Brett DUNLAP

Person

Queen Creek, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fingerprint sensor and button combinations and methods of making same
- Patent number 11,829,565
- Issue date Nov 28, 2023
- Synaptics Incorporated
- Brett Dunlap
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaging for fingerprint sensors and methods of manufacture
- Patent number 11,545,405
- Issue date Jan 3, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Patrick Huemoeller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fingerprint sensor and button combinations and methods of making same
- Patent number 11,119,615
- Issue date Sep 14, 2021
- Synaptics Incorporated
- Brett Dunlap
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaging for fingerprint sensors and methods of manufacture
- Patent number 10,636,717
- Issue date Apr 28, 2020
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaging for fingerprint sensors and methods of manufacture
- Patent number RE47890
- Issue date Mar 3, 2020
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
Information Patent Grant
Method of forming a plurality of electronic component packages
- Patent number 10,546,833
- Issue date Jan 28, 2020
- Amkor Technology, Inc.
- Brett Arnold Dunlap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge-effect mitigation for capacitive sensors
- Patent number 10,338,754
- Issue date Jul 2, 2019
- Synaptics Incorporated
- Guozhong Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fingerprint sensor and button combinations and methods of making same
- Patent number 10,325,132
- Issue date Jun 18, 2019
- Synaptics Incorporated
- Brett Dunlap
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package for sensor applications
- Patent number 10,055,631
- Issue date Aug 21, 2018
- Synaptics Incorporated
- Shengmin Wen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaging for fingerprint sensors and methods of manufacture
- Patent number 9,754,852
- Issue date Sep 5, 2017
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of forming a plurality of electronic component packages
- Patent number 9,691,734
- Issue date Jun 27, 2017
- Amkor Technology, Inc.
- Brett Arnold Dunlap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and button combinations and methods of making same
- Patent number 9,651,513
- Issue date May 16, 2017
- Synaptics Incorporated
- Brett Dunlap
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked and staggered die MEMS package and method
- Patent number 9,013,011
- Issue date Apr 21, 2015
- Amkor Technology, Inc.
- Bob Shih-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package fabrication method and structure
- Patent number 8,941,250
- Issue date Jan 27, 2015
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin stackable package and method
- Patent number 8,937,381
- Issue date Jan 20, 2015
- Amkor Technology, Inc.
- Brett Arnold Dunlap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device structure and method
- Patent number 8,791,501
- Issue date Jul 29, 2014
- Amkor Technology, Inc.
- Ruben Fuentes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical tape separation package
- Patent number 8,753,730
- Issue date Jun 17, 2014
- Amkor Technology, Inc.
- Brett Arnold Dunlap
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic component package fabrication method and structure
- Patent number 8,653,674
- Issue date Feb 18, 2014
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode (LED) package and method
- Patent number 8,535,961
- Issue date Sep 17, 2013
- Amkor Technology, Inc.
- Bob Shih-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded embedded electronic component substrate fabrication method...
- Patent number 8,432,022
- Issue date Apr 30, 2013
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical tape separation package and method
- Patent number 8,337,657
- Issue date Dec 25, 2012
- Amkor Technology, Inc.
- Brett Arnold Dunlap
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME
- Publication number 20240061537
- Publication date Feb 22, 2024
- SYNAPTICS INCORPORATED
- Brett Dunlap
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME
- Publication number 20210373709
- Publication date Dec 2, 2021
- SYNAPTICS INCORPORATED
- Brett Dunlap
- G01 - MEASURING TESTING
Information Patent Application
PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE
- Publication number 20200365480
- Publication date Nov 19, 2020
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF FORMING A PLURALITY OF ELECTRONIC COMPONENT PACKAGES AND...
- Publication number 20200335476
- Publication date Oct 22, 2020
- Amkor Technology, Inc.
- Brett Arnold Dunlap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME
- Publication number 20190258840
- Publication date Aug 22, 2019
- SYNAPTICS INCORPORATED
- Brett Dunlap
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE
- Publication number 20180090409
- Publication date Mar 29, 2018
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF FORMING A PLURALITY OF ELECTRONIC COMPONENT PACKAGES
- Publication number 20170294405
- Publication date Oct 12, 2017
- Amkor Technology, Inc.
- Brett Arnold Dunlap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME
- Publication number 20170220837
- Publication date Aug 3, 2017
- SYNAPTICS INCORPORATED
- Brett Dunlap
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EDGE-EFFECT MITIGATION FOR CAPACITIVE SENSORS
- Publication number 20170177113
- Publication date Jun 22, 2017
- SYNAPTICS INCORPORATED
- Guozhong Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Biometric Image Sensor Packaging and Mounting
- Publication number 20150187707
- Publication date Jul 2, 2015
- SYNAPTICS INCORPORATED
- Young Seen LEE
- G01 - MEASURING TESTING
Information Patent Application
Method And System For Semiconductor Packaging
- Publication number 20140162407
- Publication date Jun 12, 2014
- Curtis Michael Zwenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME
- Publication number 20140103943
- Publication date Apr 17, 2014
- SYNAPTICS INCORPORATED
- Brett DUNLAP
- G01 - MEASURING TESTING

Brett DUNLAP

Person

Patents Grantslast 30 patents

Fingerprint sensor and button combinations and methods of making same

Packaging for fingerprint sensors and methods of manufacture

Fingerprint sensor and button combinations and methods of making same

Packaging for fingerprint sensors and methods of manufacture

Packaging for fingerprint sensors and methods of manufacture

Method of forming a plurality of electronic component packages

Edge-effect mitigation for capacitive sensors

Fingerprint sensor and button combinations and methods of making same

Semiconductor package for sensor applications

Packaging for fingerprint sensors and methods of manufacture

Method of forming a plurality of electronic component packages

Fingerprint sensor and button combinations and methods of making same

Stacked and staggered die MEMS package and method

Electronic component package fabrication method and structure

Thin stackable package and method

Integrated passive device structure and method

Mechanical tape separation package

Electronic component package fabrication method and structure

Light emitting diode (LED) package and method

Shielded embedded electronic component substrate fabrication method...

Mechanical tape separation package and method

Patents Applicationslast 30 patents

FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME

FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME

PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE

METHOD OF FORMING A PLURALITY OF ELECTRONIC COMPONENT PACKAGES AND...

FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME

PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE

METHOD OF FORMING A PLURALITY OF ELECTRONIC COMPONENT PACKAGES

FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME

EDGE-EFFECT MITIGATION FOR CAPACITIVE SENSORS

Biometric Image Sensor Packaging and Mounting

Method And System For Semiconductor Packaging

FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME