Patent Application
20090139833
This application claims priority to Japanese Patent Application No. JP2007-310675, filed on Nov. 30, 2007, the entire disclosure of which is hereby incorporated by reference in its entirety for all purposes.
This invention relates to a substrate treating apparatus for performing a series of treatments of substrates such as semiconductor wafers, glass substrates for liquid crystal displays, glass substrates for photomasks, and substrates for optical disks (hereinafter called simply “substrates”).
Conventionally, this type of apparatus is used to form a resist film on substrates and to develop the substrates exposed in a separate exposing machine. The apparatus includes a treating section having arranged therein at least a coating block for forming resist film, a developing block for developing the substrates. Each such treating block includes a single main transport mechanism and a plurality of chemical treating units and heat-treating units stacked vertically. The main transport mechanism of each block both transports substrates to the treating units in that block and transfers the substrates to and from the main transport mechanism of adjacent treating blocks to carry out a series of treatments of the substrates (as disclosed in Japanese Unexamined Patent Publication No. 2003-324139, for example).
The conventional apparatus with such a construction has the following drawbacks:
In the conventional apparatus various treating units are stacked vertically with the result that the quality of treatment tends to be different between the treating units which carry out the same treatment. This is considered due to variations in environment such as temperature and pressure between the treating units arranged vertically.
Further, where the exposing machine has a plurality of exposing stages, a difference may occur in the quality of exposure between these exposing stages. Even if the quality of treatment in forming resist film and development is uniform for the substrates assigning substrates to different exposing stages may cause the quality of entire treatment including exposure to be variable among the substrates.
This invention has been made having regard to the state of the art noted above, and its objective is to provide a substrate treating apparatus that can produce a uniform quality of treatment among substrates.
According to this invention the above objective is fulfilled by a substrate treating apparatus comprising a plurality of substrate treatment lines arranged one over another with each line treating substrates while transporting the substrates substantially horizontally; an interface section for transporting the substrates between the substrate treatment lines, an exposing machine separate from the apparatus having a plurality of exposing stages, and a controller for controlling transport of the substrates in the interface section to cause all the substrates similarly treated in each of the substrate treatment lines to be exposed on one of the exposing stages.
According to this invention, each substrate treatment line treats the substrates while transporting the substrates substantially horizontally. Thus, even when a plurality of substrates receive the same type of treatment in the substrate treatment lines, relatively little variation occurs with the treating positions of the substrates. Therefore, each substrate treatment line can carry out uniform treatment for the plurality of substrates. Each exposing stage in the exposing machine can expose a plurality of substrates with the same quality. The controller causes all the plurality of substrates that receive the same type of treatment in the same substrate treatment line to be exposed on the same exposing stage. Compared with the case of using the plurality of exposing stages together, this control can inhibit variations in the quality of entire treatment including the treatment in the substrate treatment line and exposure in the exposing machine occurring among the plurality of substrates receiving the same type of treatment in the same substrate treatment line.
To carry out “the same type of treatment in the same substrate treatment line L” includes the case where all types of treatment are carried out in one substrate treatment line, and also the case where certain types of treatment are carried out in one substrate treatment line, and other types of treatment in another substrate treatment line.
In the invention noted above, the controller may be arranged to control the transport of the substrates in the interface section by referring to coordination information which determines for each substrate, at least one of which substrate treatment line to treat the substrate and which exposing stage to expose the substrate. By referring to the coordination information, the control by the controller is realized effectively.
The above coordination information may include substrate identification information which identifies each substrate actually transferred between the interface section and the exposing machine in the treatment information which determines at least one of which substrate treatment line to treat the substrate and which exposing stage to expose the substrate that is. Based on the substrate identification information included in the coordination information, the controller can identify each actual substrate conveniently. Based on the treatment information related to this substrate identification information, the controller can determine a substrate treatment line or exposing stage assigned to each actual substrate. When a substrate treatment line is determined, the controller can control transport of the substrate in the interface unit such that the substrate concerned receives treatment in the substrate treatment line determined. When an exposing stage is determined, the controller can control transport of the substrate in the interface unit such that the substrate concerned is exposed on the exposing stage determined. With the controller performing control in this way based on the coordination information, the substrates are transported such that all the substrates exposed on the same exposing stage are treated in the same substrate treatment line, that is, in a way that one substrate treatment line corresponds to one exposing stage.
In the invention noted above, treatment carried out in the substrate treatment lines may include resist film forming treatment for forming resist film on the substrates and post-exposure baking (PEB) treatment for heating the substrates after exposure; and the controller may be arranged to control the transport of the substrates in the interface section to cause all the substrates receiving the resist film forming treatment in each of the substrate treatment lines to be exposed on one of the exposing stages and to receive the post-exposure baking (PEB) treatment in one of the substrate treatment lines. The quality of the entire series of treatments including the resist film forming treatment, exposure and post-exposure baking (PEB) treatment can be made uniform among the plurality of substrates having received the resist film forming treatment in the same substrate treatment line.
The substrate treatment line which gives post-exposure baking (PEB) treatment to the substrates may be the substrate treatment line which has given the resist film forming treatment to the substrates. Then, the quality of the entire series of treatments can be made uniform with increased precision.
Each of the substrate treatment lines may include a plurality of main transport mechanisms arranged substantially horizontally; and a plurality of treating units provided for each of the main transport mechanisms for treating the substrates; each main transport mechanism being arranged to transfer the substrates to another main transport mechanism substantially horizontally adjacent thereto, while transporting the substrates to the treating units associated with the each main transport mechanism, thereby carrying out a series of treatments for the substrates. In this way, the substrate treatment lines may be constructed conveniently.
The treating units provided in each substrate treatment line may include resist film coating units for applying a resist film material to the substrates; and all the substrates with the resist film formed in each substrate treatment line may be exposed on one of the exposing stages. This can make uniform the quality of the series of treatments including the treatment for applying the resist film material to the substrates, and exposure of the substrates with the resist film formed.
The plurality of resist film coating units provided in each substrate treatment line may be arranged in substantially equal height positions. With the resist film coating units arranged in substantially equal height positions, the quality of treatment may be made uniform among these coating units.
The treating units provided in each substrate treatment line may further include PEB units for giving post-exposure baking (PEB) treatment to the substrates after exposure; and the substrate treatment line which gives post-exposure baking (PEB) treatment to the substrates may be the substrate treatment line which has applied the resist film material to the substrates. This can make uniform the quality of the series of treatments including the treatment for applying the resist film material, exposure and post-exposure baking (PEB) treatment. The quality may be made uniform with increased precision since the treatments before and after exposure are carried out in the same substrate treatment line.
In the invention noted above, the substrates may be transported to each of the substrate treatment lines and to the exposing machine at least twice, to form circuit patterns in at least two separate steps on a film acting as underlying film, the substrate treatment line to which the substrates are transported for a second time or later time being the same substrate treatment line to which the substrates are transported for a first time. The quality such as wiring pattern linewidth can be made uniform between the circuit pattern formed in the first step and one formed for the second or later step.
In another embodiment of the invention, a substrate treating apparatus comprises a treating section including a plurality of treating blocks arranged horizontally, each treating block having treating units arranged on each of vertical stories for treating substrates, and a main transport mechanism disposed on each story for transporting the substrates to and from the treating units on each story, a series of treatments being carried out by transferring the substrates between the main transport mechanisms on the same story of the treating blocks adjacent each other; an interface section disposed adjacent the treating section for transporting the substrates between the treating section and an exposing machine having a plurality of exposing stages, the exposing machine being provided separately from the apparatus; and a controller for controlling transport of the substrates in the interface section to cause all the substrates similarly treated on each of the stories to be exposed on one of the exposing stages.
According to this embodiment, since the treating section includes a plurality of treating blocks arranged side by side, the treating section can be formed or varied by selecting or substituting the type of each treating block as appropriate as suited to the contents and object of treatment carried out for the substrates. Further, the substrates are transferred between the main transport mechanisms on the same story of the treating blocks adjacent to each other to carry out a series of treatments for the substrates on that story. The term “the same story” means a story of the same level (height position). Thus, even where each story has a plurality of treating units of the same type arranged on each story, there is relatively little variation in the height position between these treating units. Therefore, uniform treatment can be carried out for the plurality of substrates on each story. The controller causes all the plurality of substrates that receive the same type of treatment on the same story to be exposed on the same exposing stage. This control can inhibit variations in the quality of entire treatment including the treatment in the substrate treatment line and exposure in the exposing machine occurring among the plurality of substrates receiving the same type of treatment on the same story.
All the plurality of substrates that receive the same type of treatment on the same story includes the case where all types of treatment are carried out on one story, and also the case where certain types of treatment are carried out on one story, and other types of treatment on another story.
In the embodiment noted above, the controller may be arranged to control the transport of the substrates in the interface section by referring to coordination information which determines for each substrate at least one of which story to treat the substrate and which exposing stage to expose the substrate. By referring to the coordination information, the control by the controller is realized effectively.
The coordination information may include substrate identification information which identifies each substrate actually transferred between the interface section and the exposing machine with treatment information which determines at least one of which story to treat the substrate and which exposing stage to expose the substrate. Based on the substrate identification information included in the coordination information, the controller can identify each actual substrate conveniently. Based on the treatment information related to this substrate identification information, the controller can determine a story or exposing stage assigned to each actual substrate. When a story is determined, the controller can control transport of the substrate in the interface unit such that the substrate concerned receives treatment on the story determined. When an exposing stage is determined, the controller can control transport of the substrate in the interface unit such that the substrate concerned is exposed on the exposing stage determined. Thus, the substrates are transported such that all the substrates exposed on the same exposing stage are treated on the same story, that is, in a way that one story corresponds to each exposing stage.
In the embodiments noted above, each story may have an atmosphere blocked off from that of the other. This allows the atmosphere of each story to be easily maintained clean. It is also easy to keep the environment on each story constant.
One of the treating blocks may be a coating block having resist film coating units arranged as the treating units on each story for applying a resist film material to the substrates; and all the substrates having the resist film formed thereon on each story may be exposed on one of the exposing stages. This can make uniform the series of treatments including the treatment for applying the resist film material to the substrates, and exposure of the substrates with the resist film formed.
The plurality of resist film coating units provided on each story may be arranged in substantially equal height positions. With the resist film coating units arranged in substantially equal height positions, the quality of treatment may be made uniform between these coating units.
One of the treating blocks different from the coating block may be a PEB block having PEB units arranged as the treating units on each story for carrying out post-exposure baking (PEB) treatment for heating the substrates after exposure; and the story having the PEB block which gives post-exposure baking (PEB) treatment to the substrates may be the story having the coating block which has applied the resist film material to the substrates. This can make uniform the quality of the series of treatments including the treatment for applying the resist film material, exposure and post-exposure baking (PEB) treatment. The quality may be made uniform with increased precision since the treatments before and after exposure are carried out on the same story.
The substrates may be transported to the treating section and to the exposing machine at least twice, to form circuit patterns in at least two separate steps on a film acting as underlying film, the story of the treating section to which the substrates are transported for a second time or later time being the same story of the treating section to which the substrates are transported for a first time. The quality such as wiring pattern linewidth can be made uniform between the circuit pattern formed in the first step and one formed for the second or later step.
In another embodiment of the invention, a substrate treating apparatus comprises a plurality of substrate treatment lines arranged one over another, each for treating substrates while transporting the substrates substantially horizontally; each substrate treatment line including film forming units for forming film on the substrates; wherein all the film forming units of each substrate treatment line which form the same type of film are arranged in substantially equal height positions.
According to this embodiment, each substrate treatment line treats the substrates while transporting the substrates substantially horizontally. Thus, the quality of treatment can be made uniform among the plurality of substrates transported to the same substrate treatment line. Further, where a plurality of film forming units are provided for forming the same type of film, these units are arranged in substantially equal height positions. Thus, there is no possibility of variations in the quality of treatment between these film forming units. Consequently, each substrate treatment line provides a uniform quality of treatment among the substrates.
The film forming units provided in each substrate treatment line may include a plurality of resist film coating units for forming resist film and all the resist film coating units of each substrate treatment line may be arranged in substantially equal height positions. This construction can make uniform the quality of substrate treatment among the resist film coating units of each substrate treatment line.
The film forming units provided in each substrate treatment line may include a plurality of antireflection film coating units for forming antireflection film on the substrates; and all the antireflection film coating units of each substrate treatment line may be arranged in substantially equal height positions. This construction can make uniform the quality of substrate treatment among the antireflection film coating units of each substrate treatment line.
The resist film coating units and the antireflection film coating units of each substrate treatment line may be stacked vertically. This construction realizes a reduced footprint.
The above apparatus may further comprise a main transport mechanism movable along a substantially horizontal transport path for transporting the substrates wherein the resist film coating units and the antireflection film coating units are arranged along the transport path of the main transport mechanism. Then, the main transport mechanism can transport the substrates efficiently to and from the resist film coating units and antireflection film coating units.
In a still further aspect of the invention, a substrate treating apparatus comprises an indexer section including an indexer transport mechanism for transporting substrates to and from a cassette configured to store a plurality of substrates; a coating block disposed adjacent the indexer section including coating units for applying a treating solution to the substrates and heat-treating units arranged on each of upper and lower stories, a main transport mechanism disposed on each story for transporting the substrates to and from the coating units and the heat-treating units on the each story; a developing block disposed adjacent the coating block including developing units for supplying a developer to the substrates and heat-treating units arranged on each of upper and lower stories, a main transport mechanism disposed on each story for transporting the substrates to and from the developing units and the heat-treating units on the each story; an interface section disposed adjacent the developing block including an interface transport mechanism for transporting the substrates to and from an exposing machine provided separately from the apparatus. All the coating units on each story which apply the same type of treating solution to the substrates are arranged in substantially equal height positions and the indexer transport mechanism transfers the substrates to and from the main transport mechanism on each story of the coating block. The main transport mechanism on each story of the coating block transfers the substrates to and from the main transport mechanism on the same story of the developing block; and the interface transport mechanism transfers the substrates to and from the main transport mechanism on each story of the developing block.
According to this embodiment, while the main transport mechanisms on the same story of the coating block and developing block transfer the substrates to each other, the substrates are treated in the varied types of treating units arranged on that story of the treating blocks. Thus, the quality of treatment can be made uniform among the substrates treated on the same story. Further, where a plurality of coating units are provided for applying the same type of treating solution to the substrates, these units are arranged in substantially equal height positions. Thus, there is no possibility of variations in the quality of treatment between these units. Consequently, each story can provide a uniform quality of the entire series of treatments including the coating treatment and associated heat treatment of the substrates, the exposure of the substrates and the development and associated heat treatment of the substrates.
The coating units provided on each story of the coating block may include a plurality of resist film coating units for applying a resist film material to the substrates, and a plurality of antireflection film coating units for applying an anti-reflection film forming solution to the substrates; and on each story, the resist film coating units may be arranged in substantially equal height positions, and the antireflection film coating units may be arranged in substantially equal height positions. This construction can make uniform the quality of substrate treatment among the plurality of resist film coating units on each story of the coating block. The construction can also make uniform the quality of substrate treatment among the plurality of antireflection film coating units on each story.
The heat-treating units of the developing block may include PEB units for carrying out post-exposure baking (PEB) treatment for the substrates after exposure. This construction can carry out on each story of the developing block post-exposure bake (PEB) treatment of the substrates after exposure and develop the substrates successively.
This specification discloses an invention directed to a multi-line substrate treating apparatus. Several exemplary embodiments are described below.
(1) In an embodiment of the substrate treating apparatus, the controller is arranged to carry out at least one of transmission and reception of the coordination information to/from the exposing machine to link one of the exposing stages to each substrate treatment line or story.
According to the apparatus defined in (1) above, with the controller constructed capable of communication with the exposing machine, a further embodiment of the apparatus can set the substrate treatment lines and exposing stages to an effective corresponding relationship regarding each substrate. Another embodiment of the apparatus can set the stories and exposing stages to an effective corresponding relationship regarding each substrate.
(2) In an embodiment of the substrate treating apparatus, the substrate identification information is transport information on times for or an order of actually transferring the substrates between the interface section and the exposing machine.
According to the apparatus defined in (2) above, the substrates can be identified conveniently by the timing of actually transferring the substrates.
(3) In a further embodiment of the substrate treating apparatus according to (2) above, the transport information is obtained from a time estimate based on at least a transport step for transporting the substrates and a treating step for treating the substrates.
According to the apparatus defined in (3) above, the transport information can be obtained easily.
(4) In a further embodiment of the substrate treating apparatus according to (3) above, the transport information is used in transferring the substrates from the interface section to the exposing machine, and the controller is arranged to carry out control for successively receiving the substrates delivered from a substrate treatment line or story selected based on the coordination information, and transferring the substrates to the exposing machine.
According to the apparatus defined in (4) above, the control by the controller is realized with increased ease.
(5) The substrate treating apparatus according to (3) above, wherein the transport information is used in returning the substrates from the exposing machine to the interface section, and the controller is arranged to carry out control for successively receiving the substrates from the exposing machine and transferring the substrates to a substrate treatment line or story selected based on the coordination information.
According to the apparatus defined in (5) above, the control by the controller is realized with increased ease.
(6) An embodiment of the substrate treating apparatus wherein the numbers of substrate treatment lines or stories and exposing stages are two each, and one exposing stage corresponds to one substrate treatment line or story, while the other exposing stage corresponds to the other substrate treatment line or story.
According to the apparatus defined in (6) above, the construction having two substrate treatment lines can coordinate effectively with the exposing machine having two exposing stages.
(7) An embodiment of the substrate treating apparatus wherein each of the different exposing stages correspond to a substrate treatment line or story.
According to the apparatus defined in (7) above, it is possible to avoid concentration of the substrates on one of the exposing stages, thereby eliminating the possibility of lowering the efficiency of the exposing machine.
(8) An embodiment of the substrate treating apparatus wherein treatment carried out in the substrate treatment lines includes pre-exposure treatment for treating the substrates before exposure and post-exposure treatment for treating the substrates after exposure; and the controller is arranged to control the transport of the substrates in the interface section to cause all the substrates receiving the pre-exposure treatment in a same one of the substrate treatment lines to be exposed on a same one of the exposing stages and to receive the post-exposure treatment in a same one of the substrate treatment lines.
According to the apparatus defined in (8) above, it is possible to make uniform the quality of the entire series of treatments including the exposure and the treatments before and after the exposure.
(9) An embodiment of the substrate treating apparatus according to (8) above wherein the substrate treatment line which gives the post-exposure treatment to the substrates is the substrate treatment line which has given the pre-exposure treatment to the substrates.
According to the apparatus defined in (9) above, it is possible to uniform the quality of the entire series of treatments with increased precision.
(10) The substrate treating apparatus according to (8) or (9) above, wherein the post-exposure treatment is a developing treatment for developing the substrates.
According to the apparatus defined in (10) above, the quality of developing treatment can be made uniform.
(11) An embodiment of the substrate treating apparatus wherein each substrate treatment line has an atmosphere blocked off from that of the other.
According to the apparatus defined in (11) above, the atmosphere of each substrate treatment line can be easily maintained clean. It is also easy to keep the environment of each substrate treatment line constant.
(12) An embodiment of the substrate treating apparatus wherein the substrate treatment lines have the main transport mechanisms and the treating units in substantially the same arrangement in plan view.
According to the apparatus defined in (12) above, the apparatus has a simplified construction.
(13) An embodiment of the substrate treating apparatus wherein the treating blocks have the main transport mechanisms and the treating units in substantially the same arrangement in plan view on the respective stories.
According to the apparatus defined in (13) above, the apparatus has a simplified construction.
(14) The substrate treating apparatus according to claim 9, wherein the main transport mechanisms are arranged to transport the substrates separately to and from the resist film coating units and the PEB units.
According to the apparatus defined in (14) above, a different one of the main transport mechanisms transports the substrates to and from the resist film coating units which treat the substrates before exposure or the PEB units which treat the substrates after exposure. This arrangement can transport the substrates efficiently in each substrate treatment line.
(15) An embodiment of the substrate treating apparatus wherein the treating units provided in each substrate treatment line include PEB units for giving post-exposure baking (PEB) treatment to the substrates after exposure; and all of the substrates exposed on one exposing stage receive the post-exposure baking (PEB) treatment in the same substrate treatment line.
According to the apparatus defined in (15) above, it is possible to make uniform the quality of the series of treatments including the exposure and the post-exposure baking (PEB) treatment.
(16) An embodiment of the substrate treating apparatus wherein the treating units provided in each substrate treatment line include developing units for developing the substrates; and all of the substrates exposed on one exposing stage are developed in the same substrate treatment line.
According to the apparatus defined in (15) above, the quality of developing treatment can be uniformed.
For the purpose of illustrating the invention, there are shown in the drawings several embodiments, it being understood, however, that the invention is not limited to the precise arrangement and instrumentalities shown.
One embodiment of this invention will be described in detail hereinafter with reference to the drawings.
An outline of this embodiment will be described first.
This embodiment provides a substrate treating apparatus 10 for forming resist film on substrates (e.g. semiconductor wafers) W, and developing exposed wafers W. The substrate treating apparatus 10 will be abbreviated hereinafter as the apparatus 10 as appropriate. This apparatus 10 includes an indexer section (hereinafter called “ID section”) 1, a treating section 3, an interface section (hereinafter called “IF section”) 5, and a control section 90. The ID section 1, treating section 3, and IF section 5 are arranged adjacent to one another in the stated order. An exposing machine EXP is disposed adjacent the IF section 5. The exposing machine EXP is an external apparatus separate from this apparatus 10.
The ID section 1 receives wafers W transported to the apparatus 10 from outside, and transfers the wafers W to the treating section 3. The treating section 3 includes a plurality of (e.g. two) substrate treatment lines Lu and Ld. Each substrate treatment line Lu and Ld treats the wafers W while transporting the wafers W substantially horizontally. The substrate treatment lines Lu and Ld are arranged one over the other. Each substrate treatment line Lu and Lu has one end thereof opposed to the ID section 1, and the other end opposed to the IF section 5. Each substrate treatment line Lu and Ld transfers the wafers W to and from the ID section 1 and IF section 5, respectively. In the following description, the substrate treatment lines Lu and Ld will be referred to simply as the substrate treatment lines L when they are not distinguished.
The substrate treatment line Lu includes treating units U1 and U2 for treating the wafers W. The substrate treatment line Ld includes treating units U3 and U4 for treating the wafers W. The treating units U1 and U3 carry out a predetermined treatment (pre-exposure treatment) of the wafers W before exposure. The pre-exposure treatment is resist film forming treatment for forming resist film on the wafers W, for example. The treating units U2 and U4 carry out a predetermined treatment (post-exposure treatment) of the wafers W after exposure. The post-exposure treatment includes, for example, post-exposure baking (PEB) treatment for heating the wafers W after exposure, and developing treatment for developing the wafers W. The treating units U1-U4 will be referred to simply as the treating units U when they are not distinguished.
The IF section 5 transfers the wafers W between the treating section 3 and exposing machine EXP. The control section 90 controls transport of the wafers W in the IF section 5. The exposing machine EXP has a plurality of (e.g. two) exposing stages S1 and S2 for exposing the wafers W.
The apparatus 10 constructed in this way operates as follows. The ID section 1 transports wafers Wa1, Wa2, Wa3, . . . to the substrate treatment line Lu, and transports wafers Wb1, Wb2, Wb3, . . . to the substrate treatment line Ld. The wafers Wa1, Wa2, Wa3, . . . transported to the substrate treatment line Lu receive the pre-exposure treatment in the treating units U1, respectively. The wafers Wb1, Wb2, Wb3, . . . transported to the substrate treatment line Ld receive the pre-exposure treatment in the treating units U3, respectively. In the following description, the plurality of wafers Wa1, Wa2, Wa3, . . . receiving the pre-exposure treatment in the substrate treatment line Lu will be called the group of wafers Wa, while the plurality of wafers Wb1, Wb2, Wb3, . . . receiving the pre-exposure treatment in the substrate treatment line Ld will be called the group of wafers Wb.
Then, the group of wafers Wa is transported from the substrate treatment line Lu to the IF section 5, and the group of wafers Wb from the substrate treatment line Ld to the IF section 5. The control section 90 controls transport of the wafers W in the IF section 5 to have the entire group of wafers Wa exposed on the exposing stage S1, and the entire group of wafers Wb exposed on the exposing stage S2. Based on this control, the IF section 5 transports the groups of wafers Wa and Wb to the exposing machine EXP. As a result, the group of wafers Wa is exposed on the exposing stage S1, and the group of wafers Wb on the exposing stage S2. The groups of wafers Wa and Wb exposed are transported from the exposing machine EXP to the IF section 5.
The control section 90 controls transport of the wafers W in the IF section 5, so that the post-exposure treatment may be carried out for the entire group of wafers Wa in the substrate treatment line Lu, and for the entire group of wafers Wb in the substrate treatment line Ld. Based on this control, the IF section 5 transports the group of wafers Wa to the substrate treatment line Lu, and the group of wafers Wb to the substrate treatment line Ld. The group of wafers Wa transported to the substrate treatment line Lu receives the post-exposure treatment in the treating units U2. Similarly, the group of wafers Wb transported to the substrate treatment line Ld receives the post-exposure treatment in the treating units U4. Subsequently, the group of wafers Wa is transported from the substrate treatment line Lu to the ID section 1, and the group of wafers Wb from the substrate treatment line Ld to the ID section 1.
As described above, the entire group of wafers Wa receives the pre-exposure treatment in the treating units U1, is exposed on the exposing stage S1, and receives the post-exposure treatment in the treating units U3. Thus, the entire group of wafers Wa has the same history of treatment. It is therefore possible to make uniform the quality of treatment for the group of wafers Wa. Similarly, the group of wafers Wb has a uniform quality of treatment. If part of the group of wafers Wa were exposed on the exposing stage S1 and the rest of the group of wafers Wa on the exposing stage S2, all the group of wafers Wa would not have the same history of treatment. The quality of treatment would tend to vary within the group of wafers Wa.
Where the plurality treating units U1 are provided for carrying out the same type of treatment, variations in height between the plurality of treating units U 1 are clearly smaller than variations in height between the treating units U1 and U2. Thus, surrounding environment such as temperature and pressure can be made substantially the same for the treating units U1 having a relatively small difference in vertical position. It is therefore possible to easily make uniform the quality of treatment for the treating units U1. The same can be said also for the other treating units U2-U4. That is, even where a plurality of treating units U2, U3 or U4 are provided, the quality of treatment can be made uniform easily for the same type of treating units U. Therefore, the quality of each type of treatment in the substrate treatment lines Lu and Ld can be made uniform for the wafers W.
The history of treatment of the wafers W in the apparatus 10 and exposing machine EXP can be divided into two types which correspond to the number of substrate treatment lines L (one is the history of treatment of the group of wafers Wa, and the other is the one of the group of wafers Wb). Thus, a follow-up check can be conducted easily of the history of treatment of each wafer W.
This embodiment will be described in greater detail hereinafter.
The ID section 1 takes wafers W out of each cassette C, which stores a plurality of wafers W, and deposits wafers W in the cassette C. The ID section 1 has a cassette table 9 for receiving cassettes C. The cassette table 9 can receive four cassettes C as arranged in a row. The ID section 1 has also an ID transport mechanism TID. The ID transport mechanism TID transports wafers W to and from each cassette C, and transports wafers W to and from receivers PASS1 and PASS3 to be described hereinafter. As shown in
Each substrate treatment line L has main transport mechanisms T for transporting wafers W substantially horizontally. In this embodiment, each substrate treatment line L has a plurality of main transport mechanisms T (two for each substrate treatment line L, and thus a total of four). The plurality of main transport mechanisms T of each substrate treatment line L are arranged in the direction in which the wafers W are transported, and the wafers W can be transferred between the main transport mechanisms T adjacent each other in the transport direction. The treating units U1-U4 are arranged around the main transport mechanisms T, and each main transport mechanism T can transport wafers W also to the associated treating units U. With each main transport mechanism T transporting wafers W to the associated treating units U and transferring wafers W to the other main transport mechanism T adjacent thereto, a series of treatments is carried out for the wafers W in each substrate treatment line L.
Specifically, the substrate treatment line Lu includes a main transport mechanism T1 and a main transport mechanism T2 arranged in a row. The main transport mechanism T1 is disposed adjacent the ID section, while the main transport mechanism T2 is disposed adjacent the IF section 5. Similarly, the substrate treatment line Ld includes a main transport mechanism T3 and a main transport mechanism T4 arranged in a row. The main transport mechanism T3 is disposed adjacent the ID section, while the main transport mechanism T4 is disposed adjacent the IF section 5.
In this embodiment, the treating section 3 which has the above substrate treatment lines L includes a plurality of (two) treating blocks Ba and Bb arranged side by side (in substantially the same direction as the transport direction). The treating block Ba is vertically divided into a plurality of (two) stories K1 and K3. The treating block Bb also is vertically divided into a plurality of (two) stories K2 and K4. The stories K1 and K2 constitute the same story in the sense that their height levels are the same. Similarly, the stories K3 and K4 are the same story in the sense that their height levels are the same.
The above main transport mechanism T1 and treating units U1 are arranged on the upper story K1 of the treating block Ba, while the main transport mechanism T3 and treating units U3 are arranged on the lower story K3. Similarly, the main transport mechanism T2 and treating units U are arranged on the upper story K2 of the treating block Bb, while the main transport mechanism T4 and treating units U are arranged on the lower story K4. The treating units U on the story K2 include treating units U2 for the post-exposure treatment (e.g. developing units DEV) and a treating unit U1 for the pre-exposure treatment (e.g. edge exposing unit EEW). Similarly, the treating units U on the story K4 include treating units U4 for the post-exposure treatment and a treating unit U3 for the pre-exposure treatment.
The wafers W are transferred between the main transport mechanisms T on the same stories K of the adjoining treating blocks Ba and Bb, to carry out a series of treatments for the wafers W. The stories K1 and K2, connected for enabling the transfer of wafers W between the main transport mechanisms T1 and T2, constitute the substrate treatment line Lu. Similarly, the stories K3 and K4, connected for enabling the transfer of wafers W between the main transport mechanisms T3 and T4, constitute the substrate treatment line Ld.
The treating block Ba is disposed adjacent the ID section 1. Receivers PASS1 and PASS3 for receiving wafers W are provided between the ID section 1 and the respective stories K1 and K3 of the treating block Ba. The receiver PASS1 receives, as temporarily placed thereon, wafers W passed between the ID transport mechanism TID and the main transport mechanism T1. Similarly, the receiver PASS3 receives, as temporarily placed thereon, wafers W passed between the ID transport mechanism TID and the main transport mechanism T3. Seen in a sectional view, the receiver PASS1 is disposed at a height adjacent to a lower part of the upper story K2, while the receiver PASS3 is disposed at a height adjacent to an upper part of the lower story K3. Thus, the positions of receiver PASS1 and receiver PASS3 are relatively close to each other for allowing the ID transport mechanism TID to move between the receiver PASS1 and receiver PASS3 using only a small amount of vertical movement.
Receivers PASS2 and PASS4 for receiving wafers W are provided also between the treating blocks Ba and Bb. The receiver PASS2 is disposed between the story K1 and story K2, and the receiver PASS4 between the story K3 and story K4. The main transport mechanisms T1 and T2 transfer wafers W through the receiver PASS2, and the main transport mechanisms T3 and T4 through the receiver PASS4.
The receiver PASS1 includes a plurality of receivers (two in this embodiment). These receivers PASS1 are arranged vertically adjacent each other. Of the two receivers PASS1, one PASS1A receives wafers W passed from the ID transport mechanism TID to the main transport mechanism T1. The other receiver PASS1B receives wafers W passed from the main transport mechanism T1 to the ID transport mechanism TID. Each of the receivers PASS2-PASS4 and receivers PASS5 and PASS6 described hereinafter similarly includes a plurality of (two) receivers, one of which is selected according to a direction for transferring wafers W. Each of the receivers PASS1A and PASS1B has a sensor (not shown) for detecting presence or absence of a wafer W. Based on detection signals of each sensor, the transfer of wafers W by the ID transport mechanism TID and main transport mechanism T1 is controlled. Similar sensors are attached also to the receivers PASS2-PASS6, respectively.
The story K1 will now be described. The main transport mechanism T1 is movable in a transporting space A1 extending substantially through the center of the story K1 and parallel to the direction of transport. The treating units U1 on the story K1 are divided broadly into coating units 31 for applying a treating solution to wafers W, and heat-treating units 41 for heat-treating the wafers W. The coating units 31 are arranged on one side of the transporting space A1, while the heat-treating units 41 are arranged on the other side thereof The treatments carried out in the coating units 31 and heat-treating units 41 are all pre-exposure treatments.
The coating units 31 are arranged vertically and horizontally, each facing the transporting space A1. In this embodiment, four coating units 31 in total are arranged in two columns and two rows.
The coating units 31 include anti-reflection film coating units BARC for forming anti-reflection film on the wafers W, and resist film coating units RESIST for forming resist film on the wafers W (i.e. carrying out resist film forming treatment). The anti-reflection film coating units BARC and resist film coating units RESIST correspond to the film forming units in this invention.
The anti-reflection film coating units BARC apply a treating solution for antireflection film to the wafers W. The resist film coating units RESIST apply a resist film material to the wafers W. The plurality of (two) anti-reflection film coating units BARC are arranged at substantially the same height in the lower row. The plurality of resist film coating units RESIST are arranged at substantially the same height in the upper row. No dividing wall or partition is provided between the antireflection film coating units BARC. That is, all the antireflection film coating units BARC are only housed in a common chamber, and the atmosphere around each antireflection film coating unit BARC is not blocked off (i.e. is in communication). Similarly, the atmosphere around each resist film coating unit RESIST is not blocked off.
Reference is made to
The supply device 34 includes a plurality of nozzles 35, a gripper 36 for gripping one of the nozzles 35, and a nozzle moving mechanism 37 for moving the gripper 36 to move one of the nozzles 35 between a treating position above the wafer W and a standby position away from above the wafer W. Each nozzle 35 has one end of a treating solution pipe 38 connected thereto. The treating solution pipe 38 is arranged movable (flexible) to permit movement of the nozzle 35 between the standby position and treating position. The other end of each treating solution pipe 38 is connected to a treating solution source (not shown). Specifically, in the case of antireflection film coating units BARC, the treating solution sources supply different types of treating solution for antireflection film to the respective nozzles 35. In the case of resist film coating units RESIST, the treating solution sources supply different types of resist film material to the respective nozzles 35.
Even though the treating solutions applied from the antireflection film coating units BARC to the wafers W are the same type or different types, the solutions are intended for antireflection film formation. Thus, each antireflection film coating unit BARC corresponds to a coating unit for applying a treating solution of the same type. Similarly, each resist film coating unit RESIST corresponds to a coating unit for applying a treating solution of the same type.
The nozzle moving mechanism 37 has first guide rails 37a and a second guide rail 37b. The first guide rails 37a are arranged parallel to each other and opposed to each other across the two cups 33 arranged sideways. The second guide rail 37b is slidably supported by the two first guide rails 37a and disposed above the two cups 33. The gripper 36 is slidably supported by the second guide rail 37b. The first guide rails 37a and second guide rail 37b take guiding action substantially horizontally and in directions substantially perpendicular to each other. The nozzle moving mechanism 37 further includes drive members (not shown) for sliding the second guide rail 37b, and sliding the gripper 36. The drive members are operable to move the nozzle 35 gripped by the gripper 36 to the treating positions above the two spin holders 32.
Referring back to
The main transport mechanism T1 will be described specifically. Reference is made to
The base 53 has a turntable 55 rotatable about a vertical axis Q. The turntable 55 has two holding arms 57a and 57b horizontally movably attached thereto for holding wafers W, respectively. The two holding arms 57a and 57b are arranged vertically close to each other. Further, drive members (not shown) are provided for rotating the turntable 55, and moving the holding arms 57a and 57b. The drive members are operable to move the turntable 55 to positions opposed to the coating units 31, heat-treating units 41 and receivers PASS1 and PASS2, and to extend and retract the holding arms 57a and 57b to and from the coating units 31 and so on.
The story K3 will be described next. Like reference numerals are used to identify like parts which are the same as in the story K1, and will not be described again. The layout (arrangement) in plan view of the main transport mechanism T3 and treating units in the story K3 is substantially the same as in the story K1. Thus, the arrangement of the various treating units of the story K3 as seen from the main transport mechanism T3 is substantially the same as the arrangement of the various treating units of the story K1 as seen from the main transport mechanism T1. The coating units 31 and heat-treating units 41 of the story K3 are stacked under the coating units 31 and heat-treating units 41 of the story K1, respectively. The treating block Ba constructed in this way corresponds to the coating block in this invention.
In the following description, when distinguishing the resist film coating units RESIST in the stories K1 and K3, subscripts “1” and “3” will be affixed (for example, the resist film coating units RESIST in the story K1 will be referred to as “resist film coating units RESIST1”).
The other aspects of the treating block Ba will be described. As shown in
Referring to
As shown in
The pit portions PS further accommodate piping of the treating solutions, electric wiring and the like (not shown). Thus, with the pit portions PS accommodating the piping and electric wiring provided for the coating units 31 of the stories K1 and K3, the piping and electric wiring can be reduced in length.
The treating block Ba has one housing 75 for accommodating the main transport mechanisms T1 and T3 and treating units U1 and U3 described hereinbefore. The treating block Bb described hereinafter also has a housing 75 for accommodating the main transport mechanisms T2 and T4 and the treating units U2 and U4 associated therewith. The housing 75 of the treating block Ba and the housing 75 of the treating block Bb are separate entities. Thus, with each of the treating blocks Ba and Bb having the housing 75 accommodating the main transport mechanisms T and treating units U en bloc, the treating section 3 may be manufactured and assembled simply.
The treating block Bb is disposed adjacent the IF section 5. The story K2 will be described. Like reference numerals are used to identify like parts which are the same as in the story K1 and will not be described again.
The story K2 has a transporting space A2 formed as an extension of the transporting space A1. The treating units U on the story K2 are developing units DEV for developing wafers W, heat-treating units 42 for heat-treating the wafers W, and an edge exposing unit EEW for exposing peripheral regions of the wafers W. The developing units DEV are arranged at one side of the transporting space A2, and the heat-treating units 42 and edge exposing unit EEW are arranged at the other side of the transporting space A2. Preferably, the developing units DEV are arranged at the same side as the coating units 31. It is also preferable that the heat-treating units 42 and edge exposing unit EEW are arranged in the same row as the heat-treating units 41. The developing units DEV and heat-treating units 42 are the treating units U2 for the post-exposure treatment. The edge exposing unit EEW is the treating unit U1 for the pre-exposure treatment.
The number of developing units DEV is four, and sets of two units DEV arranged horizontally along the transporting space A2 are stacked one over the other. As shown in
The plurality of heat-treating units 42 are arranged sideways along the transporting space A2, and stacked one over the other. The heat-treating units 42 include heating units HP for heating wafers W, cooling units CP for cooling wafers W, and heating and cooling units PHP for successively carrying out heating treatment and cooling treatment.
The plurality of heating and cooling units PHP are vertically stacked in the column closest to the IF section 5, each having one side facing the IF section 5. The heating and cooling units PHP on the story K2 have transport ports formed in the sides thereof for passage of wafers W. IF transport mechanisms TIF to be described hereinafter transport wafers W through the above transport ports to the heating and cooling units PHP. The heating and cooling units PHP arranged on the story K2 carry out post-exposure baking (PEB) treatment. Thus, the heating and cooling units PHP on the story K2 correspond to the PEB units in this invention.
The single edge exposing unit EEW is disposed in a predetermined position. The edge exposing unit EEW includes a spin holder (not shown) for holding and spinning a wafer W, and a light emitter (not shown) for exposing edges of the wafer W held by the spin holder.
The receiver PASS5 is formed on top of the heating and cooling units PHP on the story K2. The main transport mechanism T2 and IF transport mechanisms TIF to be described hereinafter transfer wafers W through the receiver PASS5.
The main transport mechanism T2 is disposed substantially centrally of the transporting space A2 in plan view. The main transport mechanism T2 has the same construction as the main transport mechanism T1. The main transport mechanism T2 transports wafers W to and from the receiver PASS2, various heat-treating units 42, edge exposing unit EEW and receiver PASS5.
The story K4 will be described briefly. The relationship in construction between story K2 and story K4 is similar to that between stories K1 and K3. The treating units U on the story K4 are developing units DEV, heat-treating units 42 and an edge exposing unit EEW. The heat-treating units 42 on the story K4 include heating units HP, cooling units CP and heating and cooling units PHP. The receiver PASS6 is formed on top of the heating and cooling units PHP on the story K4. The main transport mechanism T4 and IF transport mechanisms TIF described hereinafter transfer wafers W through the receiver PASS6. The heating and cooling units PHP on the story K4 also correspond to the PEB units in this invention.
In the following description, when distinguishing the developing units DEV, edge exposing units EEW and so on provided on the stories K2 and K4, subscripts “2” and “4” will be affixed (for example, the heating units HP on the story K2 will be referred to as “heating units HP2”).
Each of the transporting spaces A2 and A4 of the stories K2 and K4 also has constructions corresponding to the first blowout unit 61 and exhaust unit 62. Each developing unit DEV of the stories K2 and K4 also has constructions corresponding to the second blowout unit 67 and second gas exhaust pipe 66.
The treating block Bb constructed in this way corresponds to the PEB block in this invention. The treating block Bb corresponds also to the developing block in this invention.
The IF section 5 transfers wafers W between each of the substrate treatment lines Lu and Ld (stories K2 and K4) of the treating section 3 and the exposing machine EXP. The IF section 5 has IF transport mechanisms TIF for transporting wafers W. The IF transport mechanisms TIF include a first transport mechanism TIFA and a second transport mechanism TIFB that can transfer wafers W to and from each other. The first transport mechanism TIFA transports wafers W to and from the substrate treatment lines Lu and Ld. In this embodiment, as described hereinbefore, the first transport mechanism TIFA transports wafers W to and from the receivers PASS5 and PASS6 on the stories K2 and K4, and to and from the heating and cooling units PHP on the stories K3 and K4. The second transport mechanism TIFB transports wafers W to and from the exposing machine EXP. The IF transport mechanisms TIF correspond to the interface transport mechanisms in this invention.
As shown in
As shown in
A control system of this apparatus 10 will be described next.
The main controller 91 performs overall control of the first to seventh controllers 93-99. Further, the main controller 91 can communicate through a host computer with an exposing machine controller provided for the exposing machine EXP. The first controller 93 controls substrate transport by the ID transport mechanism TID. The second controller 94 controls substrate transport by the main transport mechanism T1, and substrate treatment in the resist film coating units RESIST1, antireflection film coating units BARC1, cooling units CP1, heating and cooling units PHP1 and adhesion units AHL1. The third controller 95 controls substrate transport by the main transport mechanism T2, and substrate treatment in the edge exposing unit EEW2, developing units DEV2, heating units HP2 and cooling units CP2. The controls by the fourth and fifth controllers 96 and 97 correspond to those by the second and third controllers 94 and 95, respectively. The sixth controller 98 controls substrate transport by the first transport mechanism TIFA, and substrate treatment in the heating and cooling units PHP2 and PHP4. The seventh controller 99 controls substrate transport by the second transport mechanism TIFB. The first to seventh controllers 93-99 carry out the controls independently of one another.
Each of the main controller 91 and the first to seventh controllers 93-99 is realized by a central processing unit (CPU) which performs various processes, a RAM (Random Access Memory) used as the workspace for operation processes, and a storage medium such as a fixed disk for storing a variety of information including a predetermined processing recipe (processing program).
Next, operation of the substrate treating apparatus in this embodiment will be described.
The ID transport mechanism TID moves to a position opposed to one of the cassettes C, holds with the holding arm 25 a wafer W to be treated and takes the wafer W out of the cassette C. The ID transport mechanism TID swivels the holding arm 25, vertically moves the lift shaft 23, moves to a position opposed to the receiver PASS1, and places the wafer W on the receiver PASS1A (which corresponds to step S1a in
This operation of the ID transport mechanism TID is controlled by the first controller 93. As a result, the wafers W in the cassette C are fed to the story K1, and the wafers W delivered from the story K1 are stored in the cassette C. Similarly, the wafers W in the cassette C are fed to the story K3, and the wafers W delivered from the story K3 are stored in the cassette C.
Since operation of the main transport mechanism T3 is substantially the same as operation of the main transport mechanism T1, only the main transport mechanism T1 will be described. The main transport mechanism T1 moves to a position opposed to the receiver PASS1. At this time, the main transport mechanism T1 holds on one holding arm 57 (e.g. 57b) a wafer W received immediately before from the receiver PASS2B. The main transport mechanism T1 places this wafer W on the receiver PASS1B (step S22), and holds the wafer W present on the receiver PASS1A with the other holding arm 57 (e.g. 57a).
The main transport mechanism T1 accesses a predetermined one of the cooling units CP1. There is a different wafer W having already received a predetermined heat treatment (cooling) in the cooling unit CP1. The main transport mechanism T1 holds the different wafer W with the unloaded holding arm 57 (holding no wafer W), takes it out of the cooling unit CP1, and loads into the cooling unit CP1 the wafer W having received from the receiver PASS1A. Then, the main transport mechanism T1, holding the cooled wafer W, moves to one of the antireflection film coating units BARC1. The cooling unit CP1 starts heat treatment (cooling) of the wafer W loaded therein (step S2). This heat treatment (cooling) will have been finished by the time the main transport mechanism T1 accesses this cooling unit CP1 next time. The following description assumes that wafers W having received predetermined treatments are present also in the other different heat-treating units 41 and coating units 31 when the main transport mechanism T1 makes access thereto.
Accessing the antireflection film coating unit BARC1, the main transport mechanism T1 takes a wafer W having antireflection film formed thereon from the antireflection film coating unit BARC1, and places the cooled wafer W on the spin holder 32 of the antireflection film coating unit BARC1. Then, the main transport mechanism T1, holding the wafer W having antireflection film formed thereon, moves to one of the heating and cooling units PHP1. The antireflection film coating unit BARC1 starts treatment of the PHP1wafer W placed on the spin holder 32 (step S3).
Specifically, the spin holder 32 spins the wafer W in horizontal posture, the gripper 26 grips one of the nozzles 35, the nozzle moving mechanism 37 moves the gripped nozzle 35 to a position above the wafer W, and the treating solution for antireflection film is supplied from the nozzle 35 to the wafer W. The treating solution supplied spreads all over the wafer W, and is scattered away from the wafer W. The cup 33 collects the scattering treating solution. In this way, the treatment is carried out for forming antireflection film on the wafer W.
Accessing the heating and cooling unit PHP1, the main transport mechanism T1 takes a wafer W having received heat treatment out of the heating and cooling unit PHP1, and loads the wafer W having antireflection film formed thereon into the heating and cooling unit PHP1. Then, the main transport mechanism T1, holding the wafer W taken out of the heating and cooling unit PHP1, moves to one of the cooling units CP1. The heating and cooling unit PHP1 receives a wafer W successively on the two plates 43, to heat the wafer W on one of the plates 43 and then to cool the wafer W on the other plate 43 (step S4).
Having moved to the cooling unit CP1, the main transport mechanism T1 takes a wafer W out of the cooling unit CP1, and loads the wafer W held by the transport mechanism T1 into the cooling unit CP1. The cooling unit CP1 cools the wafer W loaded therein (step S5).
Then, the main transport mechanism T1 moves to one of the resist film coating units RESIST1. The main transport mechanism T1 takes a wafer W having resist film formed thereon from the resist film coating unit RESIST1, and loads the wafer W held by the main transport mechanism T1 into the resist film coating unit RESIST1. The resist film coating unit RESIST1 supplies the resist film material while spinning the wafer W loaded therein, to form resist film on the wafer W (step S6).
The main transport mechanism T1 further moves to one of the heating and cooling units PHP1 and one of the cooling units CP1. The main transport mechanism T1 loads the wafer W having resist film formed thereon into the heating and cooling unit PHP1, transfers a wafer W treated in the heating and cooling unit PHP1 to the cooling unit CP1, and receives a wafer W treated in the cooling unit CP1. The heating and cooling unit PHP1 and cooling unit CP1 carry out predetermined treatments of newly loaded wafers W, respectively (steps S7 and S8).
The main transport mechanism T1 moves to the receiver PASS2, places the wafer W it is holding on the receiver PASS2A (step S9), and receives a wafer W present on the receiver PASS2B (step S21).
Subsequently, the main transport mechanism T1 accesses the receiver PASS1 again, and repeats the above operation. This operation is controlled by the second controller 94. As a result, all the wafers W transported from the cassette C to the receiver PASS1 receive the same type of treatment in the treating units U provided on the story K1. Specifically, the same type of treatment refers to the treatment carried out in each of the cooling units CP1, antireflection film coating units BARC1, heating and cooling units PHP1, cooling units CP1, resist film coating units RESIST1, heating and cooling units PHP1 and cooling units CP1 to which the wafers W are transported in order. All these treatments are pre-exposure treatments.
The main transport mechanism T1 transports a wafer W having been transported to the receiver PASS1 to a predetermined treating unit U1 (a cooling unit CP1 in this embodiment), and takes a treated wafer W from this treating unit U1. Subsequently, the main transport mechanism T1 transports the wafer W taken out to a different treating unit U1, and takes a treated wafer W from the different treating unit U1. In this way, the treatment is carried out in parallel for a plurality of wafers W by transferring a treated wafer W from each treating unit U1 to a new treating unit U1. Starting with a wafer W first placed on the receiver PASS1, the wafers W are successively placed on the receiver PASS2 to be fed to the story K2. Similarly, the wafers W are placed on the receiver PASS1 in the order of placement on the receiver PASS2, to be fed to the ID section 1.
Since operation of the main transport mechanism T4 is substantially the same as operation of the main transport mechanism T2, only the main transport mechanism T2 will be described. The main transport mechanism T2 moves to a position opposed to the receiver PASS2. At this time, the main transport mechanism T2 holds a wafer W received from a cooling unit CP2 accessed immediately before. The main transport mechanism T2 places this wafer W on the receiver PASS2B (step S21), and holds the wafer W present on the receiver PASS2A (step S9).
The main transport mechanism T2 accesses the edge exposing unit EEW2. The main transport mechanism T2 receives a wafer W having received a predetermined treatment in the edge exposing unit EEW2, and loads the cooled wafer W into the edge exposing unit EEW2. While spinning the wafer W loaded therein, the edge exposing unit EEW2 irradiates peripheral regions of the wafer W with light from the light emitter not shown, thereby exposing the peripheral regions of the wafer W (step S10).
The main transport mechanism T2, holding the wafer W received from the edge exposing unit EEW2, accesses the receiver PASS5. The main transport mechanism T2 places the wafer W on the receiver PASS5A (step S11), and holds a wafer W present on the receiver PASS5B (step S16).
The main transport mechanism T2 moves to one of the cooling units CP2, and replaces a wafer W in the cooling unit CP2 with the wafer W held by the main transport mechanism T2. The main transport mechanism T2 holds the wafer W having received cooling treatment, and accesses one of the developing units DEV2. The cooling unit CP2 starts treatment of the newly loaded wafer W (step S17).
The main transport mechanism T2 takes a developed wafer W from the developing unit DEV2, and places the cooled wafer W on the spin holder 77 of the developing unit DEV2. The developing unit DEV2 develops the wafer W placed on the spin holder 77 (step S18). Specifically, while the spin holder 77 spins the wafer W in horizontal posture, the developer is supplied from one of the slit nozzles 81a to the wafer W, thereby developing the wafer W.
The main transport mechanism T2 holds the developed wafer W, and accesses one of the heating units HP2. The main transport mechanism T2 takes a wafer W out of the heating unit HP2, and loads the wafer W it is holding into the heating unit HP2. Then, the main transport mechanism T2 transports the wafer W taken out of the heating unit HP2 to one of the cooling units CP2, and takes out a wafer W already treated in this cooling unit CP2. The heating unit HP2 and cooling unit CP2 carry out predetermined treatments for the newly loaded wafers W, respectively (steps S19 and S20).
Subsequently, the main transport mechanism T2 accesses the receiver PASS2 again, and repeats the above operation. This operation is controlled by the third controller 95. As a result, the wafers W are forwarded to the receiver PASS5B in the order in which they are placed on the receiver PASS2A. Similarly, the wafers W are forwarded to the receiver PASS2B in the order in which they are placed on the receiver PASS5B.
The control section 90 controls the IF transport mechanisms TIF for causing all the plurality of wafers W that receive the same type of treatment in the same substrate treatment line L to be exposed on the same exposing stage S1 or exposing stage S2. Since the stories K constitute the substrate treatment lines in this embodiment, “the same substrate treatment line L” can also be put in another way as “the same stories K”. To carry out “the same type of treatment in the same substrate treatment line L” includes the case, as in this embodiment, where various types of treatment are all constantly carried out for the wafers W in the substrate treatment line Lu or Ld. However, such a case is not limitative. Each of various types of treatment included in the pre-exposure and post-exposure treatments may be carried out in the same substrate treatment line L. Specifically, the pre-exposure treatment may be carried out in the substrate treatment line Lu, and the post-exposure treatment in the substrate treatment line Ld. Part of the pre-exposure treatment (e.g. the treatment for forming resist film) may be carried out in the substrate treatment line Lu, and other pre-exposure treatment (e.g. edge exposing treatment for exposing peripheral regions of wafers W) in the substrate treatment line Ld.
The control section 90 controls in a way to avoid a situation where part of the plurality of wafers W that receive the same type of treatment in the same substrate treatment line L are exposed on the exposing stage S1, and the rest on the exposing stage S2. In this embodiment, wafers W are treated only in one of the substrate treatment lines Lu and Ld, the wafers W treated in the substrate treatment line Lu are all exposed on the exposing stage S1, and the wafers W treated in the substrate treatment line Ld on the exposing stage S2. With such control, it is possible to avoid concentration of the wafers W on one of the exposing stages S and lowering of the operating ratio of the other exposing stage S, thereby allowing the exposing machine EXP to expose the wafers W efficiently. The substrate treatment line L that carries out post-exposure treatment (e.g. post-exposure baking (PEB) treatment) of each wafer W is the same substrate treatment line L that carried out pre-exposure treatment (e.g. resist film formation) of that wafer W. This can make uniform the quality of the entire series of treatments including exposure and treatments before and after the exposure. Further, wafers W are not transported between the substrate treatment lines Lu and Ld, which facilitates transport control for each substrate treatment line L.
A specific example of control by the control section 90 will be described hereinafter. The control section 90 controls the IF transport mechanisms TIF with reference to coordination information. The coordination information determines, for each wafer W, at least either which substrate treatment line L to treat the wafer W or which exposing stage S to expose the wafer W. As a preferred composition of the coordination information, treatment information which determines either of the substrate treatment lines Lu and Ld or either of the exposing stages S1 and S2 is related to substrate identification information which identifies each wafer W actually transferred between the IF section 5 and exposing machine EXP.
At this time, the control section 90 and the exposing machine controller communicate the coordination information or corresponding information and commands to each other to secure coordination between operations of the apparatus 10 and exposing machine EXP. Further, the control section 90 may be arranged to output information including commands and instructions for supervising or controlling the exposing machine EXP to the exposing machine controller. Alternatively, the control section 90 may be arranged to control the IF transport mechanisms TIF to change a position for, or a method of, passing wafers W from the IF section 5 to the exposing machine EXP, thereby being capable of switching or selecting an exposing stage S for exposing each wafer W.
In the coordination information shown in
Since transport information “1”, “2” and so on can be related to the wafers W according to the order of transfer between the IF section 5 and exposing machine EXP, each transport information shown in
Based on the coordination information shown in
By operating the IF transport mechanisms TIF in this way, the wafers W are transferred from the substrate treatment lines L selected successively to the exposing machine EXP, and the wafers W received from the exposing machine EXP are transferred to the substrate treatment lines L selected successively. As a result, the plurality of wafers W receiving the same type of treatment in the same substrate treatment line L are exposed on the same exposing stage S1 or S2. The coordination information shown in
Although it has been described that the control section 90 carries out the control of the IF transport mechanisms TIF specifically any one of the main controller 91, sixth controller 98 and seventh controller 99 may carry out the control, or these controllers may share the control appropriately.
An example of operation of each of the first transport mechanism TIFA and second transport mechanism TIFB will be described hereinafter. It should be noted, however, that operations of the first transport mechanism TIFA and second transport mechanism TIFB are changed as appropriate according to the control carried out by the control section 90 with reference to the coordination information described above.
The first transport mechanism TIFA accesses the receiver PASS5, and receives the wafer W present on the receiver PASS5A (step S11a). The first transport mechanism TIFA, holding the wafer W received, moves to the receiver PASS-CP, and loads the wafer W on the receiver PASS-CP (step S12).
Next, the first transport mechanism TIFA receives a wafer W from the receiver PASS7 (step S14), and moves to a position opposed to one of the heating and cooling units PHP2. The first transport mechanism TIFA takes a wafer W having received post-exposure baking treatment (PEB) treatment from the heating and cooling unit PHP2, and loads the wafer W received from the receiver PASS7 into the heating and cooling unit PHP2. The heating and cooling unit PHP2 carries out heat treatment for the newly loaded wafer W (step S15a).
The first transport mechanism TIFA transports the wafer W taken out of the heating and cooling unit PHP2 to the receiver PASS5B. Subsequently, the first transport mechanism TIFA transports a wafer W from the receiver PASS6A to the receiver PASS-CP (Step S11b, S12). Next, the first transport mechanism TIFA transports a wafer W from the receiver PASS7 to one of the heating and cooling units PHP4. At this time, the first transport mechanism TIFA takes out a wafer W having received the post-exposure baking treatment (PEB) treatment in the heating and cooling unit PHP4, and places the wafer W on the receiver PASS6B (steps S14, S15b, S16b).
Subsequently, the first transport mechanism TIFA accesses the receiver PASS5 again and repeats the above operation.
The second transport mechanism TIFB takes a wafer W out of the receiver PASS-CP, and transports it to the exposing machine EXP. Then, the second transport mechanism TIFB receives an exposed wafer W from the exposing machine EXP, and transports it to the receiver PASS7 (step S13).
Subsequently, the second transport mechanism TIFB accesses the receiver PASS-CP again and repeats the above operation.
In the substrate treating apparatus according to this embodiment, as described above, the control section 90 controls transport of wafers W in the IF section 5 to cause all the plurality of wafers W that receive the same type of treatment in the same substrate treatment line L to be exposed on the same exposing stage S. Compared with the case of using the plurality of exposing stages S together, this control can inhibit variations in the quality of entire treatment including the treatment in the substrate treatment lines L and exposure in the exposing machine EXP occurring among the plurality of wafers W receiving the same type of treatment in the same substrate treatment line L.
The control section 90, which refers to the coordination information for control, can carry out the control effectively.
The coordination information has treatment information related to substrate identification information which identifies each wafer W actually transferred between the IF section 5 and exposing machine EXP that determines the substrate treatment lines Lu and Ld and/or the exposing stages S1 and S2,. It is therefore possible to cause each wafer W transferred to be treated in a desired one of the substrate treatment lines L and exposed on a desired one of the exposing stages S.
The treatment in each substrate treatment line L includes resist film forming treatment and post-exposure baking (PEB) treatment. This ensures uniform quality of the entire treatment including the resist film forming treatment, exposure and post-exposure baking (PEB) treatment.
Each substrate treatment line L, with the plurality of main transport mechanisms T, can transport wafers W efficiently.
Each substrate treatment line L has a plurality of resist film coating units RESIST arranged at substantially the same height. Thus, the quality of treatment can be made uniform among the resist film coating units RESIST.
Each substrate treatment line L has a plurality of antireflection film coating units BARC arranged at substantially the same height. Thus, the quality of treatment can be made uniform among the antireflection film coating units BARC.
The resist film coating units RESIST and antireflection film coating units BARC provided for each substrate treatment line L are stacked vertically. This arrangement realizes a reduced installation area.
The atmosphere around each antireflection film coating unit BARC is not blocked off (i.e. is in communication), nor is the atmosphere around each resist film coating unit RESIST blocked off. Thus, environment can be further made uniform among the resist film coating units RESIST and among the antireflection film coating units BARC.
The treating section 3, which has the substrate treatment lines L, is formed of a plurality of (two) treating blocks Ba and Bb arranged horizontally (substantially in the same direction as the transport direction). Thus, a treating section 3 suited to the contents and object of treatment carried out for wafers W can be formed easily by combining two or more types of treating blocks Ba and Bb as appropriate.
Atmosphere is blocked off between the stories K of each treating block Ba or Bb. This allows the atmosphere of each story K to be easily maintained clean. It is also easy to keep the environment on each story K constant.
This invention is not limited to the foregoing embodiment. Some other exemplary embodiments are described in the following paragraphs.
It has been described in the foregoing embodiment that the substrate treatment line L which carries out post-exposure treatment (e.g. post-exposure baking (PEB) treatment) for each wafer W preferably is the same substrate treatment line L having carried out pre-exposure treatment (e.g. resist film forming treatment) for that wafer W. However, different treatment lines may be used for each wafer W. As shown in
It has been described in the foregoing embodiment that the separate exposing machine EXP is disposed adjacent the apparatus 10. Instead, the apparatus 10 may not be close to the exposing machine EXP. In such a case also, the plurality of resist film coating units RESIST provided for each substrate treatment line L are arranged at substantially the same height, and thus the quality of treatment can be uniformed among these coating units. Similarly, the plurality of antireflection film coating units BARC provided for each substrate treatment line L are arranged at substantially the same height, and thus the quality of treatment can be uniformed among these coating units.
The foregoing embodiment provides two substrate treatment lines L, but the invention not limited to this. The construction may be modified to include three or more substrate treatment lines L vertically arranged in multiple stages.
In the foregoing embodiment, the treating section 3 having the substrate treatment lines L is formed of two treating blocks Ba and Bb, but the invention not limited to this. The construction may be modified to include three or more treating blocks arranged side by side.
In the foregoing embodiment, the substrate treatment lines L carry out the treatment for forming resist film and antireflection film on the wafers W, as well as the post-exposure baking (PEB) treatment and developing treatment. The substrate treatment lines L may be modified to perform other treatment such as cleaning of the wafers W. Accordingly, the type, number and the like of treating units are selected or designed as appropriate. Further, the substrate treating apparatus may be constructed to exclude the IF section 5.
The exposing machine EXP described above has two exposing stages S, but this is not limitative. The apparatus 10 is usable also with an exposing machine EXP having three or more exposing stages S.
In the foregoing embodiment, the wafers W may be transported to the substrate treatment line L and exposing machine EXP for additional times, i.e. twice or more, to form circuit patterns in two or more separate steps on the same oxide film acting as underlying film. In this process, the substrate treatment line L to which the wafers W are transported for the second time or later time may be the same substrate treatment line L to which the wafers W are transported for the first time. Then, the quality of circuit pattern linewidth may be made uniform between the circuit pattern formed in the first step and that formed in the second step.
The foregoing embodiment provides no partition or the like between the antireflection film coating units BARC and resist film coating units RESIST arranged on each story K1 or K2, but allows the atmosphere to be shared among these coating units. Instead, the atmosphere may be blocked off as appropriate.
This invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof and, accordingly, reference should be made to the appended claims, rather than to the foregoing specification, as indicating the scope of the invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| JP2007-310675 | Nov 2007 | JP | national |
