SEMICONDUCTOR DEVICE

Abstract

A semiconductor device such as a reverse blocking type switching element is provided with a switching element made of a wide band gap semiconductor on the side of a first major plane where a first terminal is formed, while the wide band gap semiconductor is operable at a high voltage and in low loss. In a reverse blocking type switching element having a hetero junction diode for blocking a reverse direction current on the side of a second major plane where a second terminal is formed, a silicon semiconductor region is provided in a side surface of the semiconductor so as to prevent a deterioration of a withstanding voltage of the hetero junction diode.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view for showing a semiconductor device according to an embodiment 1 of the present invention.

FIG. 2 is a sectional view for representing a manufacturing step of the semiconductor device according to the embodiment 1.

FIG. 3 is a sectional view for showing a semiconductor device according to an embodiment 2 of the present invention.

FIG. 4 is a sectional view for representing a manufacturing step of the semiconductor device according to the embodiment 2.

FIG. 5 is a sectional view for indicating a semiconductor device according to an embodiment 3 of the present invention.

FIG. 6 is a sectional view for showing a semiconductor device according to an embodiment 4 of the present invention.

FIG. 7 is a sectional view for indicating a semiconductor device according to an embodiment 5 of the present invention.

FIG. 8 is a sectional view for showing a semiconductor device according to an embodiment 6 of the present invention.

FIG. 9 is a sectional view for indicating a semiconductor device according to an embodiment 7 of the present invention.

FIG. 10 is a sectional view for showing a semiconductor device according to an embodiment 8 of the present invention.

FIG. 11 is a sectional view for indicating a semiconductor device according to an embodiment 9 of the present invention.

FIG. 12 is a circuit diagram of a semiconductor device according to an embodiment 10 of the present invention.

FIG. 13 is a circuit diagram of a semiconductor device according to an embodiment 11 of the present invention.

Claims

1. A semiconductor switching element comprising: a first junction and a second junction; wherein: at least one region within major current paths between a first main terminal and a second main terminal of said semiconductor switching element corresponds to a wide band gap semiconductor;a voltage drop of said second junction in a forward direction is lower than a voltage drop of said first junction in a forward direction;when said semiconductor switching element is turned ON in the forward direction operation, said second junction is brought into a forward bias status; when said semiconductor switching element is in a reverse bias status, said semiconductor switching element is brought into a current blocking status; and a unit is provided, in which a depletion layer of a peripheral edge portion of said second junction is extended to the side of a first major plane where said first junction is formed when said semiconductor switching element is under said current blocking status.

2. The semiconductor switching element as claimed in claim 1 wherein: said second junction is a hetero junction, and one of the semiconductors which constitute said hetero junction is a silicon semiconductor; andat least one semiconductor of said first junction is a wide band gap semiconductor.

3. The semiconductor switching element as claimed in claim 1 wherein: as said unit in which the depletion layer at the peripheral edge portion of said second junction is extended to the side of said first major plane where the first junction is formed, a silicon semiconductor region is formed in the vicinity of the peripheral edge portion of said second junction and further on the side of the first major plane.

4. A semiconductor switching element comprising: a switching element on the side of a first terminal and having a hetero junction diode on the side of a second terminal, which blocks a reverse direction current, wherein:said hetero junction diode is constituted by a first semiconductor region made of a first semiconductor whose band gap is wider, and a second semiconductor region made of a second semiconductor whose band gap is narrower; andsaid semiconductor switching element is comprised of a unit for extending a depletion layer at a peripheral portion of said second semiconductor region made of the second semiconductor along a side plane of said first semiconductor region made of said first semiconductor.

5. A semiconductor switching element comprising: a switching element on the side of a first terminal and having a hetero junction diode on the side of a second terminal, which blocks a reverse direction current, wherein:said hetero junction diode is constituted by a first semiconductor region made of a first semiconductor whose band gap is wider, and a second semiconductor region made of a second semiconductor whose band gap is narrower; andsaid semiconductor switching element is comprised of a unit for extending a depletion layer at a peripheral portion of said second semiconductor region made of the second semiconductor along a direction perpendicular to a first major plane.

6. The semiconductor switching element as claimed in claim 5 wherein: said first terminal is formed on the first major plane side of the semiconductor;said second terminal is formed on the second major plane side of the semiconductor; andas said unit for extending the depletion layer at a peripheral portion of a second region of said second semiconductor along the vertical direction with respect to said first major plane, a third semiconductor region made of the second semiconductor is provided between said first major plane and said second major plane at the peripheral portion of the second region of the second semiconductor.

7. The semiconductor switching element as claimed in claim 6 wherein: said third semiconductor region made of the second semiconductor is formed in a groove which is formed in said first semiconductor region of said first semiconductor along a direction substantially perpendicular to said first major plane.

8. The semiconductor switching element as claimed in claim 5 wherein: said unit for extending the depletion layer extended to the first major plane side from a peripheral portion of a semiconductor chip to an inside direction is provided by the unit for extending the depletion layer at the peripheral portion of said second semiconductor region made of said second semiconductor along the vertical direction with respect to said first major plane.

9. The semiconductor switching element as claimed in claim 5 wherein: as the unit for extending the depletion layer at the peripheral portion of said second semiconductor region made of said second semiconductor along the vertical direction with respect to said first major plane, a fifth semiconductor region made of a first semiconductor having a conductivity type opposite to that of the first semiconductor region made of the first semiconductor is provided on a side plane of the first semiconductor region made of the first semiconductor; anda high withstanding voltage securing region such as a floating field ring, a field plate, and a low concentration extension region is provided on the first major plane, while said high withstanding voltage security region is employed in order to relax concentration of electric fields of the depletion layer extended from the second major plane.

10. The semiconductor switching element as claimed in claim 8 wherein: as the unit for extending the depletion layer from the peripheral portion of said semiconductor chip to the inner side direction, a high withstanding voltage securing region such as a floating field ring, a field plate, and a low concentration extension region is provided on the first major plane.

11. The semiconductor switching element as claimed in claim 5 wherein: said second semiconductor region made of said second semiconductor is formed in a groove formed in said second major plane; anda fourth semiconductor region made of the first semiconductor having a polarity opposite to the polarity of said first semiconductor region made of the first semiconductor is formed on the second major plane side where said second semiconductor region made of the second semiconductor is not formed.

12. A semiconductor switching element comprising: a switching element on the side of a first terminal and having a hetero junction diode on the side of a second terminal, which blocks a reverse direction current, wherein:said hetero junction diode is constituted by a first semiconductor region made of a first semiconductor whose band gap is wider, and a second semiconductor region made of a second semiconductor whose band gap is narrower; andsaid second semiconductor region made of the second semiconductor is provided along a vertical direction with respect to a first major plane.

13. The semiconductor switching element as claimed in claim 12 wherein: said second semiconductor region made of the second semiconductor is formed in a groove which is formed in said first semiconductor region of said first semiconductor along a direction substantially perpendicular to said first major plane.

14. A semiconductor switching element having a switching element on the side of a first terminal and having a hetero junction diode on the side of a second terminal, which blocks a reverse direction current, wherein: said first terminal is provided on a first major plane, and said second terminal is provided on a second major plane;said hetero junction diode is constituted by a first semiconductor region made of a first semiconductor whose band gap is wider, and a second semiconductor region made of a second semiconductor whose band gap is narrower; andsaid hetero junction diode is located adjacent to said first semiconductor region made of the first semiconductor, and is contacted to a switching element on the side of said first terminal via a low resistance region whose resistivity is lower than, or equal to resistivity of said first semiconductor region made of the first semiconductor by 1 digit.

15. A current-fed power converting apparatus comprising: the semiconductor switching element recited in claim 1.

16. A bi-directional switch circuit comprising: the semiconductor switching element recited in claim 1.