Gwo-Liang Weng

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 7,989,937
- Issue date Aug 2, 2011
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of making a semiconductor package and method of making a sem...
- Patent number 7,642,133
- Issue date Jan 5, 2010
- Advanced Semiconductor Engineering, Inc.
- Yen-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable semiconductor package
- Patent number 7,589,408
- Issue date Sep 15, 2009
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable semiconductor package
- Patent number 7,550,832
- Issue date Jun 23, 2009
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with a ring having a buffer groove that surrounds the...
- Patent number 7,547,962
- Issue date Jun 16, 2009
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a package structure
- Patent number 7,442,580
- Issue date Oct 28, 2008
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure and the packaging process thereof
- Patent number 7,439,619
- Issue date Oct 21, 2008
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and package process thereof
- Patent number 7,432,127
- Issue date Oct 7, 2008
- Advanced Semiconductor Engineering Inc.
- Yung-Li Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable semiconductor package
- Patent number 7,365,427
- Issue date Apr 29, 2008
- Advanced Semiconductor Engineering, Inc.
- Yung-Li Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for balancing molding flow during the assembly of semiconduc...
- Patent number 7,195,956
- Issue date Mar 27, 2007
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact sensor package
- Patent number 7,193,282
- Issue date Mar 20, 2007
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensor chip packaging structure
- Patent number 7,187,067
- Issue date Mar 6, 2007
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked package module
- Patent number 7,187,070
- Issue date Mar 6, 2007
- Advanced Semiconductor Engineering, Inc.
- Chi Chih Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 7,126,221
- Issue date Oct 24, 2006
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package structure
- Patent number 7,122,893
- Issue date Oct 17, 2006
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 7,061,079
- Issue date Jun 13, 2006
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package
- Patent number 6,815,833
- Issue date Nov 9, 2004
- Advanced Semiconductor Engineering, Inc.
- Shih-Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding apparatus and molding method for flexible substrate based p...
- Patent number 6,465,277
- Issue date Oct 15, 2002
- Advanced Semiconductor Engineering, Inc.
- Shih-Chang Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molding apparatus for flexible substrate based package
- Patent number 6,257,857
- Issue date Jul 10, 2001
- Advanced Semiconductor Engineering, Inc.
- Shih-Chang Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20140312496
- Publication date Oct 23, 2014
- Advanced Semiconductor Engineering, Inc.
- Yen-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20080105962
- Publication date May 8, 2008
- Advanced Semiconductor Engineering, Inc.
- Yu-Lin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making a semiconductor package and method of making a sem...
- Publication number 20080076208
- Publication date Mar 27, 2008
- Yen-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and semiconductor device
- Publication number 20080073769
- Publication date Mar 27, 2008
- Yen-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable semiconductor package
- Publication number 20080042251
- Publication date Feb 21, 2008
- Gwo-Liang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20080023816
- Publication date Jan 31, 2008
- Gwo-Liang Weng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stackable semiconductor package
- Publication number 20070278640
- Publication date Dec 6, 2007
- Gwo-Liang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable semiconductor package
- Publication number 20070252284
- Publication date Nov 1, 2007
- Po-Ching Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE SEMICONDUCTOR PACKAGE
- Publication number 20070246815
- Publication date Oct 25, 2007
- Yung-Li Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip package
- Publication number 20070222041
- Publication date Sep 27, 2007
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of a package structure
- Publication number 20070224732
- Publication date Sep 27, 2007
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure and manufacturing method thereof
- Publication number 20070222049
- Publication date Sep 27, 2007
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Chip Package and Package Process Thereof
- Publication number 20070042534
- Publication date Feb 22, 2007
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Yung-Li Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor chip packaging structure
- Publication number 20060091515
- Publication date May 4, 2006
- Gwo-Liang Weng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor package and method of manufacturing the same
- Publication number 20050275074
- Publication date Dec 15, 2005
- Gwo-Liang Weng
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for balancing molding flow during the assembly of semiconduc...
- Publication number 20050266616
- Publication date Dec 1, 2005
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20050181543
- Publication date Aug 18, 2005
- SHIH-CHANG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Contact sensor package
- Publication number 20050168906
- Publication date Aug 4, 2005
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic package structure and the packaging process thereof
- Publication number 20050146054
- Publication date Jul 7, 2005
- Chi-Chih Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20050104194
- Publication date May 19, 2005
- GWO-LIANG WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package module
- Publication number 20050082656
- Publication date Apr 21, 2005
- Advanced Semiconductor Engineering, Inc.
- Chi Chih Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package structure
- Publication number 20050051885
- Publication date Mar 10, 2005
- Gwo-Liang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING MEHOD THEREOF]
- Publication number 20040113266
- Publication date Jun 17, 2004
- SHIH-CHANG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip package
- Publication number 20040089879
- Publication date May 13, 2004
- Advanced Semiconductor Engineering, Inc.
- Shih-Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System in package structure
- Publication number 20040080036
- Publication date Apr 29, 2004
- Advanced Semiconductor Engineering, Inc.
- Ching-Hui Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molding apparatus and molding method for flexible substrate based p...
- Publication number 20010018109
- Publication date Aug 30, 2001
- Advanced Semiconductor Engineering, Inc.
- Shih-Chang Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Gwo-Liang Weng

Person

Patents Grantslast 30 patents

Package structure and manufacturing method thereof

Method of making a semiconductor package and method of making a sem...

Stackable semiconductor package

Stackable semiconductor package

Chip package with a ring having a buffer groove that surrounds the...

Manufacturing method of a package structure

Electronic package structure and the packaging process thereof

Chip package and package process thereof

Stackable semiconductor package

Method for balancing molding flow during the assembly of semiconduc...

Contact sensor package

Sensor chip packaging structure

Stacked package module

Semiconductor package

Semiconductor package structure

Chip package structure and manufacturing method thereof

Flip chip package

Molding apparatus and molding method for flexible substrate based p...

Molding apparatus for flexible substrate based package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

CHIP PACKAGE

Method of making a semiconductor package and method of making a sem...

Semiconductor package and semiconductor device

Stackable semiconductor package

Semiconductor package

Stackable semiconductor package

Stackable semiconductor package

STACKABLE SEMICONDUCTOR PACKAGE

Chip package

Manufacturing method of a package structure

Package structure and manufacturing method thereof

Chip Package and Package Process Thereof

Sensor chip packaging structure

Semiconductor package and method of manufacturing the same

Method for balancing molding flow during the assembly of semiconduc...

SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF

Contact sensor package

Electronic package structure and the packaging process thereof

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Stacked package module

Semiconductor package structure

[SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING MEHOD THEREOF]

Flip chip package

System in package structure

Molding apparatus and molding method for flexible substrate based p...