John P. Hummel

Person

Verbank, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Formation of vertical devices by electroplating
- Patent number 8,247,905
- Issue date Aug 21, 2012
- International Business Machines Corporation
- Hariklia Deligianni
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of forming vertical contacts in integrated circuits
- Patent number 7,803,639
- Issue date Sep 28, 2010
- International Business Machines Corporation
- Solomon Assefa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of vertical devices by electroplating
- Patent number 7,608,538
- Issue date Oct 27, 2009
- International Business Machines Corporation
- Hariklia Deligianni
- G11 - INFORMATION STORAGE
Information Patent Grant
Utilizing sidewall spacer features to form magnetic tunnel junction...
- Patent number 7,531,367
- Issue date May 12, 2009
- International Business Machines Corporation
- Solomon Assefa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic switching device
- Patent number 7,097,777
- Issue date Aug 29, 2006
- Infineon Technologies AG
- Gregory Costrini
- G11 - INFORMATION STORAGE
Information Patent Grant
Encapsulation of conductive lines of semiconductor devices
- Patent number 7,087,438
- Issue date Aug 8, 2006
- Infineon Technologies AG
- Ihar Kasko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer integration scheme in MRAM technology
- Patent number 6,985,384
- Issue date Jan 10, 2006
- International Business Machines Corporation
- Gregory Costrini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improved alignment of magnetic tunnel junction elements
- Patent number 6,933,204
- Issue date Aug 23, 2005
- International Business Machines Corporation
- Chandrasekhar Sarma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bilayer CMP process to improve surface roughness of magnetic stack...
- Patent number 6,743,642
- Issue date Jun 1, 2004
- International Business Machines Corporation
- Gregory Costrini
- G11 - INFORMATION STORAGE
Information Patent Grant
Dual damascene flowable oxide insulation structure and metallic bar...
- Patent number 6,727,589
- Issue date Apr 27, 2004
- International Business Machines Corporation
- Stephen E. Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating cap layer and conductive cap layer for semiconductor dev...
- Patent number 6,680,500
- Issue date Jan 20, 2004
- Infineon Technologies AG
- Kia-Seng Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment to enhance inorganic dielectric adhesion to copper
- Patent number 6,593,660
- Issue date Jul 15, 2003
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnect wiring structure with low dielectric constant ins...
- Patent number 6,577,011
- Issue date Jun 10, 2003
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post metalization chem-mech polishing dielectric etch
- Patent number 6,551,924
- Issue date Apr 22, 2003
- International Business Machines Corporation
- Timothy J. Dalton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interim oxidation of silsesquioxane dielectric for dual damascene p...
- Patent number 6,479,884
- Issue date Nov 12, 2002
- International Business Machines Corporation
- Robert Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene processing for semiconductor chip interconnects
- Patent number 6,448,176
- Issue date Sep 10, 2002
- International Business Machines Corporation
- Alfred Grill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture and ion barrier for protection of devices and interconnect...
- Patent number 6,423,566
- Issue date Jul 23, 2002
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In situ formation of protective layer on silsesquioxane dielectric...
- Patent number 6,348,736
- Issue date Feb 19, 2002
- International Business Machines Corporation
- Vincent J. McGahay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interim oxidation of silsesquioxane dielectric for dual damascene p...
- Patent number 6,329,280
- Issue date Dec 11, 2001
- International Business Machines Corporation
- Robert Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment to enhance inorganic dielectric adhesion to copper
- Patent number 6,261,951
- Issue date Jul 17, 2001
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment to enhance inorganic dielectric adhesion to copper
- Patent number 6,255,217
- Issue date Jul 3, 2001
- International Business Machines Corporation
- Paul D. Agnello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene flowable oxide insulation structure and metallic bar...
- Patent number 6,221,780
- Issue date Apr 24, 2001
- International Business Machines Corporation
- Stephen E. Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnect wiring structure with low dielectric constant ins...
- Patent number 6,184,121
- Issue date Feb 6, 2001
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene processing for semiconductor chip interconnects
- Patent number 6,140,226
- Issue date Oct 31, 2000
- International Business Machines Corporation
- Alfred Grill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture and ion barrier for protection of devices and interconnect...
- Patent number 6,130,472
- Issue date Oct 10, 2000
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low TCE polyimides as improved insulator in multilayer interconnect...
- Patent number 5,976,710
- Issue date Nov 2, 1999
- International Business Machines Corporation
- Krishna Gandhi Sachdev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and process for its manufacture
- Patent number 5,962,113
- Issue date Oct 5, 1999
- International Business Machines Corporation
- Hugh Ralph Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming a circuit assembly
- Patent number 5,633,034
- Issue date May 27, 1997
- International Business Machines Corporation
- Kenneth R. Carter
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Viscosity stable, essentially gel-free polyamic acid compositions
- Patent number 5,115,090
- Issue date May 19, 1992
- Krishna G. Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
FORMATION OF VERTICAL DEVICES BY ELECTROPLATING
- Publication number 20090294989
- Publication date Dec 3, 2009
- International Business Machines Corporation
- Hariklia Deligianni
- G11 - INFORMATION STORAGE
Information Patent Application
Utilizing Sidewall Spacer Features to Form Magnetic Tunnel Junction...
- Publication number 20080211055
- Publication date Sep 4, 2008
- International Business Machines Corporation
- Solomon Assefa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF VERTICAL DEVICES BY ELECTROPLATING
- Publication number 20080166874
- Publication date Jul 10, 2008
- International Business Machines Corporation
- Hariklia Deligianni
- G11 - INFORMATION STORAGE
Information Patent Application
Method of Forming Vertical Contacts in Integrated Circuits
- Publication number 20080164617
- Publication date Jul 10, 2008
- Solomon Assefa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Utilizing sidewall spacer features to form magnetic tunnel junction...
- Publication number 20070166840
- Publication date Jul 19, 2007
- International Business Machines Corporation
- Solomon Assefa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulation of conductive lines of semiconductor devices
- Publication number 20060019431
- Publication date Jan 26, 2006
- Ihar Kasko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetic switching device
- Publication number 20050207064
- Publication date Sep 22, 2005
- Gregory Costrini
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR IMPROVED ALIGNMENT OF MAGNETIC TUNNEL JUNCTION ELEMENTS
- Publication number 20050079683
- Publication date Apr 14, 2005
- International Business Machines Corporation
- Chandrasekhar Sarma
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
BILAYER CMP PROCESS TO IMPROVE SURFACE ROUGHNESS OF MAGNETIC STACK...
- Publication number 20040087038
- Publication date May 6, 2004
- International Business Machines Corporation
- Gregory Costrini
- G11 - INFORMATION STORAGE
Information Patent Application
Patterning metal stack layers of magnetic switching device, utilizi...
- Publication number 20040084400
- Publication date May 6, 2004
- Gregory Costrini
- G11 - INFORMATION STORAGE
Information Patent Application
Spacer integration scheme in MRAM technology
- Publication number 20040063223
- Publication date Apr 1, 2004
- International Business Machines Corporation
- Gregory Costrini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING CAP LAYER AND CONDUCTIVE CAP LAYER FOR SEMICONDUCTOR DEV...
- Publication number 20040021188
- Publication date Feb 5, 2004
- Infineon Technologies North America Corp.
- Kia-Seng Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma treatment to enhance inorganic dielectric adhesion to copper
- Publication number 20010053591
- Publication date Dec 20, 2001
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interim oxidation of silsesquioxane dielectric for dual damascene p...
- Publication number 20010036739
- Publication date Nov 1, 2001
- Robert Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual damascene flowable oxide insulation structure and metallic bar...
- Publication number 20010000115
- Publication date Apr 5, 2001
- Stephen E. Greco
- H01 - BASIC ELECTRIC ELEMENTS

John P. Hummel

Person

Patents Grantslast 30 patents

Formation of vertical devices by electroplating

Method of forming vertical contacts in integrated circuits

Formation of vertical devices by electroplating

Utilizing sidewall spacer features to form magnetic tunnel junction...

Magnetic switching device

Encapsulation of conductive lines of semiconductor devices

Spacer integration scheme in MRAM technology

Method for improved alignment of magnetic tunnel junction elements

Bilayer CMP process to improve surface roughness of magnetic stack...

Dual damascene flowable oxide insulation structure and metallic bar...

Insulating cap layer and conductive cap layer for semiconductor dev...

Plasma treatment to enhance inorganic dielectric adhesion to copper

Chip interconnect wiring structure with low dielectric constant ins...

Post metalization chem-mech polishing dielectric etch

Interim oxidation of silsesquioxane dielectric for dual damascene p...

Dual damascene processing for semiconductor chip interconnects

Moisture and ion barrier for protection of devices and interconnect...

In situ formation of protective layer on silsesquioxane dielectric...

Interim oxidation of silsesquioxane dielectric for dual damascene p...

Plasma treatment to enhance inorganic dielectric adhesion to copper

Plasma treatment to enhance inorganic dielectric adhesion to copper

Dual damascene flowable oxide insulation structure and metallic bar...

Chip interconnect wiring structure with low dielectric constant ins...

Dual damascene processing for semiconductor chip interconnects

Moisture and ion barrier for protection of devices and interconnect...

Low TCE polyimides as improved insulator in multilayer interconnect...

Integrated circuit device and process for its manufacture

Process for forming a circuit assembly

Viscosity stable, essentially gel-free polyamic acid compositions

Patents Applicationslast 30 patents

FORMATION OF VERTICAL DEVICES BY ELECTROPLATING

Utilizing Sidewall Spacer Features to Form Magnetic Tunnel Junction...

FORMATION OF VERTICAL DEVICES BY ELECTROPLATING

Method of Forming Vertical Contacts in Integrated Circuits

Utilizing sidewall spacer features to form magnetic tunnel junction...

Encapsulation of conductive lines of semiconductor devices

Magnetic switching device

METHOD FOR IMPROVED ALIGNMENT OF MAGNETIC TUNNEL JUNCTION ELEMENTS

BILAYER CMP PROCESS TO IMPROVE SURFACE ROUGHNESS OF MAGNETIC STACK...

Patterning metal stack layers of magnetic switching device, utilizi...

Spacer integration scheme in MRAM technology

INSULATING CAP LAYER AND CONDUCTIVE CAP LAYER FOR SEMICONDUCTOR DEV...

Plasma treatment to enhance inorganic dielectric adhesion to copper

Interim oxidation of silsesquioxane dielectric for dual damascene p...

Dual damascene flowable oxide insulation structure and metallic bar...