James G. Wilder

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Enclosure for a cable connection
- Patent number 10,116,086
- Issue date Oct 30, 2018
- 3M Innovative Properties Company
- William V. Dower
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Enclosure for a cable connection
- Patent number 9,543,746
- Issue date Jan 10, 2017
- 3M Innovative Properties Company
- William V. Dower
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Enclosure for a cable connection
- Patent number 8,841,553
- Issue date Sep 23, 2014
- 3M Innovative Properties Company
- William V. Dower
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit module with thermal casing systems
- Patent number 7,737,549
- Issue date Jun 15, 2010
- Entorian Technologies LP
- James Douglas Wehrly, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low profile stacking system and method
- Patent number 7,626,273
- Issue date Dec 1, 2009
- Entorian Technologies, LP
- Julian Partridge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink for a high capacity thin module system
- Patent number 7,626,259
- Issue date Dec 1, 2009
- Entorian Technologies, LP
- James Douglas Wehrly, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit stacking system
- Patent number 7,606,048
- Issue date Oct 20, 2009
- Enthorian Technologies, LP
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-based circuit module
- Patent number 7,595,550
- Issue date Sep 29, 2009
- Entorian Technologies, LP
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit stacking system
- Patent number 7,586,758
- Issue date Sep 8, 2009
- Entorian Technologies, LP
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory expansion and integrated circuit stacking system and method
- Patent number 7,542,304
- Issue date Jun 2, 2009
- Entorian Technologies, LP
- Russell Rapport
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit stacking system and method
- Patent number 7,524,703
- Issue date Apr 28, 2009
- Entorian Technologies, LP
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacking system and method
- Patent number 7,495,334
- Issue date Feb 24, 2009
- Entorian Technologies, LP
- Russell Rapport
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modularized die stacking system and method
- Patent number 7,485,951
- Issue date Feb 3, 2009
- Entorian Technologies, LP
- David L. Roper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High capacity thin module system
- Patent number 7,459,784
- Issue date Dec 2, 2008
- Entorian Technologies, LP
- James Douglas Wehrly, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit module with thermal casing systems
- Patent number 7,446,410
- Issue date Nov 4, 2008
- Entorian Technologies, LP
- James Douglas Wehrly, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High capacity thin module system
- Patent number 7,443,023
- Issue date Oct 28, 2008
- Entorian Technologies, LP
- James Douglas Wehrly, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit stacking system and method
- Patent number 7,335,975
- Issue date Feb 26, 2008
- Staktek Group L.P.
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory expansion and chip scale stacking system and method
- Patent number 7,256,484
- Issue date Aug 14, 2007
- Staktek Group L.P.
- Russell Rapport
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pitch change and chip scale stacking system and method
- Patent number 7,202,555
- Issue date Apr 10, 2007
- Staktek Group L.P.
- David L. Roper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low profile stacking system and method
- Patent number 7,180,167
- Issue date Feb 20, 2007
- Staktek Group L.P.
- Julian Partridge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low profile chip scale stacking system and method
- Patent number 7,094,632
- Issue date Aug 22, 2006
- Staktek Group L.P.
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pitch change and chip scale stacking system
- Patent number 7,053,478
- Issue date May 30, 2006
- Staktek Group L.P.
- David L. Roper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low profile chip scale stacking system and method
- Patent number 7,026,708
- Issue date Apr 11, 2006
- Staktek Group L.P.
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory expansion and chip scale stacking system and method
- Patent number 6,955,945
- Issue date Oct 18, 2005
- Staktek Group L.P.
- Russell Rapport
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit stacking system and method
- Patent number 6,956,284
- Issue date Oct 18, 2005
- Staktek Group L.P.
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit stacking system and method
- Patent number 6,940,729
- Issue date Sep 6, 2005
- Staktek Group L.P.
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory expansion and chip scale stacking system and method
- Patent number 6,914,324
- Issue date Jul 5, 2005
- Staktek Group L.P.
- Russell Rapport
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wide data path stacking system and method
- Patent number 6,618,257
- Issue date Sep 9, 2003
- Staktek Group, L.P.
- James Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacking system and method
- Patent number 6,608,763
- Issue date Aug 19, 2003
- Staktek Group L.P.
- Carmen D. Burns
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip scale stacking system and method
- Patent number 6,576,992
- Issue date Jun 10, 2003
- Staktek Group L.P.
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ENCLOSURE FOR A CABLE CONNECTION
- Publication number 20170117661
- Publication date Apr 27, 2017
- 3M Innovative Properties Company
- William V. Dower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCLOSURE FOR A CABLE CONNECTION
- Publication number 20150034357
- Publication date Feb 5, 2015
- 3M Innovative Properties Company
- William V. Dower
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ENCLOSURE FOR A CABLE CONNECTION
- Publication number 20120090876
- Publication date Apr 19, 2012
- 3M Innovative Properties Company
- William V. Dower
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
LOW PROFILE CHIP SCALE STACKING SYSTEM AND METHOD
- Publication number 20090273069
- Publication date Nov 5, 2009
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low Profile Stacking System and Method
- Publication number 20090124045
- Publication date May 14, 2009
- Julian Partridge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN CIRCUIT MODULE AND METHOD
- Publication number 20090073661
- Publication date Mar 19, 2009
- Staktek Group L.P.
- Mark Wolfe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Module with Thermal Casing Systems
- Publication number 20090052124
- Publication date Feb 26, 2009
- Entorian Technologies, L.P. (formerly Staktek Group, L.P)
- James Douglas Wehrly, JR.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Capacity Thin Module System
- Publication number 20090046431
- Publication date Feb 19, 2009
- Staktek Group. L.P.
- James Douglas Wehrly, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low profile chip scale stacking system and method
- Publication number 20080211077
- Publication date Sep 4, 2008
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Capacity Thin Module System and Method
- Publication number 20080094803
- Publication date Apr 24, 2008
- Staktek Group. L.P.
- James Douglas Wehrly
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Modularized Die Stacking System and Method
- Publication number 20080067662
- Publication date Mar 20, 2008
- Staktek Group. L.P.
- David L. Roper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low Profile Stacking System and Method
- Publication number 20070114649
- Publication date May 24, 2007
- Staktek Group L.P., a Texas Limited Partnership
- Julian Partridge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low Profile Stacking System and Method
- Publication number 20070117262
- Publication date May 24, 2007
- Staktek Group L.P., a Texas Limited Partnership
- Julian Partridge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacking system and method
- Publication number 20060131716
- Publication date Jun 22, 2006
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High capacity thin module system and method
- Publication number 20060091529
- Publication date May 4, 2006
- Staktek Group. L.P.
- James Douglas Wehrly
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacking system and method
- Publication number 20060091521
- Publication date May 4, 2006
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit module with thermal casing systems and methods
- Publication number 20060090102
- Publication date Apr 27, 2006
- James Douglas Wehrly
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked integrated circuit cascade signaling system and method
- Publication number 20060043558
- Publication date Mar 2, 2006
- Staktek Group L.P.
- James W. Cady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rugged CSP module system and method
- Publication number 20060033187
- Publication date Feb 16, 2006
- Staktek Group, L.P.
- James Wilder
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated circuit stacking system and method
- Publication number 20060008945
- Publication date Jan 12, 2006
- Staktek Group, L.P.
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacking system and method
- Publication number 20050280135
- Publication date Dec 22, 2005
- Staktek Group. L.P.
- Russell Rapport
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flex-based circuit module
- Publication number 20050263872
- Publication date Dec 1, 2005
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pitch change and chip scale stacking system and method
- Publication number 20050146011
- Publication date Jul 7, 2005
- Staktek Group, L.P.
- David L. Roper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low profile stacking system and method
- Publication number 20050146031
- Publication date Jul 7, 2005
- Staktek Group, L.P.
- Julian Partridge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Memory expansion and chip scale stacking system and method
- Publication number 20050067683
- Publication date Mar 31, 2005
- Staktek Group. L.P.
- Russell Rapport
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Memory expansion and chip scale stacking system and method
- Publication number 20050062144
- Publication date Mar 24, 2005
- Staktek Group, L.P.
- Russell Rapport
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Memory expansion and integrated circuit stacking system and method
- Publication number 20050057911
- Publication date Mar 17, 2005
- Staktek Group, L.P.
- Russell Rapport
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit stacking system and method
- Publication number 20050041402
- Publication date Feb 24, 2005
- Staktek Group, L.P.
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit stacking system and method
- Publication number 20050041403
- Publication date Feb 24, 2005
- Staktek Group, L.P.
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit stacking system and method
- Publication number 20050041404
- Publication date Feb 24, 2005
- Staktek Group. L.P.
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

James G. Wilder

Person

Patents Grantslast 30 patents

Enclosure for a cable connection

Enclosure for a cable connection

Enclosure for a cable connection

Circuit module with thermal casing systems

Low profile stacking system and method

Heat sink for a high capacity thin module system

Integrated circuit stacking system

Flex-based circuit module

Integrated circuit stacking system

Memory expansion and integrated circuit stacking system and method

Integrated circuit stacking system and method

Stacking system and method

Modularized die stacking system and method

High capacity thin module system

Circuit module with thermal casing systems

High capacity thin module system

Integrated circuit stacking system and method

Memory expansion and chip scale stacking system and method

Pitch change and chip scale stacking system and method

Low profile stacking system and method

Low profile chip scale stacking system and method

Pitch change and chip scale stacking system

Low profile chip scale stacking system and method

Memory expansion and chip scale stacking system and method

Integrated circuit stacking system and method

Integrated circuit stacking system and method

Memory expansion and chip scale stacking system and method

Wide data path stacking system and method

Stacking system and method

Chip scale stacking system and method

Patents Applicationslast 30 patents

ENCLOSURE FOR A CABLE CONNECTION

ENCLOSURE FOR A CABLE CONNECTION

ENCLOSURE FOR A CABLE CONNECTION

LOW PROFILE CHIP SCALE STACKING SYSTEM AND METHOD

Low Profile Stacking System and Method

THIN CIRCUIT MODULE AND METHOD

Circuit Module with Thermal Casing Systems

High Capacity Thin Module System

Low profile chip scale stacking system and method

High Capacity Thin Module System and Method

Modularized Die Stacking System and Method

Low Profile Stacking System and Method

Low Profile Stacking System and Method

Stacking system and method

High capacity thin module system and method

Stacking system and method

Circuit module with thermal casing systems and methods

Stacked integrated circuit cascade signaling system and method

Rugged CSP module system and method

Integrated circuit stacking system and method

Stacking system and method

Flex-based circuit module

Pitch change and chip scale stacking system and method

Low profile stacking system and method

Memory expansion and chip scale stacking system and method

Memory expansion and chip scale stacking system and method

Memory expansion and integrated circuit stacking system and method

Integrated circuit stacking system and method

Integrated circuit stacking system and method

Integrated circuit stacking system and method