This Patent Application is a Divisional Patent Application of U.S. patent application Ser. No. 08/094,633, filed Jul. 21, 1993, entitled "METHOD FOR REPAIRING ELECTRICAL LINES", which has now issued as U.S. Pat. No. 5,384,953.
Number | Name | Date | Kind |
---|---|---|---|
4258078 | Coller et al. | Mar 1981 | |
4259367 | Dougherty, Jr. | Mar 1981 | |
4403410 | Robinson | Sep 1983 | |
4418264 | Thorwarth | Nov 1983 | |
4572941 | Sciaky et al. | Mar 1986 | |
4615765 | Levinson et al. | Oct 1986 | |
4630355 | Johnson | Dec 1986 | |
4704304 | Amendola et al. | Nov 1987 | |
4714684 | Sugahara et al. | Dec 1987 | |
4756927 | Black et al. | Jul 1988 | |
4877481 | Fukuda et al. | Oct 1989 | |
4880959 | Baum et al. | Nov 1989 | |
4882200 | Liu et al. | Nov 1989 | |
4906491 | Yamazaki | Mar 1990 | |
4908938 | Thorwarth et al. | Mar 1990 | |
4919971 | Chen | Apr 1990 | |
5064681 | Berry et al. | Nov 1991 | |
5091218 | Altman et al. | Feb 1992 | |
5130172 | Hicks et al. | Jul 1992 | |
5145714 | Reisman et al. | Sep 1992 | |
5153408 | Handford et al. | Oct 1992 | |
5182230 | Donelon et al. | Jan 1993 | |
5193732 | Interrante et al. | Mar 1993 | |
5213983 | Gustafsson et al. | May 1993 | |
5229845 | Ueba et al. | Jul 1993 |
Number | Date | Country |
---|---|---|
4038114 | Jun 1991 | DEX |
Entry |
---|
IBM Technical Disclosure Bulletin (Gobran), vol. 27, No. 5, p. 3041 (Oct. 1984), entitled "Tailless Thermo-Compression Bonding". |
IBM Technical Disclosure Bulletin (Anderson, et al.), vol. 26, No. 12, pp. 6244-6245 (May 1984), entitled "Josephson Package Repair". |
IBM Technical Disclosure Bulletin (Bakos, et al.), vol. 22, No. 9, pp. 3986-3987 (Feb. 1980), entitled "Circuit Repair/Work of Metallized Polyimide Substrates". |
IBM Technical Disclosure Bulletin (Mackey, et al.), vol. 15, No. 8, p. 2423 (Jan. 1973), entitled "Conductive Line Jumper/Repair Connection in Glass Metal Module". |
IBM Technical Disclosure Bulletin (Tappen), vol. 14, No. 10, p. 2915 (Mar. 1972), entitled "Open Conductor Repair for Glass Metal Module". |
IBM Technical Disclosure Bulletin (Mutnick), vol. 8, No. 11, p. 1469 (Apr. 1966), entitled "Repairing Breaks in Printed Circuits". |
IBM Technical Disclosure Bulletin (Foulner), vol 9, No. 10, p. 1309 (Mar. 1967). |
Number | Date | Country | |
---|---|---|---|
Parent | 94633 | Jul 1993 |