Carmen D. Burns

Person

Austin, Travis County, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Flexible circuit connector for stacked chip module
- Patent number 7,066,741
- Issue date Jun 27, 2006
- Staktek Group L.P.
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density integrated circuit module
- Patent number 6,919,626
- Issue date Jul 19, 2005
- Staktek Group L.P.
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking system and method
- Patent number 6,608,763
- Issue date Aug 19, 2003
- Staktek Group L.P.
- Carmen D. Burns
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit connector for stacked chip module
- Patent number 6,572,387
- Issue date Jun 3, 2003
- Staktek Group, L.P.
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked micro ball grid array packages
- Patent number 6,310,392
- Issue date Oct 30, 2001
- Staktek Group, L.P.
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density integrated circuit module with complex electrical inte...
- Patent number 6,288,907
- Issue date Sep 11, 2001
- Staktek Group, L.P.
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a surface mount package
- Patent number 6,205,654
- Issue date Mar 27, 2001
- Staktek Group L.P.
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warp-resistent ultra-thin integrated circuit package fabrication me...
- Patent number 6,194,247
- Issue date Feb 27, 2001
- Staktek Group L.P.
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a warp resistant thermally conductive circu...
- Patent number 6,190,939
- Issue date Feb 20, 2001
- Staktek Group L.P.
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra high density integrated circuit packages
- Patent number 6,168,970
- Issue date Jan 2, 2001
- Staktek Group L.P.
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra high density integrated circuit packages
- Patent number 6,049,123
- Issue date Apr 11, 2000
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra high density integrated circuit packages
- Patent number 6,025,642
- Issue date Feb 15, 2000
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages having an externally mounted lead frame...
- Patent number 5,978,227
- Issue date Nov 2, 1999
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making high density integrated circuit module
- Patent number 5,960,539
- Issue date Oct 5, 1999
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method of manufacturing a warp resistant thermally co...
- Patent number 5,945,732
- Issue date Aug 31, 1999
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional warp-resistant integrated circuit module method a...
- Patent number 5,895,232
- Issue date Apr 20, 1999
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-resistant ultra-thin integrated circuit package fabrication me...
- Patent number 5,864,175
- Issue date Jan 26, 1999
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an ultra-high density warp-resistant memory...
- Patent number 5,843,807
- Issue date Dec 1, 1998
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-high density warp-resistant memory module
- Patent number 5,828,125
- Issue date Oct 27, 1998
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed integrated circuit lead-on package configuration
- Patent number 5,804,870
- Issue date Sep 8, 1998
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional warp-resistant integrated circuit module method a...
- Patent number 5,801,437
- Issue date Sep 1, 1998
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a hermetically sealed circuit lead-on package
- Patent number 5,783,464
- Issue date Jul 21, 1998
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a high density integrated circuit module wi...
- Patent number 5,778,522
- Issue date Jul 14, 1998
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed ceramic integrated circuit heat dissipating pac...
- Patent number 5,702,985
- Issue date Dec 30, 1997
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-on-chip integrated circuit apparatus
- Patent number 5,654,877
- Issue date Aug 5, 1997
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-high density warp-resistant memory module
- Patent number 5,644,161
- Issue date Jul 1, 1997
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density lead-on-package fabrication method
- Patent number 5,631,193
- Issue date May 20, 1997
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated package having a pair of die...
- Patent number 5,615,475
- Issue date Apr 1, 1997
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a bus communication system for stacked high...
- Patent number 5,605,592
- Issue date Feb 25, 1997
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with overlapped die on a common lead frame
- Patent number 5,585,668
- Issue date Dec 17, 1996
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
High density integrated circuit module
- Publication number 20050139980
- Publication date Jun 30, 2005
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible circuit connector for stacked chip module
- Publication number 20030203663
- Publication date Oct 30, 2003
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible circuit connector for stacked chip module
- Publication number 20020102870
- Publication date Aug 1, 2002
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a surface mount package
- Publication number 20010005042
- Publication date Jun 28, 2001
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS

Carmen D. Burns

Person

Patents Grantslast 30 patents

Flexible circuit connector for stacked chip module

High density integrated circuit module

Stacking system and method

Flexible circuit connector for stacked chip module

Stacked micro ball grid array packages

High density integrated circuit module with complex electrical inte...

Method of manufacturing a surface mount package

Warp-resistent ultra-thin integrated circuit package fabrication me...

Method of manufacturing a warp resistant thermally conductive circu...

Ultra high density integrated circuit packages

Ultra high density integrated circuit packages

Ultra high density integrated circuit packages

Integrated circuit packages having an externally mounted lead frame...

Method of making high density integrated circuit module

Apparatus and method of manufacturing a warp resistant thermally co...

Three-dimensional warp-resistant integrated circuit module method a...

Wrap-resistant ultra-thin integrated circuit package fabrication me...

Method of manufacturing an ultra-high density warp-resistant memory...

Ultra-high density warp-resistant memory module

Hermetically sealed integrated circuit lead-on package configuration

Three-dimensional warp-resistant integrated circuit module method a...

Method of forming a hermetically sealed circuit lead-on package

Method of manufacturing a high density integrated circuit module wi...

Hermetically sealed ceramic integrated circuit heat dissipating pac...

Lead-on-chip integrated circuit apparatus

Ultra-high density warp-resistant memory module

High density lead-on-package fabrication method

Method of manufacturing an integrated package having a pair of die...

Method of manufacturing a bus communication system for stacked high...

Integrated circuit package with overlapped die on a common lead frame

Patents Applicationslast 30 patents

High density integrated circuit module

Flexible circuit connector for stacked chip module

Flexible circuit connector for stacked chip module

Method of manufacturing a surface mount package