Manufacturing method of a package structure

Abstract

A manufacturing method of a package structure is provided. Firstly, a substrate having a surface is provided. Next, a chip is disposed on the surface of the substrate. Then, a packing material layer is formed on the surface of the substrate. Next, a thin film is pasted on the packing material layer. Then, the substrate and the packing material layer are thoroughly cut along a cutting line around the chip by a first cutting blade but the thin film is not cut thoroughly. Next, the substrate is thoroughly cut along at least a part of the cutting line by a second cutting blade but the packing material layer is not thoroughly cut such that a part of the packing material layer is exposed. The width of the second cutting blade is larger than the width of the first cutting blade.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A˜1E illustrate a conventional manufacturing process of a package structure;

FIG. 2 is a flowchart of a manufacturing method of a package structure according to the invention;

FIG. 3A˜3H illustrate the manufacturing process of the package structure according to the invention;

FIG. 4 is a top view of a substrate of FIG. 3F and a cutting line thereof;

FIG. 5 is a top view of a substrate of FIG. 3G and a cutting line thereof; and

FIG. 6 is a top view of a substrate of a package structure according to a second embodiment of the invention and a cutting line thereof.

Claims

1. A manufacturing method of a package structure, the method comprising: providing a substrate having a surface;disposing a chip on the surface of the substrate;forming a packing material layer on the surface of the substrate;pasting a thin film on a surface of the packing material layer;cutting thoroughly the substrate and the packing material layer along a cutting line around the chip by a first cutting blade without cutting thoroughly the thin film; andcutting thoroughly the substrate along at least a part of the cutting line by a second cutting blade without cutting thoroughly the packing material layer for exposing a part of the packing material layer, wherein the width of the second cutting blade is larger than the width of the first cutting blade.

2. The manufacturing method of a package structure according to claim 1, wherein after the step of cutting thoroughly the substrate by the second cutting blade, the method further comprises: removing the thin film.

3. The manufacturing method of a package structure according to claim 1, wherein the packing material layer is made from a transparent material.

4. The manufacturing method of a package structure according to claim 1, wherein the package structure is a fingerprint recognizer and the chip is a fingerprint recognition chip.

5. The manufacturing method of a package structure according to claim 1, wherein after the step of disposing the chip, the method further comprises: wire bonding the chip and the substrate.

6. The manufacturing method of a package structure according to claim 1, wherein the chip is a rectangular structure and the cutting line is a rectangle.

7. The manufacturing method of a package structure according to claim 6, wherein in the step of cutting thoroughly the substrate by the second cutting blade, the second cutting blade cuts thoroughly the substrate along four lateral sides of the cutting line.

8. The manufacturing method of a package structure according to claim 6, wherein in the step of cutting thoroughly the substrate by the second cutting blade, the second cutting blade cuts thoroughly the substrate along two opposite lateral sides of the cutting line.