Paul M. Goodwin

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Camera case with removable carrier, filter receiver, external batte...
- Patent number 10,101,637
- Issue date Oct 16, 2018
- AVANT TECHNOLOGY, INC.
- Tim Peddecord
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Expansion module for a camera
- Patent number D794697
- Issue date Aug 15, 2017
- AVANT TECHNOLOGY, INC.
- Paul M. Goodwin
- D16 - Photography and optical equipment
Information Patent Grant
Camera housing
- Patent number D785069
- Issue date Apr 25, 2017
- AVANT TECHNOLOGY, INC.
- Justin M. Goodwin
- D16 - Photography and optical equipment
Information Patent Grant
Plug standards-compliant circuit modules and connectors
- Patent number 9,402,308
- Issue date Jul 26, 2016
- AVANT TECHNOLOGY, INC.
- Paul Goodwin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plug standards-compliant circuit modules and connectors
- Patent number 9,301,415
- Issue date Mar 29, 2016
- AVANT TECHNOLOGY, INC.
- Paul Goodwin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SATA and SAS plug connector
- Patent number 8,951,070
- Issue date Feb 10, 2015
- Paul Goodwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die module system
- Patent number 7,768,796
- Issue date Aug 3, 2010
- Entorian Technologies LP
- James W. Cady
- G11 - INFORMATION STORAGE
Information Patent Grant
Modified core for circuit module system and method
- Patent number 7,760,513
- Issue date Jul 20, 2010
- Entorian Technologies LP
- Julian Partridge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit module with thermal casing systems
- Patent number 7,737,549
- Issue date Jun 15, 2010
- Entorian Technologies LP
- James Douglas Wehrly, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink for a high capacity thin module system
- Patent number 7,626,259
- Issue date Dec 1, 2009
- Entorian Technologies, LP
- James Douglas Wehrly, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex circuit constructions for high capacity circuit module systems...
- Patent number 7,616,452
- Issue date Nov 10, 2009
- Entorian Technologies, LP
- James Douglas Wehrly, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory module system and method
- Patent number 7,606,040
- Issue date Oct 20, 2009
- Entorian Technologies, LP
- Paul Goodwin
- G11 - INFORMATION STORAGE
Information Patent Grant
High capacity thin module system and method
- Patent number 7,606,042
- Issue date Oct 20, 2009
- Entorian Technologies, LP
- Paul Goodwin
- G11 - INFORMATION STORAGE
Information Patent Grant
Module thermal management system and method
- Patent number 7,606,049
- Issue date Oct 20, 2009
- Entorian Technologies, LP
- Paul Goodwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Compact module system and method
- Patent number 7,606,050
- Issue date Oct 20, 2009
- Entorian Technologies, LP
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin module system and method
- Patent number 7,602,613
- Issue date Oct 13, 2009
- Entorian Technologies, LP
- Paul Goodwin
- G11 - INFORMATION STORAGE
Information Patent Grant
Circuit module turbulence enhancement systems and methods
- Patent number 7,579,687
- Issue date Aug 25, 2009
- Entorian Technologies, LP
- Leland Szewerenko
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optimized mounting area circuit module system and method
- Patent number 7,542,297
- Issue date Jun 2, 2009
- Entorian Technologies, LP
- James Douglas Wehrly, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High capacity thin module system and method
- Patent number 7,522,425
- Issue date Apr 21, 2009
- Entorian Technologies, LP
- Paul Goodwin
- G11 - INFORMATION STORAGE
Information Patent Grant
Buffered thin module system and method
- Patent number 7,511,968
- Issue date Mar 31, 2009
- Entorian Technologies, LP
- Paul Goodwin
- G11 - INFORMATION STORAGE
Information Patent Grant
Buffered memory device
- Patent number 7,508,723
- Issue date Mar 24, 2009
- Entorian Technologies, LP
- Paul Goodwin
- G11 - INFORMATION STORAGE
Information Patent Grant
Thin module system and method
- Patent number 7,480,152
- Issue date Jan 20, 2009
- Entorian Technologies, LP
- Paul Goodwin
- G11 - INFORMATION STORAGE
Information Patent Grant
Thin module system and method
- Patent number 7,468,893
- Issue date Dec 23, 2008
- Entorian Technologies, LP
- Paul Goodwin
- G11 - INFORMATION STORAGE
Information Patent Grant
Stackable micropackages and stacked modules
- Patent number 7,468,553
- Issue date Dec 23, 2008
- Entorian Technologies, LP
- Leland Szewerenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacity thin module system
- Patent number 7,459,784
- Issue date Dec 2, 2008
- Entorian Technologies, LP
- James Douglas Wehrly, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit module with thermal casing systems
- Patent number 7,446,410
- Issue date Nov 4, 2008
- Entorian Technologies, LP
- James Douglas Wehrly, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High capacity thin module system
- Patent number 7,443,023
- Issue date Oct 28, 2008
- Entorian Technologies, LP
- James Douglas Wehrly, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die module system
- Patent number 7,423,885
- Issue date Sep 9, 2008
- Entorian Technologies, LP
- James W. Cady
- G11 - INFORMATION STORAGE
Information Patent Grant
High capacity thin module system and method
- Patent number 7,324,352
- Issue date Jan 29, 2008
- Staktek Group L.P.
- Paul Goodwin
- G11 - INFORMATION STORAGE
Information Patent Grant
Inverted CSP stacking system and method
- Patent number 7,309,914
- Issue date Dec 18, 2007
- Staktek Group L.P.
- Paul Goodwin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method and Apparatus for a Cloud Connected IOT Wine Storage system
- Publication number 20240242173
- Publication date Jul 18, 2024
- Paul Goodwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Camera Case with Removable Carrier, Filter Receiver, External Batte...
- Publication number 20170078537
- Publication date Mar 16, 2017
- Avant Technology, Inc.
- Tim Peddecord
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Plug Standards-Compliant Circuit Modules and Connectors
- Publication number 20150163944
- Publication date Jun 11, 2015
- Avant Technology, Inc.
- Paul Goodwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Plug Standards-Compliant Circuit Modules and Connectors
- Publication number 20150144383
- Publication date May 28, 2015
- Avant Technology, Inc.
- Paul Goodwin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RAID Enhanced solid state drive
- Publication number 20100049914
- Publication date Feb 25, 2010
- Paul M. Goodwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Circuit Module Turbulence Enhancement
- Publication number 20090309214
- Publication date Dec 17, 2009
- Entorian Technologies, LP
- Leland Szewerenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Zero-reflow TSOP stacking
- Publication number 20090267205
- Publication date Oct 29, 2009
- Avant Technology LP
- Paul M. Goodwin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuit Module with Thermal Casing Systems
- Publication number 20090052124
- Publication date Feb 26, 2009
- Entorian Technologies, L.P. (formerly Staktek Group, L.P)
- James Douglas Wehrly, JR.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Capacity Thin Module System
- Publication number 20090046431
- Publication date Feb 19, 2009
- Staktek Group. L.P.
- James Douglas Wehrly, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Buffered Memory Device
- Publication number 20080291747
- Publication date Nov 27, 2008
- Staktek Group L.P.
- Paul Goodwin
- G11 - INFORMATION STORAGE
Information Patent Application
DIE MODULE SYSTEM
- Publication number 20080278924
- Publication date Nov 13, 2008
- Entorian Technologies, L.P. (formerly Staktek Group L.P.)
- James W. Cady
- G11 - INFORMATION STORAGE
Information Patent Application
Memory module system and method
- Publication number 20080278901
- Publication date Nov 13, 2008
- Staktek Group, L.P.
- Paul Goodwin
- G11 - INFORMATION STORAGE
Information Patent Application
High Capacity Thin Module System and Method
- Publication number 20080094803
- Publication date Apr 24, 2008
- Staktek Group. L.P.
- James Douglas Wehrly
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stackable Micropackages and Stacked Modules
- Publication number 20080093724
- Publication date Apr 24, 2008
- Staktek Group L.P.
- Leland Szewerenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inverted CSP Stacking System and Method
- Publication number 20080079132
- Publication date Apr 3, 2008
- Staktek Group L.P.
- Paul Goodwin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Capacity Thin Module System and Method
- Publication number 20080030972
- Publication date Feb 7, 2008
- Staktek Group L.P.
- Paul Goodwin
- G11 - INFORMATION STORAGE
Information Patent Application
High Capacity Thin Module System and Method
- Publication number 20080030966
- Publication date Feb 7, 2008
- Staktek Group L.P.
- Paul Goodwin
- G11 - INFORMATION STORAGE
Information Patent Application
Perimeter stacking system and method
- Publication number 20070262429
- Publication date Nov 15, 2007
- Staktek Group, L.P.
- Paul Goodwin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Active cooling methods and apparatus for modules
- Publication number 20070201208
- Publication date Aug 30, 2007
- Staktek Group. L.P.
- Paul Goodwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Memory Module System and Method
- Publication number 20070126125
- Publication date Jun 7, 2007
- Staktek Group L.P.
- Russell Rapport
- G11 - INFORMATION STORAGE
Information Patent Application
Memory Module System and Method
- Publication number 20070126124
- Publication date Jun 7, 2007
- Staktek Group L.P.
- Russell Rapport
- G11 - INFORMATION STORAGE
Information Patent Application
Thin Module System and Method
- Publication number 20070115017
- Publication date May 24, 2007
- Staktek Group L.P.
- Paul Goodwin
- G11 - INFORMATION STORAGE
Information Patent Application
Buffered Thin Module System and Method
- Publication number 20070111606
- Publication date May 17, 2007
- Staktek Group L.P., a Texas Limited Partnership
- Paul Goodwin
- G11 - INFORMATION STORAGE
Information Patent Application
Applied heat spreader with cooling fin
- Publication number 20070070607
- Publication date Mar 29, 2007
- Staktek Group, L.P.
- Paul Goodwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory module system and method
- Publication number 20060261449
- Publication date Nov 23, 2006
- Staktek Group. L.P.
- Russell Rapport
- G11 - INFORMATION STORAGE
Information Patent Application
System component interposer
- Publication number 20060250780
- Publication date Nov 9, 2006
- Staktek Group. L.P.
- Paul Goodwin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Systems, methods, and apparatus for connecting a set of contacts on...
- Publication number 20060244114
- Publication date Nov 2, 2006
- Staktek Group. L.P.
- Paul Goodwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory module system and method
- Publication number 20060203442
- Publication date Sep 14, 2006
- Staktek Group, L.P.
- Paul Goodwin
- G11 - INFORMATION STORAGE
Information Patent Application
Modified core for circuit module system and method
- Publication number 20060198238
- Publication date Sep 7, 2006
- Staktek Group. L.P.
- Julian Partridge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Systems, methods, and apparatus for generating ball-out matrix conf...
- Publication number 20060175693
- Publication date Aug 10, 2006
- Staktek Group, L.P.
- James W. Cady
- H01 - BASIC ELECTRIC ELEMENTS

Paul M. Goodwin

Person

Patents Grantslast 30 patents

Camera case with removable carrier, filter receiver, external batte...

Expansion module for a camera

Camera housing

Plug standards-compliant circuit modules and connectors

Plug standards-compliant circuit modules and connectors

SATA and SAS plug connector

Die module system

Modified core for circuit module system and method

Circuit module with thermal casing systems

Heat sink for a high capacity thin module system

Flex circuit constructions for high capacity circuit module systems...

Memory module system and method

High capacity thin module system and method

Module thermal management system and method

Compact module system and method

Thin module system and method

Circuit module turbulence enhancement systems and methods

Optimized mounting area circuit module system and method

High capacity thin module system and method

Buffered thin module system and method

Buffered memory device

Thin module system and method

Thin module system and method

Stackable micropackages and stacked modules

High capacity thin module system

Circuit module with thermal casing systems

High capacity thin module system

Die module system

High capacity thin module system and method

Inverted CSP stacking system and method

Patents Applicationslast 30 patents

Method and Apparatus for a Cloud Connected IOT Wine Storage system

Camera Case with Removable Carrier, Filter Receiver, External Batte...

Plug Standards-Compliant Circuit Modules and Connectors

Plug Standards-Compliant Circuit Modules and Connectors

RAID Enhanced solid state drive

Circuit Module Turbulence Enhancement

Zero-reflow TSOP stacking

Circuit Module with Thermal Casing Systems

High Capacity Thin Module System

Buffered Memory Device

DIE MODULE SYSTEM

Memory module system and method

High Capacity Thin Module System and Method

Stackable Micropackages and Stacked Modules

Inverted CSP Stacking System and Method

High Capacity Thin Module System and Method

High Capacity Thin Module System and Method

Perimeter stacking system and method

Active cooling methods and apparatus for modules

Memory Module System and Method

Memory Module System and Method

Thin Module System and Method

Buffered Thin Module System and Method

Applied heat spreader with cooling fin

Memory module system and method

System component interposer

Systems, methods, and apparatus for connecting a set of contacts on...

Memory module system and method

Modified core for circuit module system and method

Systems, methods, and apparatus for generating ball-out matrix conf...