Cenk Acar

Person

Irvine, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Micromachined multi-axis gyroscopes with reduced stress sensitivity
- Patent number 11,898,845
- Issue date Feb 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Cenk Acar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromachined multi-axis gyroscopes with reduced stress sensitivity
- Patent number 11,085,766
- Issue date Aug 10, 2021
- Semiconductor Components Industries, LLC
- Cenk Acar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Accelerometer techniques to compensate package stress
- Patent number 10,697,994
- Issue date Jun 30, 2020
- Semiconductor Components Industries, LLC
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Grant
Multi-axis accelerometer with reduced stress sensitivity
- Patent number 10,393,770
- Issue date Aug 27, 2019
- Semiconductor Components Industries, LLC
- Cenk Acar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromachined monolithic 3-axis gyroscope with single drive
- Patent number 10,050,155
- Issue date Aug 14, 2018
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Cenk Acar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sealed packaging for microelectromechanical systems
- Patent number 9,856,132
- Issue date Jan 2, 2018
- Fairchild Semiconductor Corporation
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromachined piezoelectric x-axis gyroscope
- Patent number 9,605,965
- Issue date Mar 28, 2017
- Snaptrack, Inc.
- Cenk Acar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS proof mass with split Z-axis portions
- Patent number 9,599,472
- Issue date Mar 21, 2017
- Fairchild Semiconductor Corporation
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Grant
Multi-die MEMS package
- Patent number 9,586,813
- Issue date Mar 7, 2017
- Fairchild Semiconductor Corporation
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromachined piezoelectric x-axis gyroscope
- Patent number 9,459,099
- Issue date Oct 4, 2016
- QUALCOMM MEMS Technologies, Inc.
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Grant
Micromachined 3-axis accelerometer with a single proof-mass
- Patent number 9,455,354
- Issue date Sep 27, 2016
- Fairchild Semiconductor Corporation
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Grant
Micromachined piezoelectric z-axis gyroscope
- Patent number 9,410,805
- Issue date Aug 9, 2016
- QUALCOMM MEMS Technologies, Inc.
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Grant
Flexure bearing to reduce quadrature for resonating micromachined d...
- Patent number 9,352,961
- Issue date May 31, 2016
- Fairchild Semiconductor Corporation
- Cenk Acar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromachined monolithic 6-axis inertial sensor
- Patent number 9,278,846
- Issue date Mar 8, 2016
- Fairchild Semiconductor Corporation
- Cenk Acar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS multi-axis gyroscope Z-axis electrode structure
- Patent number 9,278,845
- Issue date Mar 8, 2016
- Fairchild Semiconductor Corporation
- Cenk Acar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromachined monolithic 3-axis gyroscope with single drive
- Patent number 9,246,018
- Issue date Jan 26, 2016
- Fairchild Semiconductor Corporation
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Grant
Packaging to reduce stress on microelectromechanical systems
- Patent number 9,156,673
- Issue date Oct 13, 2015
- Fairchild Semiconductor Corporation
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-die MEMS package
- Patent number 9,095,072
- Issue date Jul 28, 2015
- Fairchild Semiconductor Corporation
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS multi-axis accelerometer electrode structure
- Patent number 9,062,972
- Issue date Jun 23, 2015
- Fairchild Semiconductor Corporation
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Grant
Micromachined piezoelectric three-axis gyroscope and stacked latera...
- Patent number 9,021,880
- Issue date May 5, 2015
- QUALCOMM MEMS Technologies, Inc.
- Philip Jason Stephanou
- G01 - MEASURING TESTING
Information Patent Grant
Through silicon via with reduced shunt capacitance
- Patent number 9,006,846
- Issue date Apr 14, 2015
- Fairchild Semiconductor Corporation
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system device including a metal proof mass a...
- Patent number 9,000,656
- Issue date Apr 7, 2015
- QUALCOMM MEMS Technologies, Inc.
- Justin Phelps Black
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS proof mass with split z-axis portions
- Patent number 8,978,475
- Issue date Mar 17, 2015
- Fairchild Semiconductor Corporation
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Grant
MEMS multi-axis gyroscope with central suspension and gimbal structure
- Patent number 8,813,564
- Issue date Aug 26, 2014
- Fairchild Semiconductor Corporation
- Cenk Acar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromachined inertial sensor devices
- Patent number 8,739,626
- Issue date Jun 3, 2014
- Fairchild Semiconductor Corporation
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Grant
Micromachined devices and fabricating the same
- Patent number 8,710,599
- Issue date Apr 29, 2014
- Fairchild Semiconductor Corporation
- David Lambe Marx
- G01 - MEASURING TESTING
Information Patent Grant
Micromachined piezoelectric x-axis gyroscope
- Patent number 8,584,522
- Issue date Nov 19, 2013
- QUALCOMM MEMS Technologies, Inc.
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Grant
Micromachined piezoelectric X-Axis gyroscope
- Patent number 8,516,886
- Issue date Aug 27, 2013
- QUALCOMM MEMS Technologies, Inc.
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Grant
Micromachined piezoelectric z-axis gyroscope
- Patent number 8,516,887
- Issue date Aug 27, 2013
- QUALCOMM MEMS Technologies, Inc.
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Grant
Robust six degree-of-freedom micromachined gyroscope with anti-phas...
- Patent number 8,113,050
- Issue date Feb 14, 2012
- The Regents of the University of California
- Cenk Acar
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Hermetic Heterogeneous Integration Platform for Active and Passive...
- Publication number 20220117488
- Publication date Apr 21, 2022
- InjectSense, Inc.
- Jose Padovani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROMACHINED MULTI-AXIS GYROSCOPES WITH REDUCED STRESS SENSITIVITY
- Publication number 20210372795
- Publication date Dec 2, 2021
- Semiconductor Components Industries, LLC
- Cenk ACAR
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-AXIS GYROSCOPE WITH REDUCED BIAS DRIFT
- Publication number 20200141732
- Publication date May 7, 2020
- Semiconductor Components Industries, LLC
- Cenk ACAR
- G01 - MEASURING TESTING
Information Patent Application
MICROMACHINED MULTI-AXIS GYROSCOPES WITH REDUCED STRESS SENSITIVITY
- Publication number 20190145772
- Publication date May 16, 2019
- Semiconductor Components Industries, LLC
- Cenk ACAR
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACCELEROMETER TECHNIQUES TO COMPENSATE PACKAGE STRESS
- Publication number 20180238925
- Publication date Aug 23, 2018
- Semiconductor Components Industries, LLC
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Application
MULTI-AXIS ACCELEROMETER WITH REDUCED STRESS SENSITIVITY
- Publication number 20170315147
- Publication date Nov 2, 2017
- Semiconductor Components Industries, LLC
- Cenk ACAR
- G01 - MEASURING TESTING
Information Patent Application
MICROMACHINED MONOLITHIC 3-AXIS GYROSCOPE WITH SINGLE DRIVE
- Publication number 20160264404
- Publication date Sep 15, 2016
- Fairchild Semiconductor Corporation
- Cenk Acar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-DIE MEMS PACKAGE
- Publication number 20150321904
- Publication date Nov 12, 2015
- Fairchild Semiconductor Corporation
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PROOF MASS WITH SPLIT Z-AXIS PORTIONS
- Publication number 20150185012
- Publication date Jul 2, 2015
- Fairchild Semiconductor Corporation
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Application
MICROMACHINED PIEZOELECTRIC X-AXIS GYROSCOPE
- Publication number 20140041174
- Publication date Feb 13, 2014
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Application
MICROMACHINED PIEZOELECTRIC X-AXIS GYROSCOPE
- Publication number 20140013557
- Publication date Jan 16, 2014
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Application
PACKAGING TO REDUCE STRESS ON MICROELECTROMECHANICAL SYSTEMS
- Publication number 20130341737
- Publication date Dec 26, 2013
- Fairchild Semiconductor Corporation
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMACHINED PIEZOELECTRIC Z-AXIS GYROSCOPE
- Publication number 20130333175
- Publication date Dec 19, 2013
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Application
MICROMACHINED MONOLITHIC 3-AXIS GYROSCOPE WITH SINGLE DRIVE
- Publication number 20130328139
- Publication date Dec 12, 2013
- Fairchild Semiconductor Corporation
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Application
FLEXURE BEARING TO REDUCE QUADRATURE FOR RESONATING MICROMACHINED D...
- Publication number 20130298671
- Publication date Nov 14, 2013
- Fairchild Semiconductor Corporation
- Cenk Acar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THROUGH SILCON VIA WITH REDUCED SHUNT CAPACITANCE
- Publication number 20130277773
- Publication date Oct 24, 2013
- Fairchild Semiconductor Corporation
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMACHINED MONOLITHIC 6-AXIS INERTIAL SENSOR
- Publication number 20130270657
- Publication date Oct 17, 2013
- Fairchild Semiconductor Corporation
- Cenk Acar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEALED PACKAGING FOR MICROELECTROMECHANICAL SYSTEMS
- Publication number 20130270660
- Publication date Oct 17, 2013
- Fairchild Semiconductor Corporation
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-DIE MEMS PACKAGE
- Publication number 20130250532
- Publication date Sep 26, 2013
- Fairchild Semiconductor Corporation
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMACHINED 3-AXIS ACCELEROMETER WITH A SINGLE PROOF-MASS
- Publication number 20130247666
- Publication date Sep 26, 2013
- Fairchild Semiconductor Corporation
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Application
MEMS PROOF MASS WITH SPLIT Z-AXIS PORTIONS
- Publication number 20130192364
- Publication date Aug 1, 2013
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Application
MEMS MULTI-AXIS ACCELEROMETER ELECTRODE STRUCTURE
- Publication number 20130192369
- Publication date Aug 1, 2013
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Application
MEMS MULTI-AXIS GYROSCOPE Z-AXIS ELECTRODE STRUCTURE
- Publication number 20130139592
- Publication date Jun 6, 2013
- Fairchild Semiconductor Corporation
- Cenk Acar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MULTI-AXIS GYROSCOPE WITH CENTRAL SUSPENSION AND GIMBAL STRUCTURE
- Publication number 20130139591
- Publication date Jun 6, 2013
- Fairchiled Semiconductor Corporation
- Cenk Acar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEM DEVICE INCLUDING A METAL PROOF MASS A...
- Publication number 20120234093
- Publication date Sep 20, 2012
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Justin Phelps Black
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micromachined piezoelectric z-axis gyroscope
- Publication number 20110265566
- Publication date Nov 3, 2011
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Application
Micromachined piezoelectric X-axis gyroscope
- Publication number 20110265565
- Publication date Nov 3, 2011
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Application
Micromachined piezoelectric x-axis gyroscope
- Publication number 20110265564
- Publication date Nov 3, 2011
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Application
Micromachined piezoelectric three-axis gyroscope and stacked latera...
- Publication number 20110270569
- Publication date Nov 3, 2011
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Philip Jason Stephanou
- G01 - MEASURING TESTING
Information Patent Application
MICROMACHINED INERTIAL SENSOR DEVICES
- Publication number 20110030473
- Publication date Feb 10, 2011
- Cenk Acar
- G01 - MEASURING TESTING

Person

Patents Grantslast 30 patents

Micromachined multi-axis gyroscopes with reduced stress sensitivity

Micromachined multi-axis gyroscopes with reduced stress sensitivity

Accelerometer techniques to compensate package stress

Multi-axis accelerometer with reduced stress sensitivity

Micromachined monolithic 3-axis gyroscope with single drive

Sealed packaging for microelectromechanical systems

Micromachined piezoelectric x-axis gyroscope

MEMS proof mass with split Z-axis portions

Multi-die MEMS package

Micromachined piezoelectric x-axis gyroscope

Micromachined 3-axis accelerometer with a single proof-mass

Micromachined piezoelectric z-axis gyroscope

Flexure bearing to reduce quadrature for resonating micromachined d...

Micromachined monolithic 6-axis inertial sensor

MEMS multi-axis gyroscope Z-axis electrode structure

Micromachined monolithic 3-axis gyroscope with single drive

Packaging to reduce stress on microelectromechanical systems

Multi-die MEMS package

MEMS multi-axis accelerometer electrode structure

Micromachined piezoelectric three-axis gyroscope and stacked latera...

Through silicon via with reduced shunt capacitance

Microelectromechanical system device including a metal proof mass a...

MEMS proof mass with split z-axis portions

MEMS multi-axis gyroscope with central suspension and gimbal structure

Micromachined inertial sensor devices

Micromachined devices and fabricating the same

Micromachined piezoelectric x-axis gyroscope

Micromachined piezoelectric X-Axis gyroscope

Micromachined piezoelectric z-axis gyroscope

Robust six degree-of-freedom micromachined gyroscope with anti-phas...

Patents Applicationslast 30 patents

Hermetic Heterogeneous Integration Platform for Active and Passive...

MICROMACHINED MULTI-AXIS GYROSCOPES WITH REDUCED STRESS SENSITIVITY

MULTI-AXIS GYROSCOPE WITH REDUCED BIAS DRIFT

MICROMACHINED MULTI-AXIS GYROSCOPES WITH REDUCED STRESS SENSITIVITY

ACCELEROMETER TECHNIQUES TO COMPENSATE PACKAGE STRESS

MULTI-AXIS ACCELEROMETER WITH REDUCED STRESS SENSITIVITY

MICROMACHINED MONOLITHIC 3-AXIS GYROSCOPE WITH SINGLE DRIVE

MULTI-DIE MEMS PACKAGE

MEMS PROOF MASS WITH SPLIT Z-AXIS PORTIONS

MICROMACHINED PIEZOELECTRIC X-AXIS GYROSCOPE

MICROMACHINED PIEZOELECTRIC X-AXIS GYROSCOPE

PACKAGING TO REDUCE STRESS ON MICROELECTROMECHANICAL SYSTEMS

MICROMACHINED PIEZOELECTRIC Z-AXIS GYROSCOPE

MICROMACHINED MONOLITHIC 3-AXIS GYROSCOPE WITH SINGLE DRIVE

FLEXURE BEARING TO REDUCE QUADRATURE FOR RESONATING MICROMACHINED D...

THROUGH SILCON VIA WITH REDUCED SHUNT CAPACITANCE

MICROMACHINED MONOLITHIC 6-AXIS INERTIAL SENSOR

SEALED PACKAGING FOR MICROELECTROMECHANICAL SYSTEMS

MULTI-DIE MEMS PACKAGE

MICROMACHINED 3-AXIS ACCELEROMETER WITH A SINGLE PROOF-MASS

MEMS PROOF MASS WITH SPLIT Z-AXIS PORTIONS

MEMS MULTI-AXIS ACCELEROMETER ELECTRODE STRUCTURE

MEMS MULTI-AXIS GYROSCOPE Z-AXIS ELECTRODE STRUCTURE

MEMS MULTI-AXIS GYROSCOPE WITH CENTRAL SUSPENSION AND GIMBAL STRUCTURE

MICROELECTROMECHANICAL SYSTEM DEVICE INCLUDING A METAL PROOF MASS A...

Micromachined piezoelectric z-axis gyroscope

Micromachined piezoelectric X-axis gyroscope

Micromachined piezoelectric x-axis gyroscope

Micromachined piezoelectric three-axis gyroscope and stacked latera...

MICROMACHINED INERTIAL SENSOR DEVICES