John VanNortwick

Person

Kuna, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Devices and method for handling microelectronics assemblies
- Patent number 9,048,272
- Issue date Jun 2, 2015
- Illinois Tool Works Inc.
- Valoris L. Forsyth
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus for improving stencil/screen print quality
- Patent number 7,476,277
- Issue date Jan 13, 2009
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for in-line testing of flip-chip semiconductor assemblies
- Patent number 7,105,366
- Issue date Sep 12, 2006
- Micron Technology, Inc.
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Grant
Method for packaging flip-chip semiconductor assemblies
- Patent number 7,074,648
- Issue date Jul 11, 2006
- Micron Technology, Inc.
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Grant
Method for in-line testing of flip-chip semiconductor assemblies
- Patent number 7,005,878
- Issue date Feb 28, 2006
- Micron Technology, Inc.
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Grant
Method for in-line testing of flip-chip semiconductor assemblies
- Patent number 6,982,177
- Issue date Jan 3, 2006
- Micron Technology, Inc.
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing flip-chip semiconductor assembly
- Patent number 6,972,200
- Issue date Dec 6, 2005
- Micron Technology, Inc.
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Grant
Method for in-line testing of flip-chip semiconductor assemblies
- Patent number 6,967,113
- Issue date Nov 22, 2005
- Micron Technology, Inc.
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Grant
Method for in-line testing of flip-chip semiconductor assemblies
- Patent number 6,962,826
- Issue date Nov 8, 2005
- Micron Technology, Inc.
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Grant
Method for in-line testing of flip-chip semiconductor assemblies
- Patent number 6,953,700
- Issue date Oct 11, 2005
- Micron Technology, Inc.
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Grant
Method for in-line testing of flip-chip semiconductor assemblies
- Patent number 6,953,699
- Issue date Oct 11, 2005
- Micron Technology, Inc.
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Grant
Method for in-line testing of flip-chip semiconductor assemblies
- Patent number 6,954,081
- Issue date Oct 11, 2005
- Micron Technology, Inc.
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Grant
Method for in-line testing of flip-chip semiconductor assemblies
- Patent number 6,949,943
- Issue date Sep 27, 2005
- Micron Technology, Inc.
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Grant
Automated method of attaching flip-chip devices to a substrate
- Patent number 6,793,749
- Issue date Sep 21, 2004
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated method of attaching flip chip devices to a substrate
- Patent number 6,773,523
- Issue date Aug 10, 2004
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing flip-chip semiconductor assembly
- Patent number 6,750,070
- Issue date Jun 15, 2004
- Micron Technology, Inc.
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Grant
Use of a reference fiducial on a semiconductor package to monitor a...
- Patent number 6,744,134
- Issue date Jun 1, 2004
- Micron Technology, Inc.
- Jay Roberts
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for improving stencil/screen print quality
- Patent number 6,669,781
- Issue date Dec 30, 2003
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for improving stencil/screen print quality
- Patent number 6,641,669
- Issue date Nov 4, 2003
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Use of a reference fiducial on a semiconductor package to monitor a...
- Patent number 6,638,831
- Issue date Oct 28, 2003
- Micron Technology, Inc.
- Jay Roberts
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for fabricating semiconductor components
- Patent number 6,626,222
- Issue date Sep 30, 2003
- Micron Technology, Inc.
- John VanNortwick
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Apparatus for improving stencil/screen print quality
- Patent number 6,607,599
- Issue date Aug 19, 2003
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for improving stencil/screen print quality
- Patent number 6,599,365
- Issue date Jul 29, 2003
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for in-line testing of flip-chip semiconductor assemblies
- Patent number 6,545,498
- Issue date Apr 8, 2003
- Micron Technology, Inc.
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Grant
Automated method of attaching flip chip devices to a substrate
- Patent number 6,537,400
- Issue date Mar 25, 2003
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing improved stencil/screen
- Patent number 6,521,287
- Issue date Feb 18, 2003
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for in-line testing of flip-chip semiconductor assemblies
- Patent number 6,472,901
- Issue date Oct 29, 2002
- Micron Technology, Inc.
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Grant
Method of depositing a thermoplastic polymer in semiconductor fabri...
- Patent number 6,440,777
- Issue date Aug 27, 2002
- Micron Technology, Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufactoring and using stencil/screen
- Patent number 6,368,897
- Issue date Apr 9, 2002
- Micron Technology, Inc.
- Tongbi Jiang
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for in-line testing of flip-chip semiconductor assemblies
- Patent number 6,369,602
- Issue date Apr 9, 2002
- Micron Technology, Inc.
- Chad A. Cobbley
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
DEVICES AND METHODS FOR HANDLING MICROELECTRONICS ASSEMBLIES
- Publication number 20150235882
- Publication date Aug 20, 2015
- Illinois Tool Works Inc.
- Valoris L. FORSYTH
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
DEVICES AND METHOD FOR HANDLING MICROELECTRONICS ASSEMBLIES
- Publication number 20110259772
- Publication date Oct 27, 2011
- Illinois Tool Works Inc.
- Valoris L. Forsyth
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
DEVICES AND METHODS FOR HANDLING MICROELECTRONIC ASSEMBLIES
- Publication number 20100089851
- Publication date Apr 15, 2010
- Micron Technology, Inc.
- Michael R. Slaughter
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Apparatus for improving stencil/screen print quality
- Publication number 20050145169
- Publication date Jul 7, 2005
- Micron Technology, Inc.
- Tongbi Jiang
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method for in-line testing of flip-chip semiconductor assemblies
- Publication number 20050024080
- Publication date Feb 3, 2005
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Application
Method for in-line testing of flip-chip semiconductor assemblies
- Publication number 20050007141
- Publication date Jan 13, 2005
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Application
Method for in-line testing of flip-chip semiconductor assemblies
- Publication number 20050007142
- Publication date Jan 13, 2005
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Application
Method for in-line testing of flip-chip semiconductor assemblies
- Publication number 20040263197
- Publication date Dec 30, 2004
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Application
Method for in-line testing of flip-chip semiconductor assemblies
- Publication number 20040263195
- Publication date Dec 30, 2004
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Application
Method for in-line testing of flip-chip semiconductor assemblies
- Publication number 20040263196
- Publication date Dec 30, 2004
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Application
Stencil/screen print apparatus
- Publication number 20040107902
- Publication date Jun 10, 2004
- Micron Technology, Inc.
- Tongbi Jiang
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method for in-line testing of flip-chip semiconductor assemblies
- Publication number 20040104741
- Publication date Jun 3, 2004
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Application
Method for packaging flip-chip semiconductor assemblies
- Publication number 20040097009
- Publication date May 20, 2004
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Application
Apparatus for improving stencil/screen print quality
- Publication number 20040089171
- Publication date May 13, 2004
- Micron Technology, Inc.
- Tongbi Jiang
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method for manufacturing flip-chip semiconductor assembly
- Publication number 20040080332
- Publication date Apr 29, 2004
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Application
Method for in-line testing of flip-chip semiconductor assemblies
- Publication number 20030141888
- Publication date Jul 31, 2003
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Application
Method for in-line testing of flip-chip semiconductor assemblies
- Publication number 20030132776
- Publication date Jul 17, 2003
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR IMPROVING STENCIL/SCREEN PRINT QUALITY
- Publication number 20030121473
- Publication date Jul 3, 2003
- TONGBI JIANG
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Automated method of attaching flip chip devices to a substrate
- Publication number 20030111154
- Publication date Jun 19, 2003
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing flip-chip semiconductor assembly
- Publication number 20030054587
- Publication date Mar 20, 2003
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Application
Automated method of attaching flip chip devices to a substrate
- Publication number 20020092595
- Publication date Jul 18, 2002
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of a reference fiducial on a semiconductor package to monitor a...
- Publication number 20020058396
- Publication date May 16, 2002
- Jay Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for in-line testing of flip-chip semiconductor assemblies
- Publication number 20020003434
- Publication date Jan 10, 2002
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for improving stencil/screen print quality
- Publication number 20010053415
- Publication date Dec 20, 2001
- Tongbi Jiang
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method for in-line testing of flip-chip semiconductor assemblies
- Publication number 20010043077
- Publication date Nov 22, 2001
- Chad A. Cobbley
- G01 - MEASURING TESTING
Information Patent Application
Method of depositing a thermoplastic polymer in semiconductor fabri...
- Publication number 20010012680
- Publication date Aug 9, 2001
- Micron Technology, Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS

John VanNortwick

Person

Patents Grantslast 30 patents

Devices and method for handling microelectronics assemblies

Apparatus for improving stencil/screen print quality

Method for in-line testing of flip-chip semiconductor assemblies

Method for packaging flip-chip semiconductor assemblies

Method for in-line testing of flip-chip semiconductor assemblies

Method for in-line testing of flip-chip semiconductor assemblies

Method for manufacturing flip-chip semiconductor assembly

Method for in-line testing of flip-chip semiconductor assemblies

Method for in-line testing of flip-chip semiconductor assemblies

Method for in-line testing of flip-chip semiconductor assemblies

Method for in-line testing of flip-chip semiconductor assemblies

Method for in-line testing of flip-chip semiconductor assemblies

Method for in-line testing of flip-chip semiconductor assemblies

Automated method of attaching flip-chip devices to a substrate

Automated method of attaching flip chip devices to a substrate

Process for manufacturing flip-chip semiconductor assembly

Use of a reference fiducial on a semiconductor package to monitor a...

Method and apparatus for improving stencil/screen print quality

Method and apparatus for improving stencil/screen print quality

Use of a reference fiducial on a semiconductor package to monitor a...

System for fabricating semiconductor components

Apparatus for improving stencil/screen print quality

Apparatus for improving stencil/screen print quality

Method for in-line testing of flip-chip semiconductor assemblies

Automated method of attaching flip chip devices to a substrate

Method for manufacturing improved stencil/screen

Method for in-line testing of flip-chip semiconductor assemblies

Method of depositing a thermoplastic polymer in semiconductor fabri...

Method for manufactoring and using stencil/screen

Method for in-line testing of flip-chip semiconductor assemblies

Patents Applicationslast 30 patents

DEVICES AND METHODS FOR HANDLING MICROELECTRONICS ASSEMBLIES

DEVICES AND METHOD FOR HANDLING MICROELECTRONICS ASSEMBLIES

DEVICES AND METHODS FOR HANDLING MICROELECTRONIC ASSEMBLIES

Apparatus for improving stencil/screen print quality

Method for in-line testing of flip-chip semiconductor assemblies

Method for in-line testing of flip-chip semiconductor assemblies

Method for in-line testing of flip-chip semiconductor assemblies

Method for in-line testing of flip-chip semiconductor assemblies

Method for in-line testing of flip-chip semiconductor assemblies

Method for in-line testing of flip-chip semiconductor assemblies

Stencil/screen print apparatus

Method for in-line testing of flip-chip semiconductor assemblies

Method for packaging flip-chip semiconductor assemblies

Apparatus for improving stencil/screen print quality

Method for manufacturing flip-chip semiconductor assembly

Method for in-line testing of flip-chip semiconductor assemblies

Method for in-line testing of flip-chip semiconductor assemblies

METHOD AND APPARATUS FOR IMPROVING STENCIL/SCREEN PRINT QUALITY

Automated method of attaching flip chip devices to a substrate

Method for manufacturing flip-chip semiconductor assembly

Automated method of attaching flip chip devices to a substrate

Use of a reference fiducial on a semiconductor package to monitor a...

Method for in-line testing of flip-chip semiconductor assemblies

Method and apparatus for improving stencil/screen print quality

Method for in-line testing of flip-chip semiconductor assemblies

Method of depositing a thermoplastic polymer in semiconductor fabri...