This application is a continuation of application Ser. No. 07/871,456, filed Apr. 21, 1992, now abandoned.
Number | Name | Date | Kind |
---|---|---|---|
4254447 | Griffis | Mar 1981 | |
4706166 | Go | Nov 1987 | |
4727410 | Higgins, III | Feb 1988 | |
4731701 | Kuo | Mar 1988 | |
4764846 | Go | Aug 1988 | |
4868712 | Woodman | Sep 1989 | |
4983533 | Go | Jan 1991 | |
5016138 | Woodman | May 1991 | |
5019943 | Fassbender | May 1991 | |
5081063 | Vonno et al. | Jan 1992 | |
5104820 | Go | Apr 1992 | |
5159530 | Komoto | Oct 1992 |
Number | Date | Country |
---|---|---|
0206696 | Dec 1986 | EPX |
0354708 | Feb 1990 | EPX |
0479205A2 | Apr 1992 | EPX |
2354260 | Jun 1974 | DEX |
Entry |
---|
Tepper, "Packaging or a Large Memory System", IBM Technical Disclosure Bulletin, vol. 17, No. 4, Sep. 1974, pp. 987-988. |
Chrysler, G. M. et al., "Direct Liquid Cooling of Computer Chips Using a Densley Packed Pin Fin Array and Controlled Radial Flow of a Dielectric Coolant," Research Disclosure, Dec. 1990, No. 320. Kenneth Mason Publications, Ltd., England. |
Tuckerman, David B., "Heat-Transfer Microstructures for Integrated Circuits," Ph.D. Thesis, Feb. 1984, UCRL-53515. Lawrence Livermore National Laboratory. |
Number | Date | Country | |
---|---|---|---|
Parent | 871456 | Apr 1992 |