Stacked semiconductor device and device stacking method

Abstract

To prevent wires from contacting an upper device when that upper device is stacked on a device that is bonded to electrodes of a board by wire bonding, a stacked semiconductor device includes a first device bonded to a package board, wires connecting electrodes of the first device to electrodes of the package board, and a second device stacked on the first device through an adhesive member. The adhesive member has a double-layered structure composed of a first die attach film and a second die attach film softer than the first die attach film. The first die attach film prevents the wires from penetrating.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

FIG. 1 is a front view showing an example of a package board;

FIG. 2 is a schematic sectional view showing a state in which a first device is bonded to a package board;

FIG. 3 is a schematic sectional view showing a state in which the electrodes of a first device are bonded to the electrodes of the package board;

FIG. 4 is a schematic sectional view showing a stacked semiconductor device of the present invention; and

FIG. 5 is a schematic sectional view showing a conventional stacked semiconductor device.

Claims

1. A stacked semiconductor device comprising: a package board;a first device bonded to a top surface of said package board;a wire connecting an electrode of said package board and an electrode of said first device to each other;a second device stacked on top of said first device; andan adhesive member attaching said first device and said second device to each other,wherein said adhesive member comprising:a first die attach film affixed to a bottom surface of said second device and preventing embedding of said wire; anda second die attach film affixed to a top surface of said first device and permitting embedding of said wire.

2. A device stacking method comprising the steps of bonding a first device to a package board;connecting electrodes of said first device and electrodes of said package board to each other by wire bonding; and thenstacking a second device on top of said first device,wherein a first die attach film affixed to a bottom surface of said second device preventing embedding of a wire and a second die attach film affixed to a top surface of said first device and permitting embedding of said wire are inserted between said first device and said second device and said second device is stacked on said first device through said first die attach film and said second die attach film.

3. The device stacking method according to claim 2, wherein said first die attach film and said second die attach film are affixed and stacked before said first die attach film is affixed to the bottom surface of said second device.

4. The device stacking method according to claim 2, wherein said first die attach film is affixed to a rear surface of said second device, heated, and hardened to prevent penetration by the wire, after which said second die attach film is affixed to said hardened first die attach film.

5. The device stacking method according to claim 4, wherein said first die attach film and said second die attach film are formed of identical material.