David J. Corisis

Person

Nampa, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Build-up package for integrated circuit devices, and methods of mak...
- Patent number 11,367,667
- Issue date Jun 21, 2022
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor components having substantially rigid suppor...
- Patent number 10,763,185
- Issue date Sep 1, 2020
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 10,692,827
- Issue date Jun 23, 2020
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Build-up package for integrated circuit devices, and methods of mak...
- Patent number 10,593,607
- Issue date Mar 17, 2020
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer modules with small thicknesses and associated methods of m...
- Patent number 10,522,515
- Issue date Dec 31, 2019
- Micron Technology, Inc.
- Kevin Gibbons
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device assemblies including conductive vias having two o...
- Patent number 10,448,509
- Issue date Oct 15, 2019
- Micron Technology, Inc.
- David J. Corisis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaged semiconductor components having substantially rigid suppor...
- Patent number 10,312,173
- Issue date Jun 4, 2019
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in package (SIP) with dual laminate interposers
- Patent number 10,297,574
- Issue date May 21, 2019
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer modules with small thicknesses and associated methods of m...
- Patent number 10,256,214
- Issue date Apr 9, 2019
- Micron Technology, Inc.
- Kevin Gibbons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 10,211,114
- Issue date Feb 19, 2019
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 10,163,826
- Issue date Dec 25, 2018
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 10,008,468
- Issue date Jun 26, 2018
- Micron Technology, Inc.
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor components having substantially rigid suppor...
- Patent number 9,960,094
- Issue date May 1, 2018
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 9,812,415
- Issue date Nov 7, 2017
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 9,768,121
- Issue date Sep 19, 2017
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer modules with small thicknesses and associated methods of m...
- Patent number 9,717,157
- Issue date Jul 25, 2017
- Micron Technology, Inc.
- Kevin Gibbons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrierless chip package for integrated circuit devices, and method...
- Patent number 9,673,121
- Issue date Jun 6, 2017
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 9,530,748
- Issue date Dec 27, 2016
- Micron Technology, Inc.
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor components having substantially rigid suppor...
- Patent number 9,362,208
- Issue date Jun 7, 2016
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked packaged integrated circuit devices, and methods of making...
- Patent number 9,362,260
- Issue date Jun 7, 2016
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 9,362,141
- Issue date Jun 7, 2016
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Build-up package for integrated circuit devices, and methods of mak...
- Patent number 9,355,994
- Issue date May 31, 2016
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array semiconductor device packages
- Patent number 9,355,992
- Issue date May 31, 2016
- Micron Technology, Inc.
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making an interposer structure with embedded capacitor s...
- Patent number 9,142,427
- Issue date Sep 22, 2015
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device assemblies including conductive vias having two o...
- Patent number 9,084,360
- Issue date Jul 14, 2015
- Micron Technology, Inc.
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged microelectronic devices recessed in support member cavitie...
- Patent number 8,975,745
- Issue date Mar 10, 2015
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked packaged integrated circuit devices, and methods of making...
- Patent number 8,963,302
- Issue date Feb 24, 2015
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling computer modules small in thickness
- Patent number 8,959,759
- Issue date Feb 24, 2015
- Micron Technology, Inc.
- Kevin Gibbons
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 8,940,581
- Issue date Jan 27, 2015
- Micron Technology, Inc.
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making microelectronic die systems
- Patent number 8,869,387
- Issue date Oct 28, 2014
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAK...
- Publication number 20230005802
- Publication date Jan 5, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...
- Publication number 20200286801
- Publication date Sep 10, 2020
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF M...
- Publication number 20190279964
- Publication date Sep 12, 2019
- Micron Technology, Inc.
- Kevin Gibbons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
- Publication number 20190252281
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN PACKAGE (SIP) WITH DUAL LAMINATE INTERPOSERS
- Publication number 20190237436
- Publication date Aug 1, 2019
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20190081015
- Publication date Mar 14, 2019
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
- Publication number 20180211896
- Publication date Jul 26, 2018
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20180040582
- Publication date Feb 8, 2018
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20180005909
- Publication date Jan 4, 2018
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF M...
- Publication number 20170294414
- Publication date Oct 12, 2017
- Micron Technology, Inc.
- Kevin Gibbons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHOD...
- Publication number 20170271228
- Publication date Sep 21, 2017
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20170103961
- Publication date Apr 13, 2017
- Micron Technology, Inc.
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20160358831
- Publication date Dec 8, 2016
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
- Publication number 20160254204
- Publication date Sep 1, 2016
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...
- Publication number 20160247737
- Publication date Aug 25, 2016
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
- Publication number 20150364403
- Publication date Dec 17, 2015
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE ASSEMBLIES INCLUDING CONDUCTIVE VIAS HAVING TWO O...
- Publication number 20150319860
- Publication date Nov 5, 2015
- Micron Technology, Inc.
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED PACKAGED INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING...
- Publication number 20150171061
- Publication date Jun 18, 2015
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF M...
- Publication number 20150156908
- Publication date Jun 4, 2015
- Micron Technology, Inc.
- Kevin Gibbons
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20150130081
- Publication date May 14, 2015
- Micron Technology, Inc.
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES WITH LEADFRAMES, INCLUDING LEADFRAMES CONF...
- Publication number 20150041204
- Publication date Feb 12, 2015
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20150021769
- Publication date Jan 22, 2015
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND GRID ARRAY SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20140342476
- Publication date Nov 20, 2014
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...
- Publication number 20140295622
- Publication date Oct 2, 2014
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN PACKAGE (SIP) WITH DUAL LAMINATE INTERPOSERS
- Publication number 20140225282
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MAKING AN INTERPOSER STRUCTURE WITH EMBEDDED CAPACITOR S...
- Publication number 20140162412
- Publication date Jun 12, 2014
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF M...
- Publication number 20140154844
- Publication date Jun 5, 2014
- Micron Technology, Inc.
- Kevin Gibbons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION ELEMENTS AND SEMICONDUCTOR DEVICE PACKAGES INCLUDING...
- Publication number 20130292810
- Publication date Nov 7, 2013
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGED INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING...
- Publication number 20130256853
- Publication date Oct 3, 2013
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20130252354
- Publication date Sep 26, 2013
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS

David J. Corisis

Person

Patents Grantslast 30 patents

Build-up package for integrated circuit devices, and methods of mak...

Packaged semiconductor components having substantially rigid suppor...

Packaged microelectronic devices and methods for manufacturing pack...

Build-up package for integrated circuit devices, and methods of mak...

Computer modules with small thicknesses and associated methods of m...

Electronic device assemblies including conductive vias having two o...

Packaged semiconductor components having substantially rigid suppor...

System in package (SIP) with dual laminate interposers

Computer modules with small thicknesses and associated methods of m...

Microelectronic devices, stacked microelectronic devices, and metho...

Packaged microelectronic devices and methods for manufacturing pack...

Packaged microelectronic devices and methods for manufacturing pack...

Packaged semiconductor components having substantially rigid suppor...

Packaged microelectronic devices and methods for manufacturing pack...

Microelectronic devices, stacked microelectronic devices, and metho...

Computer modules with small thicknesses and associated methods of m...

Carrierless chip package for integrated circuit devices, and method...

Packaged microelectronic devices and methods for manufacturing pack...

Packaged semiconductor components having substantially rigid suppor...

Stacked packaged integrated circuit devices, and methods of making...

Microelectronic devices, stacked microelectronic devices, and metho...

Build-up package for integrated circuit devices, and methods of mak...

Land grid array semiconductor device packages

Methods of making an interposer structure with embedded capacitor s...

Electronic device assemblies including conductive vias having two o...

Packaged microelectronic devices recessed in support member cavitie...

Stacked packaged integrated circuit devices, and methods of making...

Method for assembling computer modules small in thickness

Packaged microelectronic devices and methods for manufacturing pack...

Methods for making microelectronic die systems

Patents Applicationslast 30 patents

BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAK...

NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...

COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF M...

PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...

SYSTEM IN PACKAGE (SIP) WITH DUAL LAMINATE INTERPOSERS

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...

PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF M...

CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHOD...

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...

NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...

PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...

ELECTRONIC DEVICE ASSEMBLIES INCLUDING CONDUCTIVE VIAS HAVING TWO O...

STACKED PACKAGED INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING...

COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF M...

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...

MICROELECTRONIC PACKAGES WITH LEADFRAMES, INCLUDING LEADFRAMES CONF...

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...

LAND GRID ARRAY SEMICONDUCTOR DEVICE PACKAGES

NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...

SYSTEM IN PACKAGE (SIP) WITH DUAL LAMINATE INTERPOSERS

METHODS OF MAKING AN INTERPOSER STRUCTURE WITH EMBEDDED CAPACITOR S...

COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF M...

REDISTRIBUTION ELEMENTS AND SEMICONDUCTOR DEVICE PACKAGES INCLUDING...

STACKED PACKAGED INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING...

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...