Claims
- 1. A manufacturing method for producing a TAB tape containing leads provided with metal bumps for subsequent connection to associated conductors, comprising the steps of:
- providing a belt-shaped tape member having a plurality of sprocket holes formed along opposite side edges, a plurality of first openings for inner lead bonding formed at a transversely substantially central portion so as to be arranged at equal intervals in a longitudinal direction, and a plurality of second openings for outer lead bonding formed around each of said first openings;
- providing a plurality of sheet-like leads having oppositely facing surfaces, one of which defining a contact surface for bonded engagement with a facing surface of an associated conductor,
- fixing each of said leads to said tape with a first end portion of said contact surface exposed to each of said first openings and a second end portion of said contact surface exposed to each of said second openings;
- pressing a pyramidal or conical point onto said contact surface of said each lead to form at least one recess therein at each of said first and second end portions of said each lead;
- seating a piece of bondable metal in said each recess; and
- melting said metal piece seated in said each recess and cooling it to permit it to solidify so that, when solidified upon cooling, said metal piece is bonded to said lead and a part thereof substantially hemispherically projects from said contact surface of said each lead to form a plurality of bumps of bondable metal projecting from the contact surface of said each lead which are effective for subsequently engaging and thereby effecting a bonded connection to an associated conductor.
- 2. The manufacturing method as defined in claim 1, wherein said point has a shape of regular quadrangular pyramid having a base side parallel to a side surface of said each lead.
- 3. The manufacturing method as defined in claim 1, wherein said metal piece is a metal ball formed of metal selected from the group consisting of gold, copper, and alloy thereof.
- 4. A manufacturing method for producing a TAB tape containing leads provided with metal bumps for subsequent connection to associated conductors comprising steps of:
- providing a belt-shaped tape member having a plurality of sprocket holes formed along opposite side edges, a plurality of first openings for inner lead bonding, formed at a transversely substantially central portion so as to be arranged at equal intervals in a longitudinal direction, and a plurality of second openings for outer lead bonding, formed around each of said first openings;
- providing a plurality of sheet-like leads having oppositely facing surfaces, one of which defining a contact surface for bonded engagement with an associated conductor,
- fixing each of said leads to said tape with a first end portion of said contact surface exposed to each of said first openings and a second end portion of said contact surface exposed to each of said second openings;
- pressing a pyramidal or conical point onto said contact surface of said each lead to form at least one recess therein at each of said first and second end portions of said each lead;
- filling a mixture of a bondable metal powder and a paste in said each recess; and
- melting said mixture filled in said each recess and cooling it to permit it to solidify so that, when solidified upon cooling, said mixture is bonded to said lead and a part thereof substantially hemispherically projects from said contact surface of said each lead to form a plurality of bumps of bondable metal projecting from the contact surface of said each lead which are effective for subsequently engaging and thereby effecting a bonded connection to an associated conductor.
- 5. The manufacturing method as defined in claim 4, wherein said point has a shape of regular quadrangular pyramid having a base side parallel to a side surface of said each lead.
- 6. The manufacturing method as defined in claim 4, wherein said mixture is a solder cream formed by mixing a powder of Pb/Sn solder as said metal powder with said paste.
Priority Claims (1)
Number |
Date |
Country |
Kind |
3-263632 |
Oct 1991 |
JPX |
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Parent Case Info
This application is a continuation of application Ser. No. 07/958,637 filed Oct. 9, 1992, now abandoned.
US Referenced Citations (5)
Foreign Referenced Citations (3)
Number |
Date |
Country |
60-4963 |
Mar 1985 |
JPX |
01241196 |
Sep 1989 |
JPX |
1-305541 |
Dec 1989 |
JPX |
Non-Patent Literature Citations (1)
Entry |
Microelectronics Packaging Handbook, New York, Van Nostrand Rewhold, 1989. pp. 374, 409-426, and 828-829. TK7874.T824 1988. |
Continuations (1)
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Number |
Date |
Country |
Parent |
958637 |
Oct 1992 |
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