BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a circuit diagram of the inverter structure of the invention.
FIG. 2 is a top plan view of the assembled leadframes of the invention.
FIG. 3 is a perspective view of the assembly of FIG. 2.
FIG. 3A is a detail view of the circled area in FIG. 3.
FIG. 4 shows the path of the cooling channel in a heat sink beneath the leadframes of FIG. 1.
FIG. 5 is a plan view of the leadframes of FIG. 1 without the die or wire bonds in place to show the substantial coplanarity of the leadframes.
FIG. 6 is an exploded perspective view of the leadframes and insulation printed circuit board (PCB) of FIGS. 1 and 5.
FIG. 7 is a detailed top view of a die mounted on a leadframe in FIG. 1.
FIG. 8 is a cross-section of FIG. 7 taken across section line 8-8 in FIG. 7.
FIG. 8A is a detail showing the bending of a leadframe extension in FIG. 8 to form a power terminal which extends perpendicularly from the plane of the leadframe.
FIG. 9 is a partly cut-away view of the leadframe assembly of FIGS. 2 to 8 assembled on a heat sink.
FIG. 9A is a detail of the capacitor connection terminals in FIG. 9.
FIG. 10 is an exploded perspective view of the housing and leadframe assembly.
FIG. 11 shows the assembly of FIG. 10 without the top cover.
FIG. 12 is a cross-section detail of the seal between the cover and heatsink of FIG. 10.
FIG. 13 and 14 show two respective isometric views of the assembly of FIG. 10.
FIG. 15 is a cross-sectional detail of the connector bolt of FIGS. 10, 13 and 14.