbitrary position of the sample 6, is read into a computer 43 through an interface circuit 42. The XYZ stage 31 is controlled in response to a command from the computer 43 through the interface 42.

A 3D to-be-analyzed sample is placed on the XYZ stage so that X_i, Y_i, and Z_i axes in a sectional view showing the making of a sample in FIG. 1 are consistent with X, Y, and Z axes on the sample stage. Accordingly, a specific part on the vicinity of a surface to be analyzed is kept being tracked by sequentially focusing the laser microscope on the specific part, and thereby coordinate values (X₁, Y₁, Z₁) at that point are obtained and registered. Such coordinate position information includes tilting information on a sample surface to be analyzed. For example, denoting coordinates (X₁, Y₁, Z₁) of a mark b_j (=1 to 4) in FIG. 4A as (X_1j, Y_1j, Z_1j), θ_x and θ_y are respectively calculated by the following equations.

θ_x=arctan [(Z₁₃+Z₁₄−Z₁₁−Z₁₂)/(X₁₃+X₁₄−X₁₁−X₁₂)]  (16)

θ_y=arctan [(Z₁₃+Z₁₄−Z₁₁−Z₁₂)/(X₁₃+X₁₄−X₁₁−X₁₂)]  (17)

Accordingly, an amount of movement of a field of view ΔY_e and an amount of deviation of a focus position ΔZ_e in electron beam coordinates, which correspond to an amount of movement ΔX_i of the cross section 20, can be calculated using Eqs. (8) to (11). The laser microscope and the charged particle beam apparatus are connected, and coordinate position information (or information on θ_x and θy) is sent from the laser microscope to a beam control section of the charged particle beam apparatus. In this case, the coordinate position information (or information on θ_x and θ_y), which is obtained by the laser microscope, is read in through a recording medium, or it needs a key input by an operator, while the laser microscope and the charged particle beam apparatus may be in offline. When comparing with the method employing SIM images and SEM images as described above, the method using the laser microscope has a drawback that a laser microscope is necessary other than a charged particle beam apparatus integral with an SEM and an SIM.

Claims

1-9. (canceled)

10. Method of preparing and observing a sample in which a cross section formed on a sample surface is moved in a direction in which the cross section moves backward by processing the sample surface using a focused ion beam; in which an electron beam is irradiated on the cross section in a direction of an axis obliquely crossing an irradiation axis of the focused ion beam; and in which the moving sample cross section is observed with a scanning electron microscope, comprising: measuring an amount of correction for a deviation in focus in a scanning electron microscope observation, the amount of which corresponds to the amount of movement of the processed sample cross section, prior to the cross-sectioning and observation,setting a state of the scanning electron microscope according to the amount of correction when performing cross-sectioning, andcausing the focus position of the scanning electron microscope to follow the movement of the sample cross section.

11. The method according to claim 10, wherein a secondary electron is used as a luminance signal for an image of the scanning electron microscope, and cross-sectioning with the focused ion beam and observations with the scanning electron microscope are repeatedly performed.

12. The method according to claim 10, wherein a reflected electron or an X-ray is used as a luminance signal for an image of the scanning electron microscope, and cross-sectioning with the focused ion beam and observations with the scanning electron microscope are sequentially performed.

13. Method of preparing and observing a sample in which a cross section formed on a sample surface is moved in a direction in which the cross section moves backward by processing the sample surface using a focused ion beam; in which an electron beam is irradiated on the cross section in a direction of an axis obliquely crossing an irradiation axis of the focused ion beam; and in which the moving sample cross section is observed with a scanning electron microscope, comprising: correcting a deviation of a focus position of the scanning electron microscope, which occurs due to the movement of the sample cross section by the processing with the focused ion beam, using information on an angle formed by the irradiation axis of the focused ion beam and the irradiation axis of the electron beam as well as tilting information on the sample surface, andcausing the focus position of the scanning electron microscope to follow the movement of the sample cross section.

14. The method according to claim 13, wherein a secondary electron is used as a luminance signal for an image of the scanning electron microscope, and cross-sectioning with the focused ion beam and observations with the scanning electron microscope are repeatedly performed.

15. The method according to claim 13, wherein a reflected electron or an X-ray is used as a luminance signal for an image of the scanning electron microscope, and cross-sectioning with the focused ion beam and observations with the scanning electron microscope are sequentially performed.

16. Method of preparing and observing a sample in which a cross section formed on a sample surface is moved in a direction in which the cross section moves backward by processing the sample surface using a focused ion beam; in which an electron beam is irradiated on the cross section in a direction of an axis obliquely crossing an irradiation axis of the focused ion beam; and in which the moving sample cross section is observed with a scanning electron microscope, comprising: correcting a deviation of a focus position of the scanning electron microscope, which occurs due to the movement of the sample cross section by the processing, using information on a height of a surface of a cross section processing area and tilting information on the surface, andcausing the focus position of the scanning electron microscope to follow the movement of the sample cross section.

17. The method according to claim 16, wherein a secondary electron is used as a luminance signal for an image of the scanning electron microscope, and cross-sectioning with the focused ion beam and observations with the scanning electron microscope are repeatedly performed.

18. The method according to claim 16, wherein a reflected electron or an X-ray is used as a luminance signal for an image of the scanning electron microscope, and cross-sectioning with the focused ion beam and observations with the scanning electron microscope are sequentially performed.

19. A charged particle beam apparatus in which a cross section formed on a sample surface is movable in a direction in which the cross section moves backward by processing the sample surface using a focused ion beam; and in which the moving sample cross section is observed with a scanning electron microscope, comprising: a sample stage for holding a sample;a focused ion beam system for irradiating a focused ion beam on the sample held on the sample stage and for thus processing a sample cross section;an electron beam system which has an irradiation axis crossing an irradiation axis of the focused ion beam on the sample;a detector for detecting a sample signal emitted from the sample due to an irradiation of any one of the focused ion beam and an electron beam;a displaying section for displaying at least one of a scanning ion microscope image and a scanning electron microscope image, the image or images being formed on the basis of detector output; anda beam control section for controlling the focused ion beam system and the electron beam system, wherein the apparatus is configured such thatan amount of correction for a deviation in focus in a scanning electron microscope observation, the amount of which corresponds to the amount of movement of the processed sample cross section, is measured prior to the operation of the cross-sectioning and observation,a state of the scanning electron microscope is set according to the amount of correction when performing an operation of cross-sectioning, andthe focus position of the scanning electron microscope is caused to follow the movement of the sample cross section.

20. The charged particle beam apparatus according to claim 19, wherein a secondary electron is used as a luminance signal for an image of the scanning electron microscope, and cross-sectioning with the focused ion beam and observations with the scanning electron microscope are repeatedly performed.

21. The charged particle beam apparatus according to claim 19, wherein a reflected electron or an X-ray is used as a luminance signal for an image of the scanning electron microscope, and cross-sectioning with the focused ion beam and observations with the scanning electron microscope are sequentially performed.

22. A charged particle beam apparatus in which a cross section formed on a sample surface is moved in a direction in which the cross section moves backward by processing the sample surface using a focused ion beam; and in which the moving sample cross section is observed with a scanning electron microscope, comprising: a sample stage for holding a sample;a focused ion beam system for irradiating a focused ion beam on the sample held on the sample stage, and for thus processing a sample cross section;an electron beam system which has an irradiation axis crossing an irradiation axis of the focused ion beam on the sample;a detector for detecting a sample signal emitted from the sample due to an irradiation of any one of the focused ion beam and an electron beam;a displaying section for displaying at least one of a scanning ion microscope image and a scanning electron microscope image, the image or images being formed on the basis of detector output; anda beam control section for controlling the focused ion beam system and the electron beam system, wherein the apparatus is configured such thata deviation of a focus position of the scanning electron microscope, which occurs due to the movement of the sample cross section by the processing with the focused ion beam, is corrected using information on an angle formed by the irradiation axis of the focused ion beam and the irradiation axis of the electron beam as well as tilting information on the sample surface, andthe focus position of the scanning electron microscope is caused to follow the movement of the sample cross section.

23. The charged particle beam apparatus according to claim 22, wherein a secondary electron is used as a luminance signal for an image of the scanning electron microscope, and cross-sectioning with the focused ion beam and observations with the scanning electron microscope are repeatedly performed.

24. The charged particle beam apparatus according to claim 22, wherein a reflected electron or an X-ray is used as a luminance signal for an image of the scanning electron microscope, and cross-sectioning with the focused ion beam and observations with the scanning electron microscope are sequentially performed.

25. A charged particle beam apparatus in which a cross section formed on a sample surface is moved in a direction in which the cross section moves backward by processing the sample surface using a focused ion beam; and in which the moving sample cross section is observed with a scanning electron microscope, comprising: a sample stage for holding a sample;a focused ion beam system for irradiating a focused ion beam on the sample held on the sample stage, and for thus processing a sample cross section;an electron beam system which has an irradiation axis crossing an irradiation axis of the focused ion beam on the sample;a detector for detecting a sample signal emitted from the sample due to an irradiation of any one of the focused ion beam and an electron beam;a displaying section for displaying at least one of a scanning ion microscope image and a scanning electron microscope image, the image or images being formed on the basis of the detector output; anda beam control section for controlling the focused ion beam system and the electron beam system, wherein the apparatus is configured such that a deviation of a focus position of the scanning electron microscope, which occurs due to the movement of the sample cross section by the processing, is corrected using information on a height of a surface of a cross section processing area and tilting information on the surface, andthe focus position of the scanning electron microscope is caused to follow the movement of the sample cross section.

26. The charged particle beam apparatus according to claim 25, wherein a secondary electron is used as a luminance signal for an image of the scanning electron microscope, and cross-sectioning with the focused ion beam and observations with the scanning electron microscope are repeatedly performed.

27. The charged particle beam apparatus according to claim 25, wherein a reflected electron or an X-ray is used as a luminance signal for an image of the scanning electron microscope, and cross-sectioning with the focused ion beam and observations with the scanning electron microscope are sequentially performed.