Probe-based data collection system with adaptive mode of probing controlled by local sample properties

Information

  • Patent Grant
  • 9891280
  • Patent Number
    9,891,280
  • Date Filed
    Friday, December 2, 2016
    7 years ago
  • Date Issued
    Tuesday, February 13, 2018
    6 years ago
Abstract
A method for testing an integrated circuit (IC) using a nanoprobe, by using a scanning electron microscope (SEM) to register the nanoprobe to an identified feature on the IC; navigating the nanoprobe to a region of interest; scanning the nanoprobe over the surface of the IC while reading data from the nanoprobe; when the data from the nanoprobe indicates that the nanoprobe traverse a feature of interest, decelerating the scanning speed of the nanoprobe and performing testing of the IC. The scanning can be done at a prescribed nanoprobe tip force, and during the step of decelerating the scanning speed, the method further includes increasing the nanoprobe tip force.
Description
BACKGROUND

1. Field of Invention


This invention is in the field of sample probing (including electrical) using scanning probe and nanoprobing systems.


2. Related Art


Nanoprobing (using scanning or point probing) is a very broad field of analytical science covering various types of electrical, mechanical, compositional and chemical physical characterization of nano-size objects. Nanoelectronic devices and their components are examples of such objects. Electrical probing of single transistors, memory bitcell and critical parts of integrated circuits (IC) is used widely to test performance of newly designed IC and to correct potential problems of the specific IC design or/and overall technology.


To test the elements of an IC, the nanoprobes are made to physically contact the surface of the IC and to scan the surface of the IC. The scanning can be used to generate topography image, capacitance image (dC/dV), etc. To generate those images, every pixel of the image is generated as the probe scan the surface at the same speed and with the same force applied to the probe. However, there are circumstances wherein certain areas of the scanning are not of interest for the particular test, in which case there's no need for slow, high-resolution scanning. In other cases, certain areas of the region of interest (ROI) may constitute a softer or more sensitive layer, such that less force should be applied. In yet other cases the probes should simply contact certain elements without the need for scanning, e.g., to read electrical signals in a point probing mode. Thus, there's a need for improved nanoprobing device and method for operating the nanoprobes, such that the above cases are taken into consideration.


SUMMARY

The following summary of the disclosure is included in order to provide a basic understanding of some aspects and features of the invention. This summary is not an extensive overview of the invention and as such it is not intended to particularly identify key or critical elements of the invention or to delineate the scope of the invention. Its sole purpose is to present some concepts of the invention in a simplified form as a prelude to the more detailed description that is presented below.


Various disclosed embodiments utilize systems and methods wherein the probe scanning speed and force are variable during the scanning of the sample. When the probes are scanning areas that are of no interest, the speed can be increased until a new area of interest is reached, wherein the speed is decreased. Similarly, when the probe is scanning a sensitive area, or area of no interest, the force can be reduced, to prevent damage to the sensitive area and to reduce wear of the probes. For example, when the probes are scanning over an interlayer dielectric, the force should be reduced (to cause less sample damage and less probe-tip wear) and the speed should be increased (to provide higher throughput, even at reduced resolution), since the dielectric area is of no interest for the electrical testing).


In other embodiments, the probes are used to collect electrical data and, therefore, need not scan the sample, but rather contact specific points on the device. In such cases, the probes' positions are registered to the sample outside of the area of interest. Then, the probes are moved blindly above the sample, i.e., without physical contact with the sample, to the ROI using a priori knowledge of the circuit layout (e.g., from CAD file). When the probes are in the proper position above the specific points, the probes are moved down so as to “land” on the appropriate points.


According to disclosed embodiments, an adaptive (i.e., variable) mode of probe motion is executed during sample probing. The adaptive mode operates the probes to test the sample using a combination of any of the following modes of motion: hopping, contact scanning, non-contact scanning, taping, scanning with variable feedback type, scanning at different speeds, scanning at different force, scanning at different amplitude of oscillation, etc. The specific mode of motion is selected according to the local properties of the sample, which may be known a priory (for example from CAD information) or/and assessed in real time (for example from robust high signal-to-noise ratio electrical or mechanical probe signal).


The embodiments are beneficial as data quality improvement achieved using an optimized probe-sample interaction adjusted for and dependent on (1) local properties of the sample and also (2) type of measurement to be done at the particular location. The embodiments are also beneficial for preserving of the sample and probe(s) for repeatable and precise measurements on the stable sample-probe system, by avoiding unnecessary wear of the probe tips.





DRAWINGS

Other aspects and features of the invention would be apparent from the detailed description, which is made with reference to the following drawings. It should be mentioned that the detailed description and the drawings provide various non-limiting examples of various embodiments of the invention, which is defined by the appended claims.


The accompanying drawings, which are incorporated in and constitute a part of this specification, exemplify the embodiments of the present invention and, together with the description, serve to explain and illustrate principles of the invention. The drawings are intended to illustrate major features of the exemplary embodiments in a diagrammatic manner. The drawings are not intended to depict every feature of actual embodiments nor relative dimensions of the depicted elements, and are not drawn to scale.



FIG. 1 illustrates a probing system according to one embodiment;



FIG. 2 illustrates various probing modes according to an embodiment;



FIG. 3 illustrates registration and blind move according to one embodiment.





DETAILED DESCRIPTION

Various embodiments will be described below to achieve the benefits of the invention. Some of the benefits include the following.


(1) Scanning a sample with physical contact of the probe tip can damage the sample. For certain locations or parts of the sample, physical contact with prescribed force or pressure is required in order to obtain the needed data. However, there are cases where some parts of the sample are not that critical for the tests. In such cases, disclosed embodiments avoid damage caused by contact mode of scanning.


(2) The prober throughput and data quality can be optimized using high-speed low-pressure or non-contact motion over areas of no-interest, and slow increased-pressure contact motion (optimized) or even a full stop at sites of interest (for the period of time needed to achieve desired quality of data).


(3) The probe tip lifetime can be improved by avoiding high pressure and/or contact with the sample when not needed. The probe tip can be made to “fly” over areas of no-interest at safe height above the sample's surface.


(4) When high-integrity electrical data needs to be collected from the sample, the data quality can be improved by placing the probe in complete stop and full contact during data acquisition.


The above benefits are achieved by the following embodiments.



FIG. 1 illustrates a nanoprober system according to one embodiments of the invention. A sample 105, such as a microchip, is placed on an x-y-z stage 110. The stage 110 may be controlled by controller 130, or by a separate stage controller. A nanoprober 115 includes an actuator 113, for example, a piezoelectric actuator, and a probe tip 117. The probe tip 117 can be placed and/or moved across the surface of sample 105, by the motion of the actuator 113. The actuator 113 is controlled by controller 130. Also, if data is collected from the probe tip 117, the data is sent to the controller 130. Additionally, the motion of the tip 117 can be sensed by illuminating the tip using laser 120 and sensing the reflection using optical sensor 125. The illumination and optical sensing can be controlled using the same controller 130. The optical sensing is especially beneficial for sensing z-motion, i.e., changes of elevation, amplitude and frequency of oscillation of the probe tip 117, so as to create topography map, surface potential map, capacitance map, etc. More information about this technique can be found in U.S. Pat. No. 5,267,471, the disclosure of which is incorporated herein by reference in its entirety. While in FIG. 1 only one nanoprober 115 is illustrated, in the various embodiments described, a plurality of nanoprobers is used to simultaneously test the sample. In one example, eight nanoprober tips are controlled simultaneously by the controller 130.



FIG. 2 illustrates an embodiment of a method for adoptive scanning the probe tips 117, such as illustrated in FIG. 1. A cross-section of part of sample 105 is illustrated at the bottom of FIG. 2. In this example, the sample 105 has metal areas 102 and areas of interlayer dielectric 104. Scanning and time progresses from left to right and is shown on the x-axis of the plot in the upper part of FIG. 2. The speed (shown as dotted line) and the force of scanning (shown by double-dotted line) are controlled by the controller according to the probing signal (shown in solid line), read from the prober. Speed, force and probe signals are plotted over the Y-axis. For example, if checking the probe signal for conductivity or capacitive signal (dC/dV), when the probe tip is over the dielectric region 104, i.e., on the left side of the sample 105, no or low-level signal is read from the prober. During this time, the prober is operated at high speed and low pressure mode. Once the high-level signal is detected (solid-line plot), it indicates that the probe tip is traversing over a conductive region 102. The speed is then slowed down until it the prober reaches full stop. Meanwhile, the force is increased and data acquisition starts. The force can be measured by, e.g., stress or strain sensors measuring the bending of the probe tip and feeding the signal to the controller 130. Once proper probing signal-to-noise level is achieved, data acquisition stops and scanning is continued at the high speed and with low (or zero) force of contact. The scanning proceeds in this mode until the next indication of metal or high signal region is reached, wherein the process repeats.


According to another example, the changes of scanning speed and force of probe-sample interaction is triggered by CAD information from a CAD file 140 (FIG. 1). Moreover, the CAD data file can be used together with the capacitance (dC/dV) or any other signal. For example, when the CAD data indicates that the probe tip is over regions representing interlayer dielectric, these regions could be skipped all together (hopped over) or scanned with the fastest speed and the lowest contact force. Then, prior to reaching an area indicated by the CAD data to correspond to a conductive (or other feature of interest), the speed is slowed and the force may or may not be increased, and the scan is continued while reading the capacitance or other data from the prober. Once a pre-set threshold of capacitance dC/dV signal is detected, the probe scanning is controlled according to the speed/force signals shown in FIG. 2. The data acquisition continues until proper signal-to-noise ratio is achieved, and then scanning at the high speed and low (possibly zero for hopping) force is continued towards the next feature, as indicated by the CAD data. Thus, according to this embodiment, three modes can be used: hopping (no contact, zero force, and highest speed), high speed/low force, and deceleration to a stop while increasing force to a maximum set point.


According to one embodiment, the probe to sample registration is conducted outside of the area of interest. The probe can be registered to the sample using imaging, e.g., scanning electron microscope (SEM) imaging. The sample may also be registered to a CAD pattern, if it is to be used for hopping/scanning modes. Once the probes are registered to SEM image and CAD pattern, “blind moves” to the points of interest followed by data acquisition could be made. The blind moves can be assisted using the CAD data for navigation, similar to a GPS (global position system). Depending on the amount of probe vs. stage drift, periodic probe to sample re-registration and correction may be needed.



FIG. 3 illustrates the use of SEM for registration, and then performing blind motion to the ROI using, e.g., CAD data. In FIG. 3, a section of sample 105 is illustrated, wherein two particular sections are delineated, an ROI (which may be sensitive device) and a non-ROI (which may be an alignment target or a feature of no interest). Within the delineated areas part of the surface is dielectric 104, and parts are features of interest 102, e.g., metal contacts, metal lines, etc. The non-ROI section is first imaged using SEM, and the probe tips 117 are landed on the sample. Tip position for each probe is registered to the sample SEM image and the corresponding CAD pattern. Since this delineated area is not of interest, it can be exposed to e-beam of the SEM. However, in order not to disturb or damage the ROI, no e-beam is scanned over the ROI, such that no SEM image of the ROI is produced. Instead, the system uses information from CAD design or other navigation aid, to blindly move each tip to a selected feature of interest in the ROI and land the tips on the selected features of interest in the ROI. According to one example, the move is followed by data acquisition with zero probe speed and optimal force of contact, followed by blind move to the next area of interest or back to the registration no-interest area. Moves are done using CAD or/and other navigation data. During every return to the registration point, probe to sample position is re-adjusted. The later will reduce probe to sample registration inaccuracy caused by slow relative drift of the two (for example by thermal drift).


Although electrical nanoprobing was provided as an example of adaptive probing, the same approach can be used for other types of probing. According to one example, tip-enhanced optical circuit analysis (TE OCA) can be done using so-called backside approach. With this approach Si wafer is thinned to about 100 nm thickness. IC tester is connected to the IC from the front side in a normal manner. Standard IC tests are conducted on the thinned chip. Electro-optical emission from operating FET p/n junctions is usually detected using high-resolution high numerical aperture optics (www.dcg.systems.com). In this example nanoprober tip is brought to the ROI from the back side of the wafer.


The metal probe is acting as an antenna which amplifies electro-magnetic (EM) field in the probe apex proximity (the effect is similar to the tip-enhanced Raman spectroscopy or TERS). As a result, at any moment of time low-resolution optics (placed at the back side of the wafer) collects photons mostly from the probe apex proximity (where EM field is amplified). Once collected signal is synchronized with the probe position, the high-resolution map of electro-optical emission is constructed.


According to another embodiment of this example nanoprober tip is moving parallel to the backside of the wafer with variable speed and at variable distance between the sample surface and the probe. Such adoptive (speed and distance) probe motion will improve throughput, signal-to-noise and lateral resolution of the TE OCA method.


In another example the front side TE optical spectroscopy (Raman or fluorescence) can be used for high resolution and throughput defect analysis. A large laser spot is used to irradiate sample. The probe is scanned over ROI with low (nanometer) scale topography. Low resolution optics is used for collection of scattered (Raman or/and fluorescence) photon. The method spatial resolution is defined by the size of the probe apex and not by the resolution of photon collection optics. Throughput of the method is usually very low since long per pixel time is used to collect sufficient number of scattered photons. If one tries to collect spectral map of the scattered photons the data collection time becomes almost impractical. Adoptive scanning helps to reduce the data acquisition time. Tip is scanned at high speed collecting monochrome signal with relatively poor signal-to-noise. Once suspicious (monochrome) signal is detected at certain locations the probe stops at the spot and tool collects high signal-to-noise spectral data.

Claims
  • 1. An apparatus for performing probing on an integrated circuits (IC), comprising: a stage configured for supporting the IC and configured to enable connecting an IC tester to front side of the IC to conduct tests on the sample;a prober having a probe tip;an actuator activating the prober to position the probe tip at a region of interest (ROI) at a back side of the sample, wherein the probe tip is acting as an antenna which amplifies electro-magnetic (EM) field, thereby amplifying electro-optical emission from operating devices within the sample;collection optics positioned at the backside of the sample and collect photons in proximity to the probe tip;a controller collecting data signals from the collection optics synchronized with the prober position, and generating map of electro-optical emission over the IC.
  • 2. The apparatus of claim 1, wherein the controller is further preprogrammed to read a CAD design data corresponding to the sample, and to further control the actuating signals according to the CAD design data indicating dielectric regions and conductive regions.
  • 3. The apparatus of claim 1, wherein the controller is further preprogrammed to register the prober to an image obtained by a scanning electron microscope outside of an area of interest.
  • 4. The apparatus of claim 1, wherein the actuator is configured to move the probe tip parallel to the backside of the IC with variable speed and at variable distance between the IC backside and the probe tip.
  • 5. A method of performing integrated circuits (IC) probing using a prober having a probe tip, comprising the steps of: applying test signals to the IC from a front surface of the IC to thereby cause electro-optical emission from operating p/n junctions within the IC;placing the probe tip over a back surface of the IC; and,placing collection optics to collect photons of the electro-optical emission from proximity of the probe tip.
  • 6. The method of claim 5, further comprising thinning the IC to 100 nm prior to performing the probing.
  • 7. The method of claim 5, further comprising scanning the probe tip over the back surface of the IC.
  • 8. The method of claim 5, further comprising scanning the probe tip over the back surface of the IC at variable speed and at variable distance between back surface and the probe tip.
  • 9. The method of claim 5, further comprising collecting data signals from the collection optics synchronized with position of the probe tip.
  • 10. The method of claim 9, further comprising generating map of electro-optical emission over the IC.
  • 11. The method of claim 5, further comprising the steps: registering the probe tip to the IC outside of an area of interest (ROI); and,blindly moving the probe tip to the area of interest.
  • 12. The method of claim 11, wherein blindly moving is performed by moving the probe tip without contacting the sample.
  • 13. The method of claim 12, further comprising assessing test data quality prior to accelerating the probe tip.
CROSS-REFERENCE TO RELATED APPLICATIONS

This is a divisional application of U.S. patent application Ser. No. 14/314,013, filed on Jun. 24, 2014, which claims the benefit of priority from U.S. Provisional Patent Application No. 61/838,744 filed on Jun. 24, 2013, and the disclosures of which are hereby incorporated herein by reference in their entireties.

US Referenced Citations (74)
Number Name Date Kind
3258326 Rabussier Jun 1966 A
3752008 Danek Aug 1973 A
4101072 Weaver et al. Jul 1978 A
4142793 Schilling Mar 1979 A
4736401 Donges et al. Apr 1988 A
4798989 Miyazaki et al. Jan 1989 A
4874945 Dhi Oct 1989 A
4902892 Okayama et al. Feb 1990 A
5081353 Yamada et al. Jan 1992 A
5229606 Elings et al. Jul 1993 A
5239313 Marko et al. Aug 1993 A
5253085 Maruo et al. Oct 1993 A
5256876 Hazaki et al. Oct 1993 A
5267471 Abraham et al. Dec 1993 A
5312510 Poultney May 1994 A
5373372 Loewen Dec 1994 A
5455420 Ho et al. Oct 1995 A
5479024 Hillner Dec 1995 A
5510615 Ho et al. Apr 1996 A
5710052 Alvis et al. Jan 1998 A
5713667 Alvis et al. Feb 1998 A
5763879 Zimmer et al. Jun 1998 A
5866806 Samsavar et al. Feb 1999 A
5899703 Kalter et al. May 1999 A
5905577 Wilsher et al. May 1999 A
5907096 Chen May 1999 A
6075234 Patterson Jun 2000 A
6287880 Erickson et al. Sep 2001 B1
RE37404 Harp et al. Oct 2001 E
6399400 Osann, Jr. et al. Jun 2002 B1
6520005 McWaid et al. Feb 2003 B2
6643012 Shen Nov 2003 B2
6880389 Hare et al. Apr 2005 B2
6891170 Yu et al. May 2005 B1
6951130 Hare et al. Oct 2005 B2
6953927 Quake Oct 2005 B2
6955078 Mancevski et al. Oct 2005 B2
6967335 Dyer et al. Nov 2005 B1
7057409 Wills Jun 2006 B2
7178387 Kley Feb 2007 B1
7196454 Baur et al. Mar 2007 B2
7220973 Yu et al. May 2007 B2
7227140 Skidmore et al. Jun 2007 B2
7285778 Baur et al. Oct 2007 B2
7319336 Baur et al. Jan 2008 B2
7446550 McDowell Nov 2008 B2
7493794 Mancevski et al. Feb 2009 B2
7513142 Rice et al. Apr 2009 B2
7562564 Baba et al. Jul 2009 B2
7675300 Baur et al. Mar 2010 B2
7716970 Watanabe et al. May 2010 B2
8484755 Leach et al. Jul 2013 B2
8536526 Bell et al. Sep 2013 B2
9057740 Ukraintsev et al. Jun 2015 B1
20020178800 Hasegawa et al. Dec 2002 A1
20040133300 Tsuboi et al. Jul 2004 A1
20040207424 Hollman Oct 2004 A1
20050184028 Baur et al. Aug 2005 A1
20050193576 Hollman et al. Sep 2005 A1
20060261827 Cooper et al. Nov 2006 A1
20060284083 Kurenuma et al. Dec 2006 A1
20070179731 Suri et al. Aug 2007 A1
20070187623 Skidmore et al. Aug 2007 A1
20080065341 Ishikawa et al. Mar 2008 A1
20080078506 Verbeck et al. Apr 2008 A1
20080078745 Cordell et al. Apr 2008 A1
20080150559 Nayak et al. Jun 2008 A1
20080180118 Itou et al. Jul 2008 A1
20100205697 Iyoki et al. Aug 2010 A1
20110035848 Perkins et al. Feb 2011 A1
20110221461 Kanev et al. Sep 2011 A1
20120090056 Hirooka et al. Apr 2012 A1
20150377921 Ukraintsev et al. Dec 2015 A1
20150377958 Ukraintsev et al. Dec 2015 A1
Foreign Referenced Citations (16)
Number Date Country
102014118657 Jun 2015 DE
112014002974 Jun 2016 DE
2003-156326 May 2003 JP
2005-233700 Sep 2005 JP
2008-089542 Apr 2008 JP
2015-129749 Jul 2015 JP
2016530499 Sep 2016 JP
200831853 Aug 2008 TW
201102658 Jan 2011 TW
201113528 Apr 2011 TW
201532102 Aug 2015 TW
201600861 Jan 2016 TW
201611074 Mar 2016 TW
WO 2014210083 Dec 2014 WO
WO 2015200719 Dec 2015 WO
WO 2015200724 Dec 2015 WO
Non-Patent Literature Citations (40)
Entry
Invitation to Pay Additional Fees in International Application No. PCT/US2014/043975, dated Mar. 6, 2015.
Kane, T., Microelectron. Div., IBM Syst. Technol. Group, Hopewell Junction, NY, USA, “In Fab 300 mm Wafer Level Atomic Force Probe Characterization,” Proc. Of the International Symposium for Testing and Failure Analysis, pp. 71-76 (Nov. 2012).
Kane, T., Microelectron. Div., IBM Syst. Technol. Group, Hopewell Junction, NY, USA “300mm wafer Atomic force probe characterization methodology,” International Symposium on the Components, Circuits, Devices & Systems I, Physical and Failure Analysis of Integrated Circuits, 2010 17th IEEE, Jul. 5-9, 2010, Singapore, IEEE, pp. 1-3.
Kuhn, K. et al., Intel's 45nm CMOS Technology: “Managing Process Variation in Intel's 45nm CMOS Technology,” Intel Technology Journal, vol. 12, Issue 2, Jun. 17, 2008, pp. 92-110.
Ukraintsev, V. et al., “Distributed force probe bending model of critical dimension atomic force microscopy bias,” J. Micro/Nanolith. MEMS MOEMS, vol. 12, Issue 2, Apr.-Jun. 2013, pp. 23009-1 through 23009-15.
Vickers, J.S., Rubix, “A Hybrid Between Ruby, LVi, & LVx the performance of Ruby with the simplicity of LVx,” DCG Systems, Inc., Technology Summit 2013, 18 pages.
International Search Report in International Patent Application No. PCT/US2014/043975, dated May 19, 2015.
Kleindiek Nanotechnik, ProbeWorkstation found online at http://www.nanotechnik.com/probeworkstation.html, website accessed Jun. 22, 2015, 3 pages.
Merlin Series: From Imaging to Your Complete Lab: Analytical Power for the Sub-Nanometer World, Interactive PDF, Release 1.0, ZEISS White Paper, downloaded from http://www.zeiss.com/microscopy/en_us/products/scanning-electron-microscopes/merlin-materials.html#downloads, on Jun. 22, 2015, 20 pages.
Nanonics Imaging Ltd., 3TB4000 Combined AFM FIB and AFM SEM found online at http://www.nanonics.co.il/ products/nsom-spm-systems/combined-afm-fib-and-afm-sem.html?gclid=CJq59Lmrr4CFWVp7AodeiMAYw, website accessed Jun. 22, 2015, 3 pages.
Park XE-3DM, Automated Industrial AFM for High-Resolution 3D Metrology Overview, found online at http://www. parkafm.condindex.php/products/industrial-afm/park-xe-3dm/overview, website accessed Jun. 22, 2015, 3 pages.
Zeiss: Merlin Analytical Power for the sub-nanometer world: Introduction, found online at http://www.zeiss.com/ microscopy/en us/products/scanning-electron-microscopes/merlin-materials.html#introduction, website accessed Jun. 22, 2015, 2 pages.
Zeiss: Merlin Analytical Power for the sub-nanometer world: Downloads, found online at http://www.zeiss.com/ microscopy/en_us/products/scanning-electron-microscopes/merlin-materials.html#downloads, website accessed Jun. 22, 2015, 2 pages.
Advic, A. et al., “Fabrication of cone-shaped boron doped diamond and gold nanoelectrodes for AFM-SECM,” Nanotechnology, Mar. 3, 2011, vol. 22, 145306, pp. 1-6.
Altmann, F. et al., “Evaluation of combined EBIC/FIB methods for solar cell activation,” Fraunhofer Institute for Mechanics of Materials Halle, Drei-Lander FIB Workshop, Jun. 28-29, 2010, Vienna, 23 pages.
Dickson, K. et al., “Electron Beam Absorbed Current as a Means of Locating Metal Defectivity on 45nm SOI Technology,” ISTFA 2010, Proceedings from the 36th International Symposium for Testing and Failure Analysis, Nov. 14-18, 2010, Addison, TX, pp. 413-422.
Eifert, A. et al., “Atomic force microscopy probes with integrated boron doped diamond electrodes: Fabrication and application,” Electrochemistry Communications, vol. 25, 2012, pp. 30-34.
Erington, K. et al., “Advanced Backside Defect Isloation Techniques Using Electron Beam Absombed Current to Locate Metal Defectivity on Bulk and SOI Technology,” ISTFA 2011, Proceedings from the 37th International Symposium for Testing and Failure Analysis, Nov. 13-17, 2011, San Jose, CA, pp. 275-286.
Gatan: An Introduction to EBIC: Whitepaper, Available online at http://info.gatan.com/acton/attachment/11413/ f-02a3/1/-/-/-/-/App%20Note%20Intro%20to%20EBIC%20FL2.pdf, accessed on Jun. 29, 2015, 6 pages.
Gatan: Smart EBIC: Product Datasheet, Available online at http://www.gatan.com/products/sem-imaging—ispectroscopy/smartebic-system, accessed on Jun. 29, 2015, 4 pages.
Ippolito, S. et al., “Active Electrostatic Force Microscopy,” Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 22nd IEEE International Symposium, Taiwan, Jun. 29, 2015, Session 17-1, 3 pages.
Ippolito, S. et al., “Emerging Techniques in Atomic Force Microscopy: Diamond Milling and Electrostatic Force Microscopy,” EDFAAO, Electronic Device Failure Analysis, vol. 17, Issue 3, 2015, pp. 4-10.
Kane, T. et al., “Wafer Level Atomic Force Probing,” Proceedings from the 36th International Symposium for Testing and Failure Analysis, Nov. 14-18, 2010, Addison, Texas, ISTFA 2010, pp. 317-319.
Larre, P. et al., “Precise Localization of 28nm via chain resistive defect using EBAC and nanoprobing,” ISTFA 2012, Proceedings from the 38th International Symposium for Testing and Failure Analysis, Nov. 11-15, 2012, Phoenix, AZ, pp. 67-70.
Lin, W.P. et al., “Physical Failure Analysis Cases by Electron Beam Absorbed Current & Electron Beam Induced Current Detection on Nano-Probing SEM System,” Physical and Failure Analysis of Integrated Circuits (IPFA), 2010 17th IEEE International Symposium, Jul. 5-9, 2010, 4 pages.
Nagatani, G. et al., “Fault Isolation of Sub-surface Leakage Defects Using Electron Beam Induced Current Characterization in Next-Generation Flash Memory Technology Development,” ISTFA 2010, Proceedings from the 36th International Symposium for Testing and Failure Analysis, Nov. 14-18, 2010, Addison, TX, pp. 62-65.
Quah, Act. et al., “Failure Analysis Methodology on Resistive Open Defects,” ISTFA 2014, Proceedings from the 40th International Symposium for Testing and Failure Analysis, Nov. 9-13, 2014, Houston, TX, ASM International, pp. 354-358.
Smirnov, W. et al., “Diamond-Modified AFM Probes: From Diamond Nanowires to Atomic Force Microscopy-Integrated Boron-Doped Diamond Electrodes,” Anal. Chem., vol. 83, pp. 4936-4941 (2011).
Strizich, M., “Electron Beam Induced Current Isolation Techniques,” Available online at http://www.analyticalsol.com/ files/TechnicalArticles/EBIC_article.pdf, accessed Jun. 29, 2015, 3 pages.
Strizich, M., “Voltage Contrast and EBIC Failure Isolation Techniques,” EDFAAO, Electronic Device Failure Analysis, vol. 9, Issue 1, 2007, pp. 20-23.
Yaliang, C. et al., “Absorbed-Specimen Current Imaging Implementation and Characterization in Nano-Prober for Resistive Interconnects Isolation in 45-nm Silicon-on-Insulator Microprocessors,” Physical and Failure Analysis of Integrated Circuits, 2010 17th IEEE International Symposium on Jul. 5-9, 2010, 5 pages.
Ippoloto, S., et al., “Diamond Milling with an Atomic Force Microscope,” Physical and Failure Analysis of Integrated Circuits, 2015 IEEE 22nd International Symposium, on Jun. 29, 2015-Jul. 2, 2015, 5 pages.
Notice of Allowance for U.S. Appl. No. 14/108,286 dated Feb. 11, 2015.
Invitation to Pay Additional Fees for PCT/U52015/037824 dated Sep. 8, 2015.
International Search Report and Written Opinion for International Patent Application No. PCT/U52015/037824 dated Dec. 4, 2015.
Invitation to Pay Additional Fees for PCT/U52015/037829 dated Sep. 8, 2015.
International Search Report and Written Opinion for International Patent Application No. PCT/US2015/037829 dated Dec. 7, 2015.
Examination Report for Taiwanese Patent Application No. 103143626 dated Mar. 22, 2016.
Examination Report for Taiwanese Patent Application No. 104120476 dated Aug. 15, 2016.
Notice of Reasons of Refusal from Japanese Application No. 2016-523868, dated Oct. 17, 2017, 7 pages (with English translation).
Related Publications (1)
Number Date Country
20170082685 A1 Mar 2017 US
Provisional Applications (1)
Number Date Country
61838744 Jun 2013 US
Divisions (1)
Number Date Country
Parent 14314013 Jun 2014 US
Child 15368516 US