Michael W. Warner

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Collective and synergistic MRAM shields
- Patent number 8,269,319
- Issue date Sep 18, 2012
- Tessera, Inc.
- Kenneth Allen Honer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency chip packages
- Patent number 7,566,955
- Issue date Jul 28, 2009
- Tessera, Inc.
- Michael Warner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic elements with compliant terminal mountings and meth...
- Patent number 7,534,652
- Issue date May 19, 2009
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency chip packages
- Patent number 7,268,426
- Issue date Sep 11, 2007
- Tessera, Inc.
- Michael Warner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-face and edge interconnects for lidded package
- Patent number 7,224,056
- Issue date May 29, 2007
- Tessera, Inc.
- Robert Burtzlaff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High frequency chip packages with connecting elements
- Patent number 7,176,506
- Issue date Feb 13, 2007
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic assemblies
- Patent number 7,149,095
- Issue date Dec 12, 2006
- Tessera, Inc.
- Michael Warner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic assemblies having low profile connections
- Patent number 7,098,074
- Issue date Aug 29, 2006
- Tessera, Inc.
- Michael Warner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components, methods and assemblies for multi-chip packages
- Patent number 7,061,122
- Issue date Jun 13, 2006
- Tessera, Inc.
- Young-Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic assemblies incorporating inductors
- Patent number 7,012,323
- Issue date Mar 14, 2006
- Tessera, Inc.
- Michael Warner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making microelectronic packages
- Patent number 6,959,489
- Issue date Nov 1, 2005
- Tessera, Inc.
- Masud Beroz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked microelectronic assemblies and methods of making same
- Patent number 6,885,106
- Issue date Apr 26, 2005
- Tessera, Inc.
- Philip Damberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making microelectronic packages including electrically a...
- Patent number 6,873,039
- Issue date Mar 29, 2005
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency chip packages
- Patent number 6,856,007
- Issue date Feb 15, 2005
- Tessera, Inc.
- Michael Warner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection components with anisotropic conductive material intercon...
- Patent number 6,825,552
- Issue date Nov 30, 2004
- Tessera, Inc.
- David Light
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making microelectronic assemblies using compressed resil...
- Patent number 6,716,671
- Issue date Apr 6, 2004
- Tessera, Inc.
- Mike Warner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a semiconductor chip package
- Patent number 6,521,480
- Issue date Feb 18, 2003
- Tessera, Inc.
- Craig Mitchell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip assembly
- Patent number 6,169,328
- Issue date Jan 2, 2001
- Tessera, Inc.
- Craig Mitchell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic bond ribbon design
- Patent number 6,081,035
- Issue date Jun 27, 2000
- Tessera, Inc.
- Michael Warner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic head air bearing slider
- Patent number 4,475,135
- Issue date Oct 2, 1984
- International Business Machines
- Michael W. Warner
- G11 - INFORMATION STORAGE
Information Patent Grant
Suspension for flying magnetic head
- Patent number 4,286,297
- Issue date Aug 25, 1981
- International Business Machines Corporation
- Ronald R. Root
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR A TARGET MARKET BUSINESS STRUCTURE
- Publication number 20140074554
- Publication date Mar 13, 2014
- Michael W. Warner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Collective and synergistic MRAM shields
- Publication number 20080122047
- Publication date May 29, 2008
- Tessera, Inc.
- Kenneth Allen Honer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable electronic device assembly
- Publication number 20080105963
- Publication date May 8, 2008
- Tessera, Inc.
- William Walter Carlson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Components, methods and assemblies for multi-chip packages
- Publication number 20070166876
- Publication date Jul 19, 2007
- Tessera, Inc.
- Young-Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic elements with compliant terminal mountings and meth...
- Publication number 20070145550
- Publication date Jun 28, 2007
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable electronic device assembly and high G-force test fixture
- Publication number 20070138612
- Publication date Jun 21, 2007
- Tessera, Inc.
- Michael Warner
- G01 - MEASURING TESTING
Information Patent Application
High frequency chip packages with connecting elements
- Publication number 20070096160
- Publication date May 3, 2007
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Back-face and edge interconnects for lidded package
- Publication number 20070096295
- Publication date May 3, 2007
- Tessera, Inc.
- Robert Burtzlaff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microelectronic assemblies having low profile connections
- Publication number 20060275951
- Publication date Dec 7, 2006
- Tessera, Inc.
- Michael Warner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic assemblies incorporating inductors
- Publication number 20060113645
- Publication date Jun 1, 2006
- Tessera, Inc.
- Michael Warner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic assemblies and methods of making microelectronic as...
- Publication number 20060108698
- Publication date May 25, 2006
- Masud Beroz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-frequency noise suppression capacitor set
- Publication number 20050280134
- Publication date Dec 22, 2005
- Tessera, Inc.
- David Gibson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged acoustic and electromagnetic transducer chips
- Publication number 20050189622
- Publication date Sep 1, 2005
- Tessera, Inc.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packaged acoustic and electromagnetic transducer chips
- Publication number 20050189635
- Publication date Sep 1, 2005
- Tessera, Inc.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of making microelectronic packages including electrically an...
- Publication number 20050167814
- Publication date Aug 4, 2005
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Back-face and edge interconnects for lidded package
- Publication number 20050087861
- Publication date Apr 28, 2005
- Tessera, Inc.
- Robert Burtzlaff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Connection components with anistropic conductive material interconn...
- Publication number 20050064626
- Publication date Mar 24, 2005
- David Light
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-frequency chip packages
- Publication number 20050046001
- Publication date Mar 3, 2005
- Tessera, Inc.
- Michael Warner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Components, methods and assemblies for multi-chip packages
- Publication number 20040262777
- Publication date Dec 30, 2004
- Tessera, Inc.
- Young-Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-frequency chip packages
- Publication number 20040238934
- Publication date Dec 2, 2004
- Tessera, Inc.
- Michael Warner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
High frequency chip packages with connecting elements
- Publication number 20040238857
- Publication date Dec 2, 2004
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic assemblies having low profile connections
- Publication number 20040219716
- Publication date Nov 4, 2004
- Tessera, Inc.
- Michael Warner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of making microelectronic packages including electrically a...
- Publication number 20040157362
- Publication date Aug 12, 2004
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic assemblies incorporating inductors
- Publication number 20040032011
- Publication date Feb 19, 2004
- Tessera, Inc.
- Michael Warner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of making microelectronic assemblies including folded subst...
- Publication number 20030168725
- Publication date Sep 11, 2003
- Tessera, Inc.
- Michael Warner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection components with anisotropic conductive material intercon...
- Publication number 20030068906
- Publication date Apr 10, 2003
- David Light
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-frequency chip packages
- Publication number 20030062541
- Publication date Apr 3, 2003
- Michael Warner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-height multi-component assemblies
- Publication number 20030048624
- Publication date Mar 13, 2003
- Tessera, Inc.
- Philip Damberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wave strip injection form
- Publication number 20020105792
- Publication date Aug 8, 2002
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of making microelectronic assemblies using compressed resil...
- Publication number 20010049158
- Publication date Dec 6, 2001
- Mike Warner
- H01 - BASIC ELECTRIC ELEMENTS

Michael W. Warner

Person

Patents Grantslast 30 patents

Collective and synergistic MRAM shields

High-frequency chip packages

Microelectronic elements with compliant terminal mountings and meth...

High-frequency chip packages

Back-face and edge interconnects for lidded package

High frequency chip packages with connecting elements

Stacked microelectronic assemblies

Microelectronic assemblies having low profile connections

Components, methods and assemblies for multi-chip packages

Microelectronic assemblies incorporating inductors

Methods of making microelectronic packages

Stacked microelectronic assemblies and methods of making same

Methods of making microelectronic packages including electrically a...

High-frequency chip packages

Connection components with anisotropic conductive material intercon...

Methods of making microelectronic assemblies using compressed resil...

Method for making a semiconductor chip package

Semiconductor chip assembly

Microelectronic bond ribbon design

Magnetic head air bearing slider

Suspension for flying magnetic head

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR A TARGET MARKET BUSINESS STRUCTURE

Collective and synergistic MRAM shields

Stackable electronic device assembly

Components, methods and assemblies for multi-chip packages

Microelectronic elements with compliant terminal mountings and meth...

Stackable electronic device assembly and high G-force test fixture

High frequency chip packages with connecting elements

Back-face and edge interconnects for lidded package

Microelectronic assemblies having low profile connections

Microelectronic assemblies incorporating inductors

Microelectronic assemblies and methods of making microelectronic as...

Multi-frequency noise suppression capacitor set

Packaged acoustic and electromagnetic transducer chips

Packaged acoustic and electromagnetic transducer chips

Method of making microelectronic packages including electrically an...

Back-face and edge interconnects for lidded package

Connection components with anistropic conductive material interconn...

High-frequency chip packages

Components, methods and assemblies for multi-chip packages

High-frequency chip packages

High frequency chip packages with connecting elements

Microelectronic assemblies having low profile connections

Methods of making microelectronic packages including electrically a...

Microelectronic assemblies incorporating inductors

Methods of making microelectronic assemblies including folded subst...

Connection components with anisotropic conductive material intercon...

High-frequency chip packages

Low-height multi-component assemblies

Wave strip injection form

Methods of making microelectronic assemblies using compressed resil...