IBM Tech Disclosure Bull vol. 9 No. 10, Mar. 1967 p. 1369 by Feulner. |
IBM Technical Disclosure Bulletin (Gobran), vol. 27, No. 5, p. 3041 (Oct. 1984), entitled "Tailless Thermo-Compression Bonding". |
IBM Technical Disclosure Bulletin (Anderson, et al.), vol. 26, No. 12, pp. 6244-6245 (May 1984), entitled "Josephson Package Repair". |
IBM Technical Disclosure Bulletin (Bakos, et al.), vol. 22, No. 9, pp. 3986-3987 (Feb. 1980), entitled "Circuit Repair/Work of Metallized Polyimide Substrates". |
IBM Technical Disclosure Bulletin (Mackey, et al.), vol. 15, No. 8, p. 2423 (Jan. 1973), entitled "Conductive Line Jumper/Repair Connection in Glass Metal Module". |
IBM Technical Disclosure Bulletin (Tappen), vol. 14, No. 10, p. 2915 (Mar. 1972), entitled "Open Conductor Repair for Glass Metal Module". |
IBM Technical Disclosure Bulletin (Mutnick), vol. 8, No. 11, p. 1469 (Apr. 1966), entitled "Repairing Breaks in Printed Circuits". |