WIRE BONDER

Abstract

A wire bonder suitable for wire bonding a chip disposed on a carrier and bonding pads of the carrier is provided. The wire bonder includes a stage, a heater plate, a compression plate, a pair of clamping bases, a pair of extended blocks and a capillary. The heater plate is disposed on the stage. The compression plate arranged above the heater plate is able to move upward or downward for compressing the carrier. The clamping bases are arranged at two opposite sides of the compression plate, wherein the length of the compression plate does not match with the distance between the clamping bases. A pair of extended blocks is connected to a pair of clamping bases at one end, respectively, and connected to the compression plate at the other. The capillary is arranged above the compression plate for forming the bonding wires electrically connecting the chip and the carrier.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

FIG. 1 is a schematic side view showing a conventional wire bonder.

FIG. 2 is a schematic side view showing a wire bonder according to a first embodiment of the present invention.

FIG. 3 is a schematic side view showing a wire bonder according to a second embodiment of the present invention.

FIG. 4 is a schematic side view showing a wire bonder according to a third embodiment of the present invention.

FIG. 5 is a schematic side view showing a wire bonder according to a fourth embodiment of the present invention.

DESCRIPTION OF THE EMBODIMENTS

Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.

FIG. 2 is a schematic side view showing a wire bonder according to a first embodiment of the present invention. Please refer to FIG. 2, the wire bonder 300 of the present invention is suitable for wire bonding a plurality of bonding pads 402 of a carrier 400 and a chip 410 disposed thereon, such that the carrier 400 may be electrically connected to the chip 410 through a plurality of bonding wires 420.

The wire bonder 300 comprises a stage 310, a heater plate 320, a compression plate 330, a pair of clamping bases 340, a pair of extended blocks 350 and a capillary 360. The heater plate 320 is disposed on the stage 310. When a wire bonding process is performed, the heater plate 320 is used to heat the carrier 400 and the gold wire within the capillary 360. The compression plate 330 is able to move upward or downward relative to the heater plate 320 for compressing the carrier disposed on the heater plate. When the wire bonding process is performed, the compression plate 330 is raised and the heater plate 320 is lowered in order to clamp and fix the carrier 400, such that the carrier 400 would not be shacked during the wire bonding process. Besides, the compression plate 330 has an opening 332 such that a portion of the carrier and the chip 410 disposed on the carrier 400 are exposed from the opening 332 to perform the wire bonding process.

A pair of clamping bases 340 is disposed at the right side and the left side of the compression plate 330, respectively, and a length of the compression plate 330 does not match with a distance between the clamping bases 340. It means that a distance d exists between one of the clamping bases 340 and the periphery of the compression plate 330. A pair of extended blocks 350 is connected to a pair of clamping bases 340 at one end, respectively, and connected to the compression plate 330 at the other. The length of the extended block 350 is corresponding to the above-mentioned distance d. In this embodiment, each of the extended blocks 350 has a Z-shaped cross-section. One end of each extended block 350 near the compression plate 330 has a through hole 352 for a screw 370 to pass through, such that the extended block 350 is screwed to the compression plate 330 by the screw 370 and the other end of each of the extended block 350 is fixed on the clamping base 340 by a mortise-and-tenon joint. Therefore, the problem of a horizontal or vertical displacement of the adapter fixed on the clamping base by using three screws may be resolved. However, both ends of each of the extended blocks 350 may be fixed on the compression plate 330 and the clamping base 340, respectively, through other mechanisms, and it is not limited in the present invention.

The capillary 360 is disposed above the compression plate 330. When the wire bonding process is performed, a plurality of bonding wires 420 are formed by the capillary 360 for electrically connecting the chip 410 and the bonding pads 402 of the carrier 400.

The extended block 350 is fixed in the clamping base 340 through the mortise-and-tenon joint, and the extended block 350 would not have a horizontal or vertical displacement. Accordingly, the vertical compression force exerted on the compression plate 330 may be more uniform, and the yield rate of the wire bonding process may be improved. Moreover, the compression plate 330 cooperating with the extended block 350 of different lengths may be applied to different types of wire bonders.

FIG. 3 is a schematic side view showing a wire bonder according to a second embodiment of the present invention. Please refer to FIG. 3, the structure of the wire bonder 300′ is similar to that of the wire bonder 300 as shown in FIG. 2, and the difference between them is that both ends of each of the extended blocks 350′ have a first through hole 352a and a second through hole 352b for a first screw 370a and a second screw 370b to pass through, respectively, such that one end of each of the extended blocks 350′ is screwed to the compression plate 330 by the first screw 370a, and the other end of each of the extended blocks 350′ is screwed to the clamping base 340 by the second screw 370b.

FIG. 4 is a schematic side view showing a wire bonder according to a third embodiment of the present invention. Referring to FIG. 4, the structure of the wire bonder 300″ is similar to that of the wire bonder 300 as shown in FIG. 2, and the difference between them is that the extended block 350″ has a Y-shaped cross-section, and it comprises a clamping portion 354 and a fixing portion 356 connected to the clamping portion 354. The clamping portion 354 has a groove 354a for clamping and fixing one side of the compression plate 330, and the fixing portion 356 is fixed in the clamping base 340. In this embodiment, the clamping portion 354 of the extended block 350″ has a through hole 352 for a screw 370 to pass through, such that the extended block 350″ is screwed onto the compression plate 330 by the screw 370, and the fixing portion 356 of the extended block 350″ is fixed in the clamping base 340 by using a mortise-and-tenon joint. Since the compression plate 330 is firmly clamped in the extended block 350″ having a Y-shaped cross-section, the carrier 400 would not shift during the wire bonding process. Accordingly, the yield rate of the wire bonding process may be enhanced.

FIG. 5 is a schematic side view showing a wire bonder according to a fourth embodiment of the present invention. Referring to FIG. 5, the structure of the wire bonder 300′″ is similar to that of the wire bonder 300″ as shown in FIG. 4, and the difference between them is that the clamping portion 354 and the fixing portion 356 have a first through hole 352a and a second through hole 352b for a first screw 370a and a second screw 370b to pass through, respectively, such that one end of the extended block 350′″ is screwed to the compression plate 330 by the first screw 370a and the other end of the extended block 350′″ is screwed to the clamping base 340 by the second screw 370b.

In summary, in the wire bonder of the present invention, a pair of extended blocks is used to be connected to a pair of clamping bases at one end, respectively, and be connected to the compression plate at the other. Therefore, the compression plate of the same size cooperating with the extended blocks of different sizes may be applied to different types of wire bonders. Accordingly, when the wire bonders are upgraded, the compression plate cooperating with different sizes of the extended blocks may be reused, to avoid the waste of money.

Further, since the extended block is connected between the clamping base and the compression plate by using a mortise-and tenon joint or a single screw, the extended block may not have a horizontal or vertical displacement compared with the prior art. Then, the vertical compression force exerted on the compression plate is more uniform, and thus the yield rate of the wire bonding process may be enhanced.

Moreover, one end of the extended block is fixed in the clamping base by a mortise-and-tenon joint, and the other end of the extended block is fixed on the compression plate by a single screw or a mortise-and-tenon joint. Compared with the prior art, the wire bonder of the present invention requires fewer components for assembling the compression plate and the clamping bases together, and the assembly time is reduced.

It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.

Claims

1. A wire bonder, suitable for wire bonding a chip disposed on a carrier to a plurality of bonding pads of the carrier, the wire bonder comprising: a stage;a heater plate, disposed on the stage;a compression plate, being able to move upward or downward relative to the heater plate for compressing the carrier disposed on the heater plate, wherein the compression plate has an opening for exposing the chip disposed on the carrier and the bonding pads of the carrier;a pair of clamping bases, disposed at two opposite sides of the compression plate, wherein a length of the compression plate does not match with a distance between the clamping bases;a pair of extended blocks, wherein each of the extended blocks is connected between one of the clamping bases and the compression plate; anda capillary, disposed above the compression plate for forming a plurality of bonding wires electrically connecting the chip and the bonding pads of the carrier.

2. The wire bonder according to claim 1, wherein each of the extended blocks has a Z-shaped cross-section.

3. The wire bonder according to claim 2, wherein one end of each extended block has a through hole for a screw to pass through, such that the extended block is screwed to the compression plate by the screw and the other end of each extended block is fixed on the clamping base by a mortise-and-tenon joint.

4. The wire bonder according to claim 2, wherein both ends of each extended block have a first through hole and a second through hole for a first screw and a second screw to pass through, respectively, such that the extended block is screwed to the compression plate by the first screw, and the extended block is screwed to the clamping base by the second screw.

5. The wire bonder according to claim 1, wherein each of the extended blocks has a Y-shaped cross-section.

6. The wire bonder according to claim 5, wherein each of the extended blocks has a clamping portion and a fixing portion connected to the clamping portion, the clamping portion has a groove for clamping and fixing one side of the compression plate, and the fixing portion is fixed on the clamping base.

7. The wire bonder according to claim 6, wherein the clamping portion of the extended block has a through hole for a screw to pass through, such that the extended block is screwed to the compression plate by the screw and the fixing portion of the extended block is fixed on the clamping base by a mortise-and-tenon joint.

8. The wire bonder according to claim 6, wherein the clamping portion and the fixing portion of the extended block have a first through hole and a second through hole for a first screw and a second screw to pass through, respectively, such that the extended block is screwed to the compression plate by the first screw, and the extended block is screwed to the clamping base by the second screw.